487 Sentences With "interconnects" | Random Sentence Generator

Still, it is incredible how much of all this interconnects circumstantially.

In September, Google launched the beta of its dedicated interconnects for Google Cloud enterprise users.

Today, the dedicated interconnects are coming out of beta and are getting a few new features.

Google offers enterprises a 99.9 percent SLA, as long as they run two interconnects for redundancy purposes.

Mellanox specifically focuses on interconnects and networking components that transfer data between cloud compute and storage resources.

The company has developed silicon optical interconnects to replace legacy products that are bulkier and consume more energy.

The U.S. grid also interconnects with Canada's grid, Sistrunk said, creating an even more complex oversight task across borders.

The export ban prohibits American firms from selling them chips and "interconnects" that allow chips to talk to each other.

They prefer analog interconnects that capitalize on their specialized amplifiers and DACs, so they have little interest in adding another, digital interconnect.

"No matter who you are or where you come from, the struggle is maybe a little bit different, but all interconnects," she added.

For businesses that have a physical presence close to L.A., Google also offers two dedicated interconnects to Equinix's and CoreSite's local LA1 data centers.

The original plan was to use powerful magnets to hold the modules in place and wireless, capacitive interconnects to get them communicating with the frame.

Most of these were software companies, but with Acacia Communications, it also recently announced its intention to acquire another fabless semiconductor company that builds optical interconnects.

Danny's abilities also seem to link him to King's sprawling multiverse, which interconnects many of King's novels by joining his vast different worlds and timelines across spacetime.

The team also ensured the interconnects—the wires connecting all of the pieces of the chip—wouldn't fry by using exotic materials like tantalum silicide, among other challenges.

What they found in these traumatic-brain-injury cases was totally different: a dustlike scarring, often at the border between gray matter (where synapses reside) and the white matter that interconnects it.

This includes CPU architectures from the Arm Cortex A, R and M families, in addition to select GPUs, interconnects, security IP, system controllers and more — essentially everything you need to build your own system.

These new dedicated interconnects, which are now in beta, allow businesses to set up a highly available, high-bandwidth network connection to the Google Cloud Platform for their data intensive or latency-sensitive services.

To make a little more sense of how all this interconnects, I reached out to Narelle Bailey, an anime localization editor based out of Melbourne, Australia, who's been a fan of Eva since its original release.

The Panda is a $99 universal car interface that plugs into a vehicle's OBD-II port and gives users access to the internal communications networks (known as a vehicle bus) that interconnects components in a vehicle.

Slack, the wildly popular workplace chat platform that interconnects users with each other and just about every enterprise and business app, is notable for producing "a gazillion notifications", in Rosenstein's words, leading to distraction from actually getting things done.

PowerAI is IBM's machine learning framework for companies that use servers based on its Power processors and NVIDIA's NVLink high-speed interconnects that allow for data to pass extremely quickly between the processor and the GPU that does most of the deep learning calculations.

Kyle Spencer, executive director of Uganda Internet Exchange Point (UIXP), a non-profit organisation that interconnects network operators, told Reuters that other rules outlined in the new policy would establish a government infrastructure monopoly, a retrogressive move that would cut jobs and hamper the sector's development.

The results so far let Intel boast of a chip that, thanks to the company's manufacturing prowess and the work by QuTech, has considerably improved in reliability and performance over the last two years, while the architecture, system infrastructure (such as interconnects and testing methods) and so on have evolved alongside.

Europol's "Internet Organised Crime Threat Assessment" for 2016 identified eight cybercrime trends that everyone should beware of: 1: Crime-as-a-Service The digital underground is underpinned by a growing Crime-as-a-Service model that interconnects specialist providers of cybercrime tools and services with an increasing number of organized crime groups.

In integrated circuits, optical interconnects refers to any system of transmitting signals from one part of an integrated circuit to another using light. Optical interconnects have been the topic of study due to the high latency and power consumption incurred by conventional metal interconnects in transmitting electrical signals over long distances, such as in interconnects classed as global interconnects. The International Technology Roadmap for Semiconductors (ITRS) has highlighted interconnect scaling as a problem for the semiconductor industry. In electrical interconnects, nonlinear signals (e.g.

In semiconductor technology, aluminum interconnects (Al interconnects) are interconnects made of aluminum or aluminum-based alloys. Since the invention of monolithic integrated circuit (IC) by Robert Noyce at Fairchild Semiconductor in 1959, Al interconnects were widely used in silicon (Si) ICs until its replacement by copper interconnects during the late 1990s and early 2000s in advanced process technologies. Al was an ideal material for interconnects due to its ease of deposition and good adherence to silicon and silicon dioxide. Initially, pure aluminum was used, but due to junction spiking, Si was added to form an alloy.

Computer networks are used to have two-way communication by having computers exchange data. Ways that this is possible is wired interconnects and wireless interconnects. Types of wired interconnects are Ethernets and fiber optic cables. Ethernets connect local devices through Ethernet cables.

Hot Interconnects is an IEEE sponsored international symposium on High Performance Interconnects held every year starting 1993. The symposium intends to bring together the architects and designers of high performance interconnects, software and systems together on platform to discuss the latest trends in the area.

Type 735 26 AWG is used for interconnects up to 225 feet, and Type 734 20 AWG is used for interconnects up to 450 feet.

In 2001, as single end signalled aluminium interconnects reached the technology scaling limits, Young and co-workers quantified the migration to repeated electrical interconnects for mainstream microprocessors.

Two proposed approaches to overcome the to date limitations are either to make very tiny local connections that will be needed in future advanced chips or to make carbon metal composite structure that will be compatible with existing microelectronic processes. Hybrid interconnects that employ CNT vias in tandem with copper interconnects may offer advantages in reliability and thermal- management. In 2016, the European Union has funded a four million euro project over three years to evaluate manufacturability and performance of composite interconnects employing both CNT and copper interconnects. The project named CONNECT (CarbON Nanotube compositE InterconneCTs) involves the joint efforts of seven European research and industry partners on fabrication techniques and processes to enable reliable Carbon NanoTubes for on-chip interconnects in ULSI microchip production.

In integrated circuits (ICs), interconnects are structures that connect two or more circuit elements (such as transistors) together electrically. The design and layout of interconnects on an IC is vital to its proper function, performance, power efficiency, reliability, and fabrication yield. The material interconnects are made from depends on many factors. Chemical and mechanical compatibility with the semiconductor substrate, and the dielectric in between the levels of interconnect is necessary, otherwise barrier layers are needed.

In 2017-2018, IBM and Nvidia delivered the Summit and Sierra supercomputers for the US Department of Energy which combine IBM's POWER9 family of CPUs and Nvidia's Volta architecture, using NVLink 2.0 for the CPU-GPU and GPU-GPU interconnects and InfiniBand EDR for the system interconnects.

In nanotechnology, carbon nanotube interconnects refer to the proposed use of carbon nanotubes in the interconnects between the elements of an integrated circuit. Carbon nanotubes (CNTs) can be thought of as single atomic layer graphite sheets rolled up to form seamless cylinders. Depending on the direction on which they are rolled, CNTs can be semiconducting or metallic. Metallic carbon nanotubes have been identified as a possible interconnect material for the future technology generations and to replace copper interconnects.

Currently interconnects are only hundreds to tens of nanometers in width, making research in electromigration increasingly important.

Darvin Edwards, Electronic Design. "Package Interconnects Can Make Or Break Performance." 14 September 2012. Retrieved 6 June 2016.

The interconnection network is the heart of a parallel processing system, and many systems have failed to meet their design goals for the design of their essential components. The bandwidth limitation of the electronic interconnects prompted the need for exploring alternatives that overcome this limitation. Optics is considered as an alternative that is capable of providing inherentcommunication, parallelism, high connectivity and large bandwidth. When the communication distances exceed few millimeters, optical interconnects provide advantage over the electronic interconnects in term of power, speed and crosstalk property.

Local interconnects connect circuit elements that are very close together, such as transistors separated by ten or so other contiguously laid out transistors. Global interconnects can transmit further, such as over large-area sub-circuits. Consequently, local interconnects may be formed from materials with relatively high electrical resistivity such as polycrystalline silicon (sometimes silicided to extend its range) or tungsten. To extend the distance an interconnect may reach, various circuits such as buffers or restorers may be inserted at various points along a long interconnect.

Compaq, "21264/EV68A Microprocessor Hardware Reference Manual". The EV68C was fabricated in a 0.18 μm CMOS process with copper interconnects.

Fiber runs underground for long distances and is the main source of Internet in most homes and businesses. Types of wireless interconnects include Wi-Fi and Bluetooth. The problem with these networks is that they don't have unlimited connection span. To expand the reach there are wide area interconnects such as satellite and cellular networks.

MySQL Cluster is designed to have no single point of failure. Provided that the cluster is set up correctly, any single node, system, or piece of hardware can fail without the entire cluster failing. Shared disk (SAN) is not required. The interconnects between nodes can be standard Ethernet, Gigabit Ethernet, InfiniBand, or SCI interconnects.

The Cisco fabric interconnects (FI) provide network connectivity for the chassis, blade servers and rack servers connected to it through different speeds of Ethernet and Fiber Channel over Ethernet (FCoE). The fabric interconnects are derived from the Nexus 5500 and 9300 series switch families and run NX-OS as well as UCS Manager software. FCoE allows connection to storage area network storage, To allow stateless compute in addition to local storage capacity. Cisco has produced the following series for fabric interconnects: 6100 Series (discontinued), 6200 Series, 6300 Series, and 6400 Series.

Suitability for fabrication is also required; some chemistries and processes prevent integration of materials and unit processes into a larger technology (recipe) for IC fabrication. In fabrication, interconnects are formed during the back-end-of-line after the fabrication of the transistors on the substrate. Interconnects are classified as local or global interconnects depending on the signal propagation distance it is able to support. The width and thickness of the interconnect, as well as the material from which it is made, are some of the significant factors that determine the distance a signal may propagate.

Seck-Hoe Wong et al. (2006) "Packaging Of Power LEDs Using Thermosonic Bonding Of Au-Au Interconnects", Surface Mount Technology Association International Conference.

ED-16 (No. 4), pp. 338-347, April 1969. At the time, the metal interconnects in ICs were still about 10 micrometres wide.

Transport of data is a major factor, influencing design on the largest scales to the smallest of DOME. The cost of communicating electrically on copper wires will drive the application of low-power photonic interconnects, from connections between collecting antennas and datacenters to connecting devices inside the computers. Both IBM and ASTRON have advanced research programs into nano photonics, beamforming and optical links and they will combine their efforts for the new designs.ASTRON & IBM Center for Exascale Technology – Nano Photonics This research project is divided into four R&D; sections, investigating digital optical interconnects, analog optical interconnects and analog optical signal processing.

In early integrated circuits the impact of the wiring was negligible, and wires were not considered as electrical elements of the circuit. However below the 0.5-micrometre technology node resistance and capacitance of the interconnects started making a significant impact on circuit performance."Automatic Layout Modification", by Michael Reinhardt, p. 120 With shrinking process technologies inductance effects of interconnects became important as well.

A/V interconnects from the theater to the ballrooms enable overflow audiences or meeting groups to use both areas of the Rose Center seamlessly.

Also, there are long-distance interconnects which need backhaul to move the data back and forth and last mile to connect the provider to the network.

Holds and operates the Texas Pacifico railroad in the United States that interconnects the border point Ojinaga, Chihuahua-Presidio, Texas with the city of Fort Worth, Texas.

He was named Fellow of the Institute of Electrical and Electronics Engineers (IEEE) in 2012 "for contributions to interconnects and passive components in integrated circuits and systems".

The advent of QSFP (Quad SFP) interconnects for 40 Gigabit Ethernet and InfiniBand is driving the widespread adoption of active cables in this form-factor as well.

Multiple measured insertion loss on QP interconnects have been conducted on quilted chipsets with sets of homogeneous and heterogeneous semiconductor materials. Radio frequency S-parameter measurements were made from DC to 220 GHz. QP interconnects have demonstrated less than 0.1 dB insertion loss from DC to 100 GHz between silicon and silicon chips, and less than 0.8 dB insertion loss up to 220 GHz between Silicon and Gallium Arsenide.

OpenVPX is a fully ratified open standard in the VITA (VMEbus International Trade Association) organization. ANSI/VITA 65-2017 is the OpenVPX System Standard with several related specifications for ruggedized mechanical implementation, RF signal interconnects, optical interconnects, and more. There is a wide ecosystem of board and system/chassis vendors including Pixus Technologies, Elma Electronic, GE Intelligent Platforms, Concurrent Technologies, CoreEL Technologies Kontron, Mercury Systems, and many others.

In all types of 3D Packaging, chips in the package communicate using off-chip signaling, much as if they were mounted in separate packages on a normal circuit board. 3D ICs can be divided into 3D Stacked ICs (3D SIC), which refers to stacking IC chips using TSV interconnects, and monolithic 3D ICs, which use fab processes to realize 3D interconnects at the local levels of the on-chip wiring hierarchy as set forth by the ITRS, this results in direct vertical interconnects between device layers. The first examples of a monolithic approach are seen in Samsung's 3D V-NAND devices. As of the 2010s, 3D IC packages are widely used for NAND flash memory in mobile devices.

Local interconnects that are on the lower levels of the interconnect stack connecting nearby logic gates are aggressively scaled down at each generation to follow the miniaturization of transistors and thus are mostly susceptible to performance degradation. On the local level where interconnects are most densely packed, and have pitch sizes close to the minimum feature size, we will need new interconnect materials that suffer much less from sizing effects than copper. Thanks to the measured properties of individual carbon nanotubes (CNTs), such material has been proposed as future material for interconnects. Particularly their current carrying capabilities are extremely high typically around 109 Acm−2 and they exhibit a ballistic length up to micrometers.

The geometric properties of an interconnect are width, thickness, spacing (the distance between an interconnect and another on the same level), pitch (the sum of the width and spacing), and aspect ratio, or AR, (the thickness divided by width). The width, spacing, AR, and ultimately, pitch, are constrained in their minimum and maximum values by design rules that ensure the interconnect (and thus the IC) can be fabricated by the selected technology with a reasonable yield. Width is constrained to ensure minimum width interconnects do not suffer breaks, and maximum width interconnects can be planarized by chemical mechanical polishing (CMP). Spacing is constrained to ensure adjacent interconnects can be fabricated without any conductive material bridging.

In 2004 also Leoben and the new Point of Presence in Eisenstadt went over to Gigabit Ethernet. In 2005 the interconnects in Vienna were upgraded to 10 Gbit/s.

Interconnects up to four T640 chassis into a single routing entity. It has 32 slots and a sustainable throughput rate of 2.5 Tbit/s (up to 3 billion pps).

High speed interconnects like UniPro, USB or PCI Express typically cost more than low speed interconnects (e.g. I2C, SPI or simple CMOS interfaces). This is for example because of the silicon area occupied by the required mixed-signal circuitry (Layer 1), as well as due to the complexity and buffer space required to automatically correct bit errors. UniPro's cost and complexity may thus be an issue for certain low bandwidth UniPro devices.

QP interconnects have a achieved 12 gigabit/sec (Gbps) bit-rate throughput with no distortion with 10 µm nodules on a 10 µm pitch on the edge of the chip.

In gallium arsenide (GaAs) ICs, which have been mainly used in application domains (e.g. monolithic microwave ICs) different to those of silicon, the predominant material used for interconnects is gold.

The high density of interconnects at the lower levels, along with the minimal spacing, helps support the upper layers. Intel introduced air gap dielectric in its 14nm technology in 2014.

France-IX is a Paris-based Internet exchange point (IXP) founded in June 2010 as a membership organisation. it interconnects more than 278 members, making it the largest IXP in France.

However, downscaling of the minimum feature size also results in tighter packing of the wires on a microprocessor, which increases parasitic capacitance and signal propagation delay. Consequently, the delay due to the communication between the parts of a chip becomes comparable to the computation delay itself. This phenomenon, known as an “interconnect bottleneck”, is becoming a major problem in high-performance computer systems. This interconnect bottleneck can be solved by utilizing optical interconnects to replace the long metallic interconnects.

The R12000A is a derivative of the R12000 developed by SGI. Introduced in July 2000, it operates at 400 MHz and was fabricated by NEC a 0.18 µm process with aluminum interconnects.

The copper post stand-off developed for the CSP market has found a home in high-density interconnects for advanced micro-processors and is used today by IBM for its CPU packaging.

Luis Miguel Silveira from the Technical University of Lisbon was named Fellow of the Institute of Electrical and Electronics Engineers (IEEE) in 2012 for contributions to analysis and modeling of VLSI interconnects.

The FDFD method has been used to provide full wave simulation for modeling interconnects for various applications in electronic packaging. FDFD has also been used for various scattering problems at optical frequencies.

The IBIS Interconnect Modeling Specification (ICM) is a behavioral, ASCII- based file format for distributing passive interconnect modeling information. The format and style of ICM are highly similar to the Input Output Buffer Information Specification (IBIS), and both specifications are managed by the same organization, the IBIS Open Forum. Interconnects under ICM may be represented through tabular frequency-dependent RLGC matrices or through S-parameters in separate Touchstone files. ICM models define interconnects as consisting of one or more segments.

Morgan, Timothy Prickett (7 November 2011). "Fujitsu readies 23 petaflops Sparc FX10 super beast". The Register. It consisted of 1 billion transistors and was implemented in a 40 nm CMOS process with copper interconnects.

Kaustav Banerjee from the University of California, Santa Barbara was named Fellow of the Institute of Electrical and Electronics Engineers (IEEE) in 2012 for contributions to modeling and design of nanoscale integrated circuit interconnects.

Weiss received her PhD from the Institute of Optics at the University of Rochester, where her dissertation, "Tunable Porous Silicon Photonic Bandgap Structures: Mirrors for Optical Interconnects and Optical Switching," was supervised by Philippe Fauchet.

Donald Stanley Gardner, from Intel Corporation, Santa Clara, California, was named a Fellow of the Institute of Electrical and Electronics Engineers (IEEE) in 2012 for his contributions to integrated circuit interconnects and integrated inductor technology.

The AR is an important factor. In technologies that form interconnect structures with conventional processes, the AR is limited to ensure that the etch creating the interconnect, and the dielectric deposition that fills the voids in between interconnects with dielectric, can be done successful. In those that form interconnect structures with damascene processes, the AR must permit successful etch of the trenches, deposition of the barrier metal (if needed) and interconnect material. Interconnect layout are further restrained by design rules that apply to collections of interconnects.

Because higher-density parts have little exposed oxide between the layers of interconnects and gate, ultraviolet erasing becomes less practical for very large memories. Even dust inside the package can prevent some cells from being erased.

Like Socket G34, it also uses the AMD SR5690, SR5670, and SR5650 chipsets. Socket C32 is also being used in the ultra-low-power Adelaide platform with the SR5650 chipset and HT1 interconnects instead of HT3.1.

Silicon waveguides are also of great academic interest, due to their unique guiding properties, they can be used for communications, interconnects, biosensors, and they offer the possibility to support exotic nonlinear optical phenomena such as soliton propagation.

Wiren Dale Becker, who works for IBM, was named a Fellow of the Institute of Electrical and Electronics Engineers (IEEE) in 2015 for contributions to power distribution and signal integrity in high-speed interconnects for computing systems.

While smaller dimensions mean better performance for transistors thanks to the decrease of intrinsic transistor gate delay, the situation is quite the opposite for interconnects. Smaller cross-section areas of interconnect would only lead to performance degradation such as increased interconnect resistance and power consumption. Since the 1990s the circuit performance is no longer limited by the transistors, thus interconnects have become a key issue and are as important as the transistors in determining chip performance. As technology scaling continues, the problem of interconnect performance degradation will only become more significant.

More recently, a renewed interest for this material was generated by the work of Hata group claiming a 100 fold increase in current carrying capacity of aligned CNT-copper material compared to pure copper. Several groups are now working worldwide on the integration of aligned CNT-copper composite materials in interconnect structures, Present and near-future efforts are focusing on demonstrating and evaluating the performances of aligned CNT-copper composite materials for both vertical and horizontal interconnects, and to develop a CMOS-compatible process flow for multilevel global interconnects.

Sebastian Anthony (Dec 10,2012), "IBM creates first commercially viable silicon nanophotonic chip", accessdate=2012-12-10 One benefit of optical interconnects is that motherboards which formerly required a certain kind of system on a chip (SoC) can now move formerly dedicated memory and network controllers off the motherboards, spreading the controllers out onto the rack. This allows standardization of backplane interconnects and motherboards for multiple types of SoCs, which allows more timely upgrades of CPUs.Open Compute: Does the data center have an open future? accessdate=2013-08-11 Another field of research is spintronics.

The material properties of the metal interconnects have a strong influence on the life span. The characteristics are predominantly the composition of the metal alloy and the dimensions of the conductor. The shape of the conductor, the crystallographic orientation of the grains in the metal, procedures for the layer deposition, heat treatment or annealing, characteristics of the passivation and the interface to other materials also affect the durability of the interconnects. There are also grave differences with time dependent current: direct current or different alternating current waveforms cause different effects.

2008: All bases upgraded with the latest generation Barrett 2060 radio-telephone interconnects. August 2008: HF-Tel (a division of the Australian National 4WD Radio Network Inc.) formed to provide direct-dial radio-telephone facilities for subscribers via the new Barrett 2060 radio- telephone interconnects. November 2008: Two additional frequencies approved by ACMA for use by VKS-737 subscribers. November 2009: Duplicated Base Stations installed at Alice Springs and Charters Towers. January 2010: New digital PABX installed to allow improved communications between the Network and other Emergency Service Organisations.

She is author of several seminal works in this area, which also led to technological implementation in the semiconductor industry. Iacopi authored an article about the problems with the structural stability of ultra-low-k-based interconnects and points that relaxation in ultra-low-k-based interconnect structures, either due to adhesion failure or by porous dielectrics compliance, can prove to be damaging in the interconnects. She proposed solutions to prevent the relaxation by either mechanism. She also defined the parameters required to generate well-grounded quantitative predictions.

Thickness is determined solely by the technology, and the aspect ratio, by the chosen width and set thickness. In technologies that support multiple levels of interconnects, each group of contiguous levels, or each level, has its own set of design rules. Before the introduction of CMP for planarizing IC layers, interconnects had design rules that specified larger minimum widths and spaces than the lower level to ensure that the underlying layer's rough topology did not cause breaks in the interconnect formed on top. The introduction of CMP has made finer geometries possible.

As IC structure geometries became smaller, to obtain acceptable yields, restrictions were imposed on interconnect direction. Initially, only global interconnects were subject to restrictions; were made to run in straight lines aligned eastwest or northsouth. To allow easy routing, alternate levels of interconnect ran in the same alignment, so that changes in direction were achieved by connecting to a lower or upper level of interconnect though a via. Local interconnects, especially the lowest level (usually polysilicon) could assume a more arbitrary combination of routing options to attain the a higher packing density.

In addition to interconnections with the P&PU; track's owners, the T&P; interconnects with the Burlington Northern Santa Fe, the Toledo, Peoria & Western, the Iowa Interstate Railroad, and the T&P;'s sister Illinois and Midland Railroad.

Diffusion processes caused by electromigration can be divided into grain boundary diffusion, bulk diffusion and surface diffusion. In general, grain boundary diffusion is the major electromigration process in aluminum wires, whereas surface diffusion is dominant in copper interconnects.

Hirotaka Tamura is an electrical engineer at Fujitsu Laboratories Ltd. in Kawasaki, Japan. He was named a Fellow of the Institute of Electrical and Electronics Engineers (IEEE) in 2013 for his contributions to technology for high speed interconnects.

Route 19 is a minor Connecticut state route running from Stafford to the Massachusetts state line. It is long and runs north-south, entirely within Stafford. The road interconnects the settlements in the eastern part of the town.

It does not allow a source to directly manage network performance by forcing packets to travel over one path to prevent congestion on another. Many high-performance interconnects including Myrinet, Quadrics, IEEE 1355, and SpaceWire support source routing.

44, no. 1, pp. 134-142, Feb 2002. A. C. Polycarpou, P. A. Tirkas and C. A. Balanis, "The finite-element method for modeling circuits and interconnects for electronic packaging," in IEEE Transactions on Microwave Theory and Techniques, vol.

In the intervening years since the development of boundary-scan standard as a structural test technology, the embedded boundary-scan infrastructure in chips and on circuit boards has been appropriated for a number of related applications, including as an access method to the instrumentation inserted in chips. A later standard in the boundary-scan family, the IEEE 1149.6 Boundary-Scan Standard for Advanced Digital Networks, utilizes the 1149.1 boundary-scan embedded instrumentation infrastructure but expands the types of chip-to-chip interconnects that can be tested. Whereas the 1149.1 standard defines a methodology for testing DC-coupled interconnects, the 1149.6 version of the boundary-scan standard extends the methodology to testing high-speed AC coupled and/or differential interconnects. Another addition to the boundary- scan family of standards has been IEEE 1149.7, which defines a reduced pin- count interface and provides for enhanced software debug.

Set in modern times, this novel interconnects the past to the present. As Mona discovers these hidden histories, she also comes to discover herself. The "Swinging Bridge" serves as a symbol of her life journey and the journey of her ancestors.

Wei Hu Koh is an electrical engineer from Pacrim Technology in Irvine, California. He was named a Fellow of the Institute of Electrical and Electronics Engineers (IEEE) in 2013 for his development of three-dimensional multichip modules and flip chip interconnects.

Later, electromigration caused reliability problems, and copper (Cu) was added to the alloy. Al interconnects are deposited by physical vapor deposition or chemical vapor deposition methods. They were originally patterned by wet etching, and later by various dry etching techniques.

A reconfigurable datapath array (rDPA) is a semiconductor device containing reconfigurable data path units and programmable interconnects, first proposed by Rainer Kress in 1993, at the University of Kaiserslautern. Instead of FPGAs (field-programmable gate arrays) having single bit configurable logic blocks (CLBs), rDPAs have multiple bits wide (for instance, 32 bit path width) reconfigurable datapath units (rDPUs). Each rDPU can be configured to perform an individual function. These rDPUs and interconnects can be programmed after the manufacturing process by the customer/designer (hence the term "reconfigurable") so that the rDPA can perform whatever complex computation is needed.

Michel S Nakhla is a Chancellor’s Professor at Carleton University and a researcher in Electronic Design Automation. He is the founder of the high- speed CAD research group at Carleton University and is a frequent invited speaker on the topic of high-speed interconnects. He is one of the first pioneers to introduce the concept of harmonic balance, which is the backbone of current RF and microwave circuit simulators. He was awarded the IEEE Fellowship in 1998 for his contributions to the development of advanced computer-aided design techniques for microwave circuits and high-speed interconnects.

The Coppermine contained 29 million transistors and was fabricated in a 0.18 μm process. Although its codename could give the impression that it used copper interconnects, its interconnects were in fact aluminium. The Coppermine was available in 370-pin FC-PGA or FC-PGA2 for use with Socket 370, or in SECC2 for Slot 1 (all speeds except 900 and 1100). FC-PGA and Slot 1 Coppermine CPUs have an exposed die, however most higher frequency SKUs starting with the 866 MHz model were also produced in FC-PGA2 variants that feature an integrated heat spreader (IHS).

Microvias are used as the interconnects between layers in high density interconnect (HDI) substrates and printed circuit boards (PCBs) to accommodate the high input/output (I/O) density of advanced packages. Driven by portability and wireless communications, the electronics industry strives to produce affordable, light, and reliable products with increased functionality. At the electronic component level, this translates to components with increased I/Os with smaller footprint areas (e.g. flip-chip packages, chip- scale packages, and direct chip attachments), and on the printed circuit board and package substrate level, to the use of high density interconnects (HDIs) (e.g.

For a given area, technologies that rely on CMP have density rules to ensure the whole IC has an acceptable variation in interconnect density. This is because the rate at which CMP removes material depends on the material's properties, and great variations in interconnect density can result in large areas of dielectric which can dish, resulting in poor planarity. To maintain acceptable density, dummy interconnects (or dummy wires) are inserted into regions with spare interconnect density. Historically, interconnects were routed in straight lines, and could change direction by using sections aligned 45° away from the direction of travel.

It interconnects the townships of Thiruvalla, Kozhencherry and Pathanamthitta. It starts at SCS Junction, Thiruvalla (Main Central Road intersection) and ends at Kumbazha (Main Eastern Highway intersection). Till the 1990s, it was called Thiruvalla-Kozhencherry Road and ended at Kozhencherry (Poyanil Jn.).

Nordost Corporation is an American high-end audio company founded in 1991 by Joe Reynolds and based in Holliston, Massachusetts. Nordost manufactures and sells audio and video cables, interconnects and unique accessories to the audiophile market and is distributed in 72 countries.

Viewing the internal structures of electronic components by cross section can reveal problems with manufacturing and material quality. In integrated circuits, a cross section can reveal the die and its active layers, the die paddle, and 1st level interconnects (wire bonds or solder bumps).

This drama is about three men in their forties, just starting to experience and understand their definition of life: issues with women, love, career, and many other relationships in life. Each has a story of their own but interconnects with the other two main characters.

Minco is a privately owned company with over 650 employees worldwide. Based in Fridley, Minnesota, the company designs and manufactures flexible printed circuit boards and interconnects, RTD based temperature sensors and assemblies, and thermal solutions for medical, defense, aerospace, industrial, and food service applications.

"Virtual Midplane Realizes Ultrafast Card Interconnects". Electronic Design. 2002\. Some people use the term "midplane" to describe a board that sits between and connects a hard drive hot-swap backplane and redundant power supplies."HP StorageWorks Modular Smart Array 70 Enclosure - Replacing the Backplane".

The resources and successes with integrated circuits, and a review of some of the drivers of field failures, subsequently motivated the reliability physics community to initiate physics of failure investigations into package-level degradation mechanisms. An extensive amount of work was performed to develop algorithms that could accurately predict the reliability of interconnects. Specific interconnects of interest resided at 1st level (wire bonds, solder bumps, die attach), 2nd level (solder joints), and 3rd level (plated through holes). Just as integrated circuit community had four major successes with physics of failure at the die-level, the component packaging community had four major successes arise from their work in the 1970s and 1980s.

The supply of petroleum crude oil enters the plant through an Andeavor Logistics owned and operated 16-inch transmission pipeline pipeline system which connects to a 750-mile network across western North Dakota including the former Bakken Link pipeline. The crude delivery system also maintains multiple interconnects to other pipelines and terminals throughout the Williston Basin as well as interconnects to Canada pipelines. About the time of North Dakota's surge in oil production when it rose from the 9th ranked producer in 2002 to 2nd highest in 2014, that connection was repurposed. The crude oil processed at the facility is now sweet crude oil from North Dakota.

Recent developments have also shown the use of monolithically integrated nanowire lasers directly on silicon for optical interconnects, paving the way for chip level applications. These heterostructure nanowire lasers capable of optical interconnects in silicon are also capable of emitting pairs of phase-locked picosecond pulses with a repetition frequency up to 200 GHz, allowing for on-chip optical signal processing. Another type is a Raman laser, which takes advantage of Raman scattering to produce a laser from materials such as silicon. Lasing without maintaining the medium excited into a population inversion was demonstrated in 1992 in sodium gas and again in 1995 in rubidium gas by various international teams.

All of the cables and interconnects are made from the front of the rack and the IT equipment is hot-pluggable and serviceable from the front of the rack. Service personnel no longer access the rear of the rack or need to work in the hot aisle.

This is called subthreshold conduction. The primary source of leakage occurs inside transistors, but electrons can also leak between interconnects. Leakage increases power consumption and if sufficiently large can cause complete circuit failure. Leakage is currently one of the main factors limiting increased computer processor performance.

An alternative to inducing micro-fractures in gold to enhance stretchability, is inducing wave-like buckles by placing the gold films on pre-stretched elastomeric substrates. Once these substrates relax, the gold creates surface waves which are repeatedly stretchable and can serve as interconnects for skin-like electronic circuits.

The A2 helps get microphones or other audio devices to the right place or to the right person : An audio assistant (A2) positions and interconnects audio devices, such as microphones and intercoms, from the television production truck to the venue. Typically, larger productions use two or more A2s.

The same basic electronic device can be an Air Force Situation Awareness Data Link (SADL) device that communicates between aircraft doing close air support, but also can exchange mission data with Army Enhanced Position Location Reporting System (EPLRS) equipment. Again, the same basic equipment interconnects EPLRS ground units.

Other examples include the ion implantation of dopant species to tailor the electrical properties of a semiconductor chip and the electrochemical deposition of metallic interconnects (e.g. electroplating). Process Engineers are generally involved in the development, scaling, and quality control of new semiconductor processes from lab bench to manufacturing floor.

Sarkar and team developed a detailed methodology for the accurate evaluation of DC to high- frequency impedance of 2D layered structures. This model provides insights into the physics of on-chip 2D interconnects and inductors and revealed for the first-time anomalous skin effect in graphene. Going beyond the simplifying assumptions of Ohm’s law, this model takes into account the effects of electric-field variation within mean free path and current dependency on the nonlocal electric-field, to accurately capture the high-frequency behavior of graphene. It showed for the first time that the high-frequency resistance of intercalation doped multi-layer graphene interconnects is lower than that of Cu and Carbon Nanotubes (CNTs).

To reduce the delay penalty caused by parasitic capacitance, the dielectric material used to insulate adjacent interconnects, and interconnects on different levels (the inter-level dielectric [ILD]), should have a dielectric constant that is as close to 1 as possible. A class of such materials, Low-κ dielectrics, were introduced during the late 1990s and early 2000s for this purpose. As of January 2019, the most advanced materials reduce the dielectric constant to very low levels through highly porous structures, or through the creation of substantial air or vacuum pockets (air gap dielectric). These materials often have low mechanical strength, and are restricted to the lowest level or levels of interconnect as a result.

In addition to chip cooling, thermal bumps can also be applied to high heat-flux interconnects to provide a constant, steady source of power for energy scavenging applications. Such a source of power, typically in the mW range, can trickle charge batteries for wireless sensor networks and other battery operated systems.

The Electromigration degradation of the on-chip power grid network/interconnect depends on the IR drop noise of the power grid interconnect. The Electromigration-aware lifetime of the power grid interconnects as well as the chip decreases if the chip suffers from a high value of the IR drop noise.

TE's defense products include ruggedized electronic interconnects serving military aviation, marine, and ground vehicles including electronic warfare and space systems. Its oil and gas products include cables and electronics used for subsea environments in the offshore oil and gas and civil marine industries and in shipboard, subsea, and sonar applications.

There is a local bus station that interconnects Tver with minor towns of Tver Oblast, neighbouring oblasts, and Moscow. Local public transit consists of trolleybuses, trams, buses, and marshrutkas (routed taxis). The latter two have taken priority during recent years. In November 2018, the tram traffic in Tver was completely stopped.

When Oracle Corporation acquired Sun Microsystems in 2010, he was appointed Vice President of Photonics, Interconnects, and Packaging at Oracle Labs. As of March 1, 2014, Mitchell retired from Oracle Labs. He is now on the board of directors of the Curci Foundation, which funds research in the life sciences.

In 2012 the Boston IX went online with the Free Software Foundation as its first participant. The exchange point supports IPv4 and IPv6 unicast peering, as well as private virtual network interconnects. Some consider the Boston IX to be the successor of the now defunct Boston MXP started by MAI.net and Vincent Bono.

ElasticHosts only has persistent storage, based on local host store. However, in 2012 it announced solid-state drives (SSD) for all instance sizes. It does not use a storage area network, but instead has directly attached RAID arrays, with iSCSI interconnects between hosts. In 2011 the CEO predicted a greater demand for storage.

Wireless network interface controller Gigabyte GC-WB867D-I. Wireless adapters allow devices to connect to a wireless network. These adapters connect to devices using various external or internal interconnects such as PCI, miniPCI, USB, ExpressCard, Cardbus, and PC Card. As of 2010, most newer laptop computers come equipped with built-in internal adapters.

Keren Bergman is an American electrical engineer who is the Charles Batchelor Professor at Columbia University. She also serves as the director of the Lightwave Research Laboratory, a silicon photonics research group at Columbia University. Her research focuses on nano-photonics and particularly optical interconnects for low power, high bandwidth computing applications.

In 2019 the Shaken Fury operational experiment for the DHS Next Generation First Responder program depicts a scenario of an earthquake causing partial structural collapse and HAZMAT leak at a stadium. OGC SensorThings API is used as the standard interface that interconnects multiple sensors and offers an IoT enabled real-time situational awareness.

Most SNK-pinout units were put into Ikari Warriors cabinets, while most JAMMA-pinout units were supplied as conversion kits. The SNK-pinout boards have a 22/44-pin edge connectors. The JAMMA-pinout PCBs have a 28/56-pin edge connectors. Both types consist of a stack of three boards, with interconnects.

Each node ran its own instance of Reliant UNIX DC/OSx. This system had a two-axis mesh architecture. The RM1000 used software called ICF to manage the cluster interconnects. ICF went on to provide the cluster foundation in the PrimeCluster HA software which is still developed and available from Fujitsu Siemens.

A logo and web site debuted in April 2008. Specifications often use pre-existing interface buses and interconnects such as PCI Express , USB 2.0, ExpressCard, Low Pin Count (LPC) Bus, SPI / uWire, and I2C / SMBus, with adaptations for modular and extensible usage. Some standards preserve the Industry Standard Architecture (ISA) Bus and legacy peripherals.

The typical current density at which electromigration occurs in Cu or Al interconnects is 106 to 107 A/cm2. For solder joints (SnPb or SnAgCu lead-free) used in IC chips, however, electromigration occurs at much lower current densities, e.g. 104 A/cm2. It causes a net atom transport along the direction of electron flow.

Minco also manufactured one of the first etched foil heaters for early "wet" copy machines made by 3M. They opened their second manufacturing facility for this production. In 1974, the company adapted its precision etching and laminating expertise to the manufacture of flexible printed circuits. These first circuits served as interconnects in cardiac pacemakers.

Recent versions can be executed in cluster and multicore configurations. In the cluster configuration, it can execute parallel Java applications on clusters and clouds. Here Java sockets or specialized I/O interconnects like Myrinet can support messaging between MPJ Express processes. It can also utilize native C implementation of MPI using its native device.

Within the switch chassis are a number of line cards that carry Elite switch ASICs. These are internally linked to form a fat tree topology. Like other interconnects such as Myrinet very large systems can be built by using multiple switch chassis arranged as spine (top-level) and leaf (node-level) switches. Such systems were called "federated networks".

Alpert, R., & Philbin, J. (1997). cBSP: Zero-cost synchronization in a modified BSP model. NEC Research Institute, 4 Independence Way, Princeton NJ, 8540, . Yet also this minimal latency is expected to increase further for future supercomputer architectures and network interconnects; the BSP model, along with other models for parallel computation, require adaptation to cope with this trend.

Chip organization improvements include four integrated DDR3 SDRAM memory controllers, glueless four-way symmetrical multiprocessing, ten SERDES channels for symmetrical multiprocessing scalability to 64 sockets, and two integrated PCI Express 3.0 controllers. The SPARC64 X contains 2.95 billion transistors, measures 23.5 mm by 25 mm (637.5 mm2), and is fabricated in a 28 nm CMOS process with copper interconnects.

UltraSPARC IIe Sun UltraSPARC IIe (back side) The UltraSPARC IIe "Hummingbird" was an embedded version introduced in 2000 that operated at 400 to 500 MHz, fabricated in a 0.18 μm process with aluminium interconnects. It dissipated a maximum of 13 W at 500 MHz, used a 1.5 to 1.7 V power supply and had a 256 KB L2 cache.

Computer Physics Communications Vol. 68, No. 1, 175–196. Current FDTD modeling applications range from near-DC (ultralow-frequency geophysics involving the entire Earth-ionosphere waveguide) through microwaves (radar signature technology, antennas, wireless communications devices, digital interconnects, biomedical imaging/treatment) to visible light (photonic crystals, nanoplasmonics, solitons, and biophotonics). Approximately 30 commercial and university-developed software suites are available.

All- fiberglass glider, with foam core sandwiches for the wing skins and fuselage bulkheads. Internal tubular-steel frame interconnects the wings, cockpit and landing gear, carrying the flight and landing stresses. This steel frame is bolted to the fiberglass shell. The Cirrus was built in female moulds, an innovation that became the standard method for all manufacturers.

Lam Research designs and builds products for semiconductor manufacturing, including equipment for thin film deposition, plasma etch, photoresist strip, and wafer cleaning processes. Repeated throughout semiconductor manufacturing, these technologies help create transistors, interconnects, advanced memory, and packaging structures. They are also used for applications in related markets like microelectromechanical systems (MEMS) and light-emitting diodes (LEDs).

It was first flown in 1955 and then went into storage for three years. The aircraft is built from Swiss pine and birch plywood and has a 52.5 foot wingspan. The PM-3 has dive brakes and full-span flaps with aileron interconnects to the flaps. It originally had fixed landing gear, but has been retrofitted with retractable mainwheel.

Alcatel Space and the CNES have investigated High-throughput optical interconnect technology for future on-board digital processors optical interconnects as an enabling technology that may offer the high-throughput data communication capabilities required to the future on-board processors and digital equipment. D-Lightsys cooperated on this research with the development of the optoelectronic modules.

The 5DX was one of several tools used by many companies in the electronics manufacturing services sector to provide a means of inspecting both the visible and hidden solder connections between the printed circuit boards and components attached to those printed circuit boards. These solder connections (also known as solder joints) are referred to as PCB interconnects.

Hong Ae-Ja (Kim Hye-Ok) works as a host at a home shopping channel. She has three accomplished daughters: Ji-Sung (Woo Hee-Jin), In-Sung (Lee Soo- Kyung) and Hee-Sung (Jung Hye-Seong). Hong Ae-Ja's family interconnects with So Pan-Seok's (Jung Bo-Suk) family and Heo Eun-Sook's (Park Hae-Mi) as in- laws.

The concept of a SCSI target isn't narrowly restricted to physical devices on a SCSI bus, but instead provides a generalized model for all receivers on a logical SCSI fabric. This includes SCSI sessions across interconnects with no physical SCSI bus at all. Conceptually, the SCSI target provides a generic block storage service or server in this scenario.

It was sampled in early 2000 and achieved a maximum clock frequency of 1.25 GHz. In September 1998, Samsung announced they would fabricate a variant of the Alpha 21264B in a 0.18 μm fully depleted silicon-on-insulator (SOI) process with copper interconnects that was capable of achieving a clock frequency of 1.5 GHz. This version never materialized.

Tantalum nitride (TaN) is a chemical compound, a nitride of tantalum. There are multiple phases of compounds, stoichimetrically from Ta2N to Ta3N5, including TaN. As a thin film TaN find use as a diffusion barrier and insulating layer between copper interconnects in the back end of line of computer chips. Tantalum nitrides are also used in thin film resistors.

IC with complex circuits require multiple levels of interconnect to form circuits that have minimal area. As of 2018, the most complex ICs may have over 15 layers of interconnect. Each level of interconnect is separated from each other by a layer of dielectric. To make vertical connects between interconnects on different levels, vias are used.

3D Packaging refers to 3D integration schemes that rely on traditional methods of interconnect such as wire bonding and flip chip to achieve vertical stacks. 3D packaging can be disseminated further into 3D system in package (3D SiP) and 3D wafer level package (3D WLP), Stacked memory die interconnected with wire bonds, and package on package (PoP) configurations interconnected with either wire bonds, or flip chips are 3D SiPs that have been in mainstream manufacturing for some time and have a well established infrastructure. PoP is used for vertically integrating disparate technologies such as 3D WLP uses wafer level processes such as redistribution layers (RDL) and wafer bumping processes to form interconnects. 2.5D interposer is also a 3D WLP that interconnects die side- side on a silicon, glass or organic interposer using TSVs and RDL.

However, wirelength reduction may be undermined unless modules of certain minimal size are preserved. On the other hand, its adverse effects include the massive number of necessary TSVs for interconnects. This design style requires 3D place-and- route tools, which are unavailable yet. Also, partitioning a design block across multiple dies implies that it cannot be fully tested before die stacking.

The improvement is the result of changes in copper's nano- and microstructure, not from graphene's independent action as an added heat conducting channel. High temperature chemical vapor deposition stimulates grain size growth in copper films. The larger grain sizes improve heat conduction. The heat conduction improvement was more pronounced in thinner copper films, which is useful as copper interconnects shrink.

Such construction methods tended to keep the neighborhood radio repairman in work. In general, however, the use of turrets and turret boards dramatically improved reliability and serviceability. Turret boards additionally allowed some degree of "engineered" construction. That is, an engineer could design a turret board with listed component interconnects such that it could be assembled by someone skilled in component recognition and soldering.

The skeleton of Acropora loripes is secreted by the polyps and is covered by a thin layer of tissue. When feeding, the polyps protrude from the corallites. Each has twelve tentacles, one of which is longer than the others. The interior of the polyps opens into a body cavity which interconnects with other polyps through a system of channels called the coenenchyme.

Retrieved 6 June 2016. 2.5D packaging can enable hundreds of thousands of interconnects within a small package space. Rick Merritt, EET Asia. "Semicon West highlights 10 chip trends." 21 July 2015. Retrieved 6 June 2016. This packaging technology is used in applications such as high memory bandwidth, network switches, router chips and graphics cards for the gaming market. Ed Sperling, Semiconductor Engineering.

This was then photo-reduced to make a 1x mask. Digitization rather than rubylith cutting was just coming in as the latest technology, but initially it only removed the rubylith stage; drawings were still manual and then "hand" digitized. PC boards meanwhile had moved from custom rubylith to PC tape for interconnects. IMI created to-scale photo-enlargements of the base layers.

A backbone or core network is a part of a computer network which interconnects pieces of various networks, providing a path for the exchange of information between different LANs or subnetworks.What is a Backbone?, Whatis.com, Accessed: June 25, 2007 A backbone can tie together diverse networks in the same building, in different buildings in a campus environment, or over wide areas.

It is the second longest State Highway of Kerala covering a distance of 153.6 km. The districts it passes through are Kollam, Pathanamthitta, Kottayam, Idukki and Ernakulam. It interconnects the townships of Punalur, Pathanapuram, Koodal, Konni, Pathanamthitta, Ranni, Manimala, Ponkunnam, Pala, Thodupuzha to the main intersection at Muvattupuzha merging to MC Road which extends northwards till Angamaly at NH 66.

A partial reticulum (net- like pattern of ridges) interconnects the warts. The spore-bearing cells, the basidia, are club-shaped and have dimensions of 24–33 by 6–7.5 µm; they are colorless, and each hold from two to four spores. The pleurocystidia (cystidia on the gill face) are 40–85 by 6–8 µm and end abruptly in a sharp point.

CA-1) that can be of one or two digits enclosed in a highway shield. "CA-" highways are part of the Central American highway network (hence the "CA" letters) that interconnects Honduras with its neighboring countries as part of the Pan- American Highway. National highways are assigned a two or three-digit number and provincial routes are assigned a three-digit number.

There are various Fibre Channel connectors in use in the computer industry. Details of their pinouts are distributed between different official documents. The following sections describe the most common Fibre Channel pinouts with some comments about the purpose of their electrical signals. The most familiar Fibre Channel connectors are cable connectors, used for interconnects between initiators and targets (usually disk enclosures).

Dead arm syndrome starts with repetitive motion and forces on the posterior capsule of the shoulder. The posterior capsule is a band of fibrous tissue that interconnects with tendons of the rotator cuff of the shoulder. Four muscles and their tendons make up the rotator cuff. They cover the outside of the shoulder to hold, protect and move the joint.

The project aims to understand protein misfolding and accelerate drug design for disease research. Long continuous-trajectory simulations have been performed on Anton, a massively parallel supercomputer designed and built around custom ASICs and interconnects by D. E. Shaw Research. The longest published result of a simulation performed using Anton is a 2.936 millisecond simulation of NTL9 at 355 K.

R. Frear, Steve Burchett, Harold S. Morgan, John H. Lau, The Mechanics of Solder Alloy Interconnects, Van Nostrand Reinhold, New York, NY 1994. Foreword by George Lucey. The Mechanics of Solder Alloy Wetting and Spreading,Frederick G. Yost, F. M. Hosking, D. R. Frear, The Mechanics of Solder Alloy Wetting and Spreading, Van Nostrand Reinhold, New York, NY 1993 (Foreword by George Lucey).

Aroostook County’s 1600-mile snowmobile trail system, Northeast Snowmobile Trail (NEST), runs through the heart of Crouseville and interconnects with the International Snowmobile Trail System linking Maine, New Hampshire, Vermont, and the Province of Quebec. Nearby downhill and cross- country skiing facilities are available at 10th Mountain Ski Center, Nordic Heritage Ski Center, Big Rock Alpine Skiway and Quoggy Jo Community Alpine Area.

This service only operates from May through October. Today, the former routing is surrounded by farms and ranges outside of the numerous communities it interconnects on Manitoulin Island. On the mainland, the highway passes through mountainous terrain and the rugged Canadian Shield. Communities along the route include South Baymouth, Squirrel Town, Manitowaning, Sheguiandah, Little Current, McGregor Bay, Whitefish Falls, West River and Espanola.

The dam is located next to Park Drive, a major roadway that cuts throughout the city's park system and interconnects with Route 49. Just across the turnpike in Deerfield it opens over in the "Silly Pond". The water from Sunset Lake flows over the spillway dam and into the Cohansey River. Originally, the lake was known as Tumbling Dam Pond.

SIX (Slovak Internet eXchange) is a Slovak internet exchange point, established at the Center of Computer Technology of Slovak University of Technology (STU). , the SIX interconnects 60 ISPsSIX member list operating in the Slovak Republic, and has a peak traffic rate of 233.4 Gbit/s,Traffic Analysis for SIX backbone Aggregated traffic making it the most significant exchange point in Slovakia.

Bancnet interconnects with international card networks Diners Club, Discover Card, KFTC, MasterCard, and VISA BancNet serves more than 41 million ATM cardholders of its 114 members and affiliates with over 12,000 ATMs and more than 5,000 POS terminals. In 2008, ExpresNet outsourced its ATM operations to BancNet. On January 30, 2015, BancNet and MegaLink announced their merger and will retain itself as its brand.

GÉANT is the pan-European data network for the research and education community. It interconnects national research and education networks (NRENs) across Europe, enabling collaboration on projects ranging from biological science, to earth observation, to arts and culture. The GÉANT project combines a high-bandwidth, high-capacity 50,000 km network with a growing range of services. These allow researchers to collaborate, working together wherever they are located.

Placement of components onto the 3D body can be done in any mCAD software. There is a special design software available (Mecadtron Nextra) which can read in mCAD data as well as electrical CAD data including the net list (interconnects). This tool offers interactive routing on the 3D surface as well as an online design rule check. Data can be exported in a LPKF production file.

ISEA maintains an archive with resources available to the public. Beginning in 2012, the development of a new archive commenced with text and PDF information available for the proceedings, catalogs, presentation abstracts, artist statements, and workshops. A new archive is in development to include images and rich media. This new archive interconnects the data to create a myriad of ways to retrieve the information.

Benzocyclobutene (BCB) is a benzene ring fused to a cyclobutane ring. It has chemical formula 88.164410 Benzocyclobutene 98% BCB is frequently used to create photosensitive polymers. BCB-based polymer dielectrics may be spun on or applied to various substrates for use in Micro Electro-Mechanical Systems (MEMS) and microelectronics processing. Applications include wafer bonding, optical interconnects, low-κ dielectrics, or even intracortical neural implants.

Each has a single ring of twelve tentacles, one of which is longer than the others. The polyps have a mouth which opens into the coelenteron. This interconnects with other polyps through a complex system of channels, the coenenchyme, inside the porous skeleton. Several colour schemes occur in this coral, purple with yellow tips to the branches, pale brown with blue tips, plain green or plain brown.

Compaq LTE 386 laptop. The success of the original LTE series led Compaq to apply the designation to later models. The LTE 386 made extensive use of flexible electronics for the motherboard and motherboard interconnects. Other later Compaq LTE computers had a pointing stick in the middle of the keyboard, however the LTE Elite 486 models had a trackball mounted to the right of the LCD screen.

The central segment interconnects the following seven Metro stations via indoor walkway. As the Berri-UQAM station, which allows transfers between the Green, Orange and Yellow lines, is two Metro stops from the closest station in this segment, in many cases it is quicker to walk than to take the Metro. The lists of connected facilities which follow are grouped by segment and nearest Metro station.

250px ECFS (East Caribbean Fiber System) is a network of repeaterless fiber optic submarine communications cable that interconnects fourteen (14) eastern Caribbean islands. The cable is 1730 km (1075 mi) in length and runs from the British Virgin Islands to Trinidad in ten (10) segments. It was first installed in September 1995 and was scheduled to be upgraded by Xtera Communications as of April 25, 2013.

Mumbai Internet Exchange (Mumbai IX) is a Mumbai-based Internet exchange point (IXP) founded in 15 August 2014 as Mumbai Convergence Hub (Mumbai CH) is an Open Carrier Neutral Internet Exchange & Peering Hub. it interconnects more than 160 members, making it the largest IXP in India and surrounding region. It's a subsidiary of Germany-based DE-CIX, not be confused with National Internet Exchange of India.

Dielectric wireless receiver is a type of radiofrequency receiver front-end featuring a complete absence of electronic circuitry and metal interconnects. It offers immunity against damage from intense electromagnetic radiation, produced by EMP and HPM sources. This receiver is known as ADNERF (an acronym used to signify an All-Dielectric Non-Electronic Radio Front-End). ADNERF is a type of Electro-Magnetic Pulse Tolerant Microwave Receiver (EMPiRe).

This front-end design significantly increases the threshold for damage associated with high power microwave signals. The lack of metal interconnects eliminates the one source of failure. In addition, the charge isolation provided by the optical link protects the electronic circuitry. Good sensitivity can be achieved due to signal enhancement provided by the microwave resonance in the DRA and optical resonance in the EO resonator.

The PV/Diesel Hybrid System is the UAE's first solar-diesel hybrid not requiring batteries. It provides round-the-clock electricity to a remote, off-grid residential complex in Abu Dhabi. This system provides 24-hour power solution, with a 2.4MW set of diesel generators, and a 755kWp solar PV system. A microgrid interconnects the two power sources and delivers power to end users.

The Alpha 21264E, code-named EV68E, was a cancelled derivative developed by Samsung first announced on 10 October 2000 at Microprocessor Forum 2000 slated for introduction at around mid-2001. Improvements were a higher operating frequency of 1.25 GHz and the addition of an on-die 1.85 MB secondary cache. It was to be fabricated in a 0.18 micrometre CMOS process with copper interconnects.

Borstel-Hohenraden is a municipality in the district of Pinneberg, in Schleswig-Holstein, Germany The municipality Borstel-Hohenraden (about 2,250 inhabitants) with the districts Borstel and Hohenraden is located northeast of the county town Pinneberg. Through the town leads the national road no. 76, the Pinneberg Quickborn and the two highways Hamburg-Kiel and Hamburg Itzehoe interconnects. The first mention of Borstel (Borstele) dates back to 1388.

Segment topologies are described in terms of the arrangements of their nodes relative to pin or port lists. The electrical behaviors for each segment are then defined. Interconnects may be grouped into families with similar characteristics or sharing identical segment definitions. As of 2006, ICM version 1.1 has been standardized in the US through both the GEIA and ANSI as ANSI GEIA-STD-0001.

Computer networks are connected together to form larger networks such as campus networks, corporate networks, or the Internet. Routers are network devices that may be used to connect these networks (e.g., a home network connected to the network of an Internet service provider). When a router interconnects many networks or handles much network traffic, it may become a bottleneck and cause network congestion (i.e.

It consists of fibers that are said to arise in the parolfactory area, the gyrus subcallosus and the anterior perforated substance, and course backward in the longitudinal striae to the dentate gyrus and the hippocampal region. This is a cholinergic bundle of nerve fibers posterior to the anterior perforated substance. It interconnects the subcallosal gyrus in the septal area with the hippocampus and lateral olfactory area.

The company's first customer was CERN, the European Organization for Nuclear Research. The IPtronics chips were produced with TriQuint Semiconductor's GaAs foundry process technology. These devices are being used as front-end electronics for Resistive Plate Chambers (RPC), a gaseous particle detector capable of sub-nanosecond time resolution on very large areas. In October 2005, IPtronics started developing optical interconnects in a collaboration with NEC Corporation.

The reason for this design is due to the ever-increasing need for transferring data at very high speeds and the only way to achieve this is to introduce Optical Technology. Copper is becoming a bottleneck at 10 Gbit/s. Silicon-based optical interconnects are also highly immune to errors. Hella Zippy is predicted to supersede Intel's own Light Peak in the coming years.

XLR3 cable connectors, female on left and male on right XLR connector plugs and sockets are used mostly in professional audio and video electronics cabling applications. XLR connector are also known as Cannon plugs after their original manufacturer. They are used for analog or digital balanced audio with a balanced line Digital audio interfaces and interconnects with the AES/EBU interface also normally use an XLR connector.

ITC Midwest LLC has transmission systems in portions of Iowa, Minnesota, Illinois and Missouri. This subsidiary was created on December 20, 2007 with ITC's acquisition of Interstate Power and Light Company's transmission system. ITC Midwest owns and operates 6,600 circuit miles of transmission lines with 262 stations and substations. Since 2008, ITC Midwest has completed 16 new generator interconnects, adding approximately 2,137 megawatts of wind energy production capacity to the grid.

Another use for HyperTransport is as an interconnect for NUMA multiprocessor computers. AMD uses HyperTransport with a proprietary cache coherency extension as part of their Direct Connect Architecture in their Opteron and Athlon 64 FX (Dual Socket Direct Connect (DSDC) Architecture) line of processors. The HORUS interconnect from Newisys extends this concept to larger clusters. The Aqua device from 3Leaf Systems virtualizes and interconnects CPUs, memory, and I/O.

Timing Library Format (abbreviated TLF) is a file format used by electronic design automation tools. A TLF file is a text file in nature and contains timing and logical information about a collection of cells (circuit elements). The TLF file contains information on the timing and power parameters of the cell library. It is used to determine delays of I/O ports and interconnects of the final design.

Connections can also be time- delayed to allow for processing in the temporal domain. Most CNN architectures have cells with the same relative interconnects, but there are applications that require a spatially variant topology, i.e. Multiple-Neighborhood-Size CNN (MNS-CNN) processors. Also, Multiple-Layer CNN (ML-CNN) processors, where all cells on the same layer are identical, can be used to extend the capability of CNN processors.

With an on-net signalling network, directly connecting 300 mobile network operators and with reach to 900+ mobile network operators, Tata Communication’s interconnects mobile ecosystem players for messaging and roaming. Its signalling services can be delivered over a number of network options including TDM, IP, Global VPN and IPX Connect (SCCP over IPX). Also supported is signalling evolution from SCCP to Diameter, ready for IMS and LTE roaming capabilities.

Delta Ticketing/Check-In at Terminal 1 Delta Airlines jets parked at Concourse C Like many other airports, MSP interconnects with several other forms of transportation. Several large parking ramps are available for cars. Most other connections are made at the Hub Building and adjacent Transit Center, which has city and shuttle bus, taxi, light-rail and rental car service. Two trams (people movers) are at the airport.

Slovenian Internet Exchange (SIX) is a Slovenian internet exchange point. As of April 2014, the SIX interconnects 26 Internet service providers on two locations in Ljubljana, one being in Jožef Stefan Institute and secondary in Ljubljana Technology Park. They are managed by Academic and Research Network of Slovenia. SIX's average yearly traffic is 21 Gbit/s reaching peaks of 55 Gbit/s making it the most significant exchange point in Slovenia.

In some approaches the floorplan may be a partition of the whole chip area into axis aligned rectangles to be occupied by IC blocks. This partition is subject to various constraints and requirements of optimization: block area, aspect ratios, estimated total measure of interconnects, etc. Finding good floorplans has been a research area in combinatorial optimization. Most of the problems related to finding optimal floorplans are NP-hard, i.e.

To compound the situation, market and competitive forces are constantly accelerating. These changes drive a need to transform enterprise communications–to become more dynamic. The Dynamic Enterprise is enabled by a Dynamic Communications Framework, a concept developed by Alcatel-Lucent, that interconnects networks, people, processes and knowledge. The framework is always on, flexible, standards-based so that organizations can respond quickly to change and better harness its knowledge.

The UltraSPARC III consisted of 16 million transistors, of which 75% are contained in the caches and tags. It was initially fabricated by Texas Instruments in their C07a process, a complementary metal-oxide-semiconductor (CMOS) process with a 0.18 μm feature size and six-levels of aluminium interconnect. In 2001, it was fabricated in a 0.13 μm process with aluminium interconnects. This enabled it to operate at 750 to 900 MHz.

The computer hardware managed by the UCS Manager software on the fabric Interconnects can be any combination of the two. Both form factors use standard components, including Intel x86-64 processors and DIMM memory. The servers are marketed with converged network adapters and port virtualization. Around 2010, an extended memory technology expanded the number of memory sockets that can be connected to a single memory channel in some models.

144–151, March 2018 In advanced semiconductor manufacturing processes, copper has replaced aluminium as the interconnect material of choice. Despite its greater fragility in the fabrication process, copper is preferred for its superior conductivity. It is also intrinsically less susceptible to electromigration. However, electromigration (EM) continues to be an ever-present challenge to device fabrication, and therefore the EM research for copper interconnects is ongoing (though a relatively new field).

The PowerPC 7400 (code-named "Max") debuted in August 1999 and was the first processor to carry the "G4" moniker. The chip operates at speeds ranging from 350 to 500 MHz and contains 10.5 million transistors, manufactured using Motorola's 0.20 μm HiPerMOS6 process. The die measures 83 mm2 and features copper interconnects. Motorola had promised Apple to deliver parts with speed up to 500 MHz, but yields proved too low initially.

It is the first to deliver direct connectivity between east Africa and Europe / North America. It is the only system with built-in resilience end-to-end. EASSy interconnects with multiple international submarine cable networks for onward connectivity to Europe, the Americas, the Middle East and Asia. The project, partially funded by the World Bank, was initiated on January 2003, when a handful of companies investigated its feasibility.

The intersection of business and government has resulted in a widespread use of bribes in most sectors across the country. Bribery and conflict of interests are common within Thailand's private and public sectors. Money politics in Thailand, the "flow of money within the political scene", stems from the high number of interconnects between the business and political sectors. Despite anti-corruption laws, the government bureaucracy is ineffective in enforcing them.

GRNET operates the Greek Internet Exchange (GR-IX). GR-IX constitutes an important national infrastructure as it interconnects significant players of the Greek Internet, such as Internet Service Providers, Content providers etc., and facilitates the exchange of IP traffic among them. The goal of GR-IX is to improve the connectivity, quality and speed of the Greek Internet and, at the same time, reduce the cost of accessing it.

As memory architectures increase in complexity, maintaining cache coherence becomes a greater problem than simple connectivity. Fireplane represents a substantial advance over previous interconnects in this aspect. It combines both snoopy cache and point-to-point directory-based models to give a two-level cache coherence model. Snoopy buses are used primarily for single buses with small numbers of processors; directory models are used for larger numbers of processors.

There are two types of communication: nearest member and "party-line". Nearest member is used to connect a core to nearest core object and party line is used to connect remote objects. There are 8 nearest neighbor interconnects per object and offers transmission speed on one object hop per clock cycle. There are 10 party line interconnect per object that offers transmission speed of four object hops per clock cycle.

Like SMS, RCS requires national and international interconnects to enable roaming. As with SMS, this will be accomplished with hubbing - where third-party providers complete agreements with individual operators to interwork their systems. Each subsequent operator that connects to a hub is therefore connected automatically to all other connected operators. This eliminates the need to each operator to connect to all the others to which they may need to send messages.

Railway bridge between Zambia and Zimbabwe at Victoria Falls Zambia Railways (ZR) is the national railway of Zambia, one of the two major railway organisations in Zambia, which may also be referred to as Railway Systems of Zambia (RSZ). The other system is the binational TAZARA Railway (TAZARA) that interconnects with the ZR at Kapiri Mposhi and provides a link to the Tanzanian port of Dar es Salaam.

Sindhu had worked at the Computer Science Lab of Xerox PARC for 11 years. Sindhu worked on design tools for very-large-scale integration (VLSI) of integrated circuits and high-speed interconnects for shared memory architecture multiprocessors. Sindhu founded Juniper Networks along with Dennis Ferguson and Bjorn Liencres in February 1996 in California. The company was subsequently reincorporated in Delaware in March 1998 and went public on 25 June 1999.

The Rockford Mass Transit District is the public transportation operator for the metro area of Rockford, Illinois. Service is provided six days per week along 19 routes, with several of these routes being combined into five Sunday routes that service a large portion of the system. The core of the system is contained in The City Loop (Route 16 clockwise and 17 counterclockwise), which interconnects with every other service.

ASNET-AM develops and provides advanced network services to the Academic, Research and Education communities of Armenia. The network interconnects about 60 scientific, research, educational, cultural and other organisations in 5 cities of Armenia, such as Yerevan, Ashtarak, Byurakan, Abovian, Gyumri, integrating them with the Pan-European Research and Education Network, GEANT. ASNET-AM network in Yerevan consists of dark fiber infrastructure with current link bandwidth from 100 Mbit/s to 10 Gbit/s.

Rostelecom () is Russia's leading long-distance telephony provider. Domestic long-distance service provides about 50% of the company's revenue; and international long-distance calls provide about 25%. Rostelecom interconnects all local public operators’ networks into a single national network for long- distance service. In other words, if one makes a long-distance call or originates Internet contact to or from Russia, it is likely that Rostelecom is providing part of the service.

Changing Minds: Physiological Psychology. Psychologists in this field usually focus their attention to topics such as sleep, emotion, ingestion, senses, reproductive behavior, learning/memory, communication, psychopharmacology, and neurological disorders. The basis for these studies all surround themselves around the notion of how the nervous system intertwines with other systems in the body to create a specific behavior. The nervous system can be described as a control system that interconnects the other body systems.

Furthermore, contact resistance, mechanical stability, planarity and integration could be improved by a supporting conductive matrix. Chai et al. first demonstrated the fabrication of vertical interconnects using aligned CNT-copper composite materials in 2007 by first growing vertically aligned CNTs before filling the voids between CNTs with copper through an electroplating method. It was shown that this material could reach low, copper-like, resistivity but was more resistant to electromigration than copper.

The IMSI is used in any mobile network that interconnects with other networks. For GSM, UMTS and LTE networks, this number was provisioned in the SIM card and for cdmaOne and CDMA2000 networks, in the phone directly or in the R-UIM card (the CDMA equivalent of the SIM card). Both cards have been superseded by the UICC. An IMSI is usually presented as a 15-digit number but can be shorter.

Here, an annular flow of clean gas is introduced around the aerosol stream to focus the droplets into a tightly collimated beam of material. The combined gas streams exit the print head through a converging nozzle that compresses the aerosol stream to a diameter as small as 10 µm. The jet of droplets exits the print head at high velocity (~50 meters/second) and impinges upon the substrate. Electrical interconnects, passive and active componentsJ.

The most popular network simulation software packages, OPNET and Tetcos NetSim, also have emulation modules for real time interconnects. In general simulation tools with emulation capabilities provide more sophistication than emulation devices. Emulation devices only provide for emulation of the physical link and do not factor in the effects of the higher layers (MAC, network, transport etc.). Simulation tools however factor in effects from the entire network stack when running in emulation mode.

Particular attention must be paid to vias and contact holes. The current carrying capacity of a via is much less than a metallic wire of same length. Hence multiple vias are often used, whereby the geometry of the via array is very significant: multiple vias must be organized such that the resulting current is distributed as evenly as possible through all the vias. Attention must also be paid to bends in interconnects.

A 1.25GHz Sample 7445 EVT prototype on an iMac G4 DVT model The PowerPC 7455 "Apollo 6" was introduced in January 2002. It came with a wider, 256-bit on- chip cache path, and was fabricated in Motorola's 0.18 μm (180 nm) HiPerMOS process with copper interconnects and SOI. It was the first processor in an Apple computer to pass the 1 GHz mark. The 7445 is the same chip without the L3 cache interface.

Superman tells Luthor that he has been on to him ever since Superman Robot #7 first malfunctioned. As his powers fade, Luthor briefly sees the world as Superman sees it and weeps as he gains a measure of understanding of the subatomic and how it interconnects. The gravity weapon has warped time causing Luthor's powers to burn out at a faster rate. As his powers drain, Luthor wishes the experience to continue.

Facture is understood as an indication that an object has been made. Summers considers concepts of form, such as seriality, diachronicity, etc. Some are given new definitions, others are adjusted in relation to the existing literature; others do not change meaning at all. Summers relates and interconnects the concepts together in relationship to artworks such as Benvenuto Cellini’s Salt Cellar of Francis I, of 1539-43 to other artworks like Late Neolithic Arrowheads.

Anodic and silicon fusion bonding do not require an intermediate layer, but do not tolerate surface roughness. Wafer-level packaging techniques based on a bonding technique with a conductive intermediate layer (conductive split ring) restrict the bandwidth and isolation of the RF MEMS component. The most common wafer-level packaging techniques are based on anodic and glass frit wafer bonding. Wafer-level packaging techniques, enhanced with vertical interconnects, offer the opportunity of three-dimensional integration.

The pyramidal cells gives a recurrent excitation which is an important mechanism found in some memory processing microcircuits. Several other connections play important roles in hippocampal function. Beyond the output to the EC, additional output pathways go to other cortical areas including the prefrontal cortex. A major output goes via the fornix to the lateral septal area and to the mammillary body of the hypothalamus (which the fornix interconnects with the hippocampus).

These are new generation hybrid ECUs that combine the functionalities of multiple ECUs of Infotainment Head Unit, Advanced Driver Assistance Systems (ADAS), Instrument Cluster, Rear Camera/Parking Assist, Surround View Systems etc. This saves on the cost of electronics as well as mechanical/physical parts like interconnects across ECUs etc. There is also a more centralized control so data can be seamlessly exchanged between the systems. There are of course challenges too.

Simultaneous videoconferencing among three or more remote points is possible in a hardware- based system by means of a Multipoint Control Unit (MCU). This is a bridge that interconnects calls from several sources (in a similar way to the audio conference call). All parties call the MCU, or the MCU can also call the parties which are going to participate, in sequence. There are MCU bridges for IP and ISDN-based videoconferencing.

NEPOMUK (Networked Environment for Personal, Ontology-based Management of Unified Knowledge) is an open-source software specification that is concerned with the development of a social semantic desktop that enriches and interconnects data from different desktop applications using semantic metadata stored as RDF. Between 2006 and 2008 it was funded by a European Union research project of the same name that grouped together industrial and academic actors to develop various Semantic Desktop technologies.

In 1959, Spain started Microwave Service Company to provide distant signals to CATV systems and network interconnects for broadcast facilities. At the peak of his terrestrial transmission business, the company served twelve states. Because of the strategic location of these facilities, Spain joined Jack Goeken and Bill McGowan in the start-up of MCI. He maintained a sole ownership in MCI Mid-South and an equal partnership with the Meredith Corporation in MCI Southeast.

Some such planar inductors use a planar core. Small value inductors can also be built on integrated circuits using the same processes that are used to make interconnects. Aluminium interconnect is typically used, laid out in a spiral coil pattern. However, the small dimensions limit the inductance, and it is far more common to use a circuit called a gyrator that uses a capacitor and active components to behave similarly to an inductor.

As of 2008, the Continuum Fingerboard has a new modular digital synthesizer built-in, specifically designed for the Continuum Fingerboard, called The EaganMatrix. The EaganMatrix uses a patching matrix to design synthesis algorithms. The patching matrix interconnects a variety of modules: oscillator, filter, delay, modulation, waveshaping, spectral manipulation, modal physical modeling, waveguide physical modeling, kinetic modeling, granulation, and shape generator. Each three-dimensional performance direction of the Continuum playing surface can influence each patch point in the matrix.

The M-protein promoter is responsive to T3, and was suggested to contain thyroid hormone response elements near the transcriptional start point. The giant protein titin, together with its associated proteins, interconnects the major structure of sarcomeres, the M bands and Z discs. The C-terminal end of the titin string extends into the M line, where it binds tightly to M-band constituents MYOM1 and M-protein, of apparent molecular masses of 190 kD and 165 kD, respectively.

Server farms are commonly used for cluster computing. Many modern supercomputers comprise giant server farms of high-speed processors connected by either Gigabit Ethernet or custom interconnects such as Infiniband or Myrinet. Web hosting is a common use of a server farm; such a system is sometimes collectively referred to as a web farm. Other uses of server farms include scientific simulations (such as computational fluid dynamics) and the rendering of 3D computer generated imagery (see render farm).

A conceptual diagram of a local area network using bus network topology. A local area network (LAN) is a computer network that interconnects computers within a limited area such as a residence, school, laboratory, university campus or office building. By contrast, a wide area network (WAN) not only covers a larger geographic distance, but also generally involves leased telecommunication circuits. Ethernet and Wi-Fi are the two most common technologies in use for local area networks.

JURIX is a foundation based in the Netherlands that deals with legal subjects in relation to information technology and especially interconnects computer and legal scientists from that country. It is also known for organizing the so-called open and international JURIX conferences that are held annually since 1988. Its self attribution suffix is Foundation for Legal Knowledge and Information Systems, Foundation for Legal Knowledge Based Systems or in its logo in shortened form Foundation for Legal Knowledge Systems.

CNTs are potential candidates for future via and wire material in nano-scale VLSI circuits. Eliminating electromigration reliability concerns that plague today's Cu interconnects, isolated (single and multi-wall) CNTs can carry current densities in excess of 1000 MA/cm2 without electromigration damage. Single-walled nanotubes are likely candidates for miniaturizing electronics. The most basic building block of these systems is an electric wire, and SWNTs with diameters of an order of a nanometer can be excellent conductors.

The ocean body surrounding the Antarctic is currently the only continuous body of water where there is a wide latitude band of open water. It interconnects the Atlantic, Pacific and Indian oceans, and provide an uninterrupted stretch for the prevailing westerly winds to significantly increase wave amplitudes. It is generally accepted that these prevailing winds are primarily responsible for the circumpolar current transport. This current is now thought to vary with time, possibly in an oscillatory manner.

Rodovia Assis Chateubriand (officially designated SP-425) is a highway in the state of São Paulo, Brazil. Its name honours the Brazilian journalist and press tycoon, Assis Chateaubriand, owner of Diários Associados. The highway, which is single-lane in most of its length, crosses the state in the northeast-southwest direction. It starts in the city of Guaíra, and passes through Barretos, Olímpia and São José do Rio Preto, where it interconnects with the Rodovia Transbrasiliana (BR-153).

Random logic is a semiconductor circuit design technique that translates high- level logic descriptions directly into hardware features such as AND and OR gates. The name derives from the fact that few easily discernible patterns are evident in the arrangement of features on the chip and in the interconnects between them. In VLSI chips, random logic is often implemented with standard cells and gate arrays. Random logic accounts for a large part of the circuit design in modern microprocessors.

This however is not in the usual sense: On one side of the platform, climb—at the station Berliner Straße usually on the right side, but on the left side—seen in the direction of travel. It could also be seen as apart Laid central platforms the platforms thus. Only one transition at the north end of both platforms interconnects. This construction project was necessary because the subway construction, a road tunnel between the two side platforms was built.

The company's physically diverse networks provide customers with connections to primary carrier hotels, incumbent local exchange carrier central offices, key enterprise buildings and other major data aggregation facilities. Looking Glass interconnects with more than 140 carriers, has over 760 points of presence, 430 on-net buildings and 860 Type II buildings. This connectivity, coupled with their protocol "agnostic" platform, allows Looking Glass to deliver flexible service options and fast delivery intervals to customers with significant bandwidth needs.

An organic light-emitting transistor (OLET) is a form of transistor that emits light. These transistors have potential for digital displays and on-chip optical interconnects. OLET is a new light-emission concept, providing planar light sources that can be easily integrated in substrates like silicon, glass, and paper using standard microelectronic techniques. OLETs differ from OLEDs in that an active matrix can be made entirely of OLETs, whereas OLEDs must be combined with switching elements such as TFTs.

SiO2 surface and interacts with the top diffraction grating. Metals (made from intrinsic CMOS interconnects, shown in black) create a top and a bottom grating. The top grating creates a Talbot pattern at the depth of the bottom grating, which lines up with either opaque metal or transparent gap in the lower, analyzer grating, depending on incident angle. A large photodiode below measures the light flux through the analyzer grating, which is a sinusoidal function of incident angle.

Delivery of Advanced Network Technology to Europe (DANTE) is a not-for-profit company that plans, builds and operates the consecutive generations of the backbone network that interconnects the national research and education networks (NRENs) in Europe. The organisation is based in Cambridge, United Kingdom and was formed in 1993 as a limited liability company owned by Réseaux Associés pour la Recherche Européenne (RARE). Ownership was transferred to a number of NRENs and government agencies in 1994. DANTE Ltd.

DANTE Ltd. currently operates the third generation of the GÉANT backbone network that interconnects Europe's National Research and Education Networks (NRENs). Together GÉANT and the NRENs connect 40 million researchers and students across Europe, facilitating collaborative research in a diverse range of disciplines, including high- energy physics, radio astronomy, bio-medicine, climate change, earth observation, and arts and culture. GÉANT offers the robustness that large research projects rely on; they require outstanding service availability and service quality.

Christie and Stroobandt later derived Rent's rule theoretically for homogeneous systems and pointed out that the amount of optimization achieved in placement is reflected by the parameter p, the "Rent exponent", which also depends on the circuit topology. In particular, values p<1 correspond to a greater fraction of short interconnects. The constant t in Rent's rule can be viewed as the average number of terminals required by a single logic block, since T = t when g = 1.

The 400 kV substation interconnects four generator circuits, six feeders, two inter-bus transformers and includes two bus coupler switches and one main busbar section. The circuits are back to back and are arranged with the generator and interbus transformer connections on the power station side and the line entries on the opposite side of the substation. The current line entries are Bicker Fen-Walpole, Bicker Fen- Spalding North, Keadby 2, High Marnham, Cottam, and Keadby 1.

The WILD Foundation is a non-profit organization, belonging to category 501(c)(3) of the U.S. Internal Revenue Code, that was founded in 1974 by South Africans Ian Player (conservationist) and Magqubu Ntombela (Zulu chief, friend, and colleague), and based in Boulder, Colorado. WILD states that their vision is to inspire a world that protects and interconnects at least half of all nature areas on earth in a connected way for the benefit of wilderness and communities.

Low-temperature solid oxide fuel cells (LT-SOFCs), operating lower than 650 °C, are of great interest for future research because the high operating temperature is currently what restricts the development and deployment of SOFCs. A low-temperature SOFC is more reliable due to smaller thermal mismatch and easier sealing. Additionally, a lower temperature requires less insulation and therefore has a lower cost. Cost is further lowered due to wider material choices for interconnects and compressive nonglass/ceramic seals.

However, it is also very common to construct supercomputers out of many pieces of cheap commodity hardware; usually individual computers connected by networks. These so-called computer clusters can often provide supercomputer performance at a much lower cost than customized designs. While custom architectures are still used for most of the most powerful supercomputers, there has been a proliferation of cluster computers in recent years. They often feature thousands of CPUs, customized high-speed interconnects, and specialized computing hardware.

These are supported by a knowledge database, and a communication system that interconnects the functional processes and the knowledge database. Each functional element in the node may have an operator interface. The connections to the Operator Interface enable a human operator to input commands, to override or modify system behavior, to perform various types of teleoperation, to switch control modes (e.g., automatic, teleoperation, single step, pause), and to observe the values of state variables, images, maps, and entity attributes.

RMI had four product lines: three developed internally and one acquired. The XLR (introduced circa 2005) was a multicore, multithreaded CPU used for network processing. XLR integrated circuits had 2 to 8 MIPS architecture CPU cores, each extended to support 4 hardware threads. XLR processors included HyperTransport, PCI-X, Gigabit Ethernet, and IEEE floating point unit per core and optionally 10 Gigabit Ethernet interconnects. Alt URL A 2.0 GHz clock rate for the XLP was announced in May 2009.

In the grid computing approach, the processing power of many computers, organised as distributed, diverse administrative domains, is opportunistically used whenever a computer is available. In another approach, a large number of processors are used in proximity to each other, e.g. in a computer cluster. In such a centralized massively parallel system the speed and flexibility of the ' becomes very important and modern supercomputers have used various approaches ranging from enhanced Infiniband systems to three- dimensional torus interconnects.

Prior to the invention of the telephone switchboard, pairs of telephones were connected directly with each other, which was primarily useful for connecting a home to the owner's business (They practically functioned as a primitive intercom). A telephone exchange provides telephone service for a small area. Either manually by operators, or automatically by machine switching equipment, it interconnects individual subscriber lines for calls made between them. This made it possible for subscribers to call each other at homes, businesses, or public spaces.

This gene encodes a protein that may regulate endothelial cell differentiation. It has been postulated that the protein functions as a bridging molecule that interconnects regulatory proteins and the basal transcriptional machinery, thereby modulating the transcription of genes involved in endothelial differentiation. This protein has also been found to act as a transcriptional coactivator by interconnecting the general transcription factor TATA element-binding protein (TBP) and gene- specific activators. Two alternatively spliced transcripts which encode distinct proteins have been found for this gene.

In 2011, researchers reported that a three-dimensional, vertically aligned, functionalized multilayer graphene architecture can be an approach for graphene-based thermal interfacial materials (TIMs) with superior thermal conductivity and ultra-low interfacial thermal resistance between graphene and metal. Graphene-metal composites can be used in thermal interface materials. Adding a layer of graphene to each side of a copper film increased the metal's heat-conducting properties up to 24%. This suggests the possibility of using them for semiconductor interconnects in computer chips.

From a macroscopic point of view, a generalized compact RLC model for CNT interconnects can be depicted as in, where the model of an individual multi-wall carbon nanotube is shown with parasitics representing both dc conductance and high-frequency impedance i.e. inductance and capacitance effects. Multiple shells of a multi-wall carbon nanotube are presented by the individual parasitics of each shell. Such model can also be applicable to single-walled carbon nanotubes where only a single shell is represented.

PHONE+ is a monthly trade publication for communication distribution channels providing news and strategic information to private-label resellers, agents, brokers, VARs, systems integrators, interconnects and dealers that deliver bundled voice, data, wireless, Internet and content services, and CPE. The magazine was established in 1987 and has a circulation of 20,000. The publication also is the sponsor of the Channel Partners Conference & Expo. It was published by Virgo Publishing's Telecom Division, based in Phoenix, Arizona, U.S.A. Virgo was acquired by Informa in 2014.

The wires occupy much of the area of the chip, and in nanometer CMOS technology, interconnects dominate both performance and dynamic power dissipation, as signal propagation in wires across the chip requires multiple clock cycles. This also allows more parasitic capacitance, resistance and inductance to accrue on the circuit. (See Rent's rule for a discussion of wiring requirements for point-to-point connections). Sparsity and locality of interconnections in the communications subsystem yield several improvements over traditional bus-based and crossbar-based systems.

East West Gas Pipeline abbreviated as EWPL is a project implemented to transport gas from Kakinada (Andhra Pradesh) to Bharuch (Gujarat) including various spurs and interconnects on the way. EWPL traverses through the Indian states of Andhra Pradesh, Telangana, Karnataka, Maharashtra and Gujarat. EWPL has been authorized as a common carrier pipeline. The East West Gas Pipeline supplies Natural gas to RIL's vast petrochemical complex at Gujarat and delivers gas to numerous customers via branch line connections along its length.

I/O-space reads and writes to the MSCP controller, a less-expensive but still-costly operation, are similarly minimized. Because MSCP packets were deliberately designed to resemble the packets exchanged on the VMScluster interconnects, it is a very inexpensive operation to ship storage requests around a VMScluster for remote execution; this greatly facilitates the creation of large-scale VMSclusters. The dependence upon in-memory packets and the minimization of interrupts and I/O-space reads and writes greatly facilitates remote operations.

High current density increases the number of electrons scattering against the atoms of the conductor, and hence the speed at which those atoms are displaced. In integrated circuits, electromigration does not occur in semiconductors directly, but in the metal interconnects deposited onto them (see semiconductor device fabrication). Electromigration is exacerbated by high current densities and the Joule heating of the conductor (see electrical resistance), and can lead to eventual failure of electrical components. Localized increase of current density is known as current crowding.

Thomas has written essays for Malayalam magazines since 2006. In 2013, he published the book Rathi Rahasyam—an in depth study on human sexuality which interconnects the knowledge on sexuality with anthropology, evolutionary psychology, and cultural history. His first novel, Nidra Moshanam, is a psychological thriller published in 2015. The nonfiction book Maranathinte Ayiram Mukhangal (2016) explores ideas of death from cell death to the end of human civilization by converging political history, cultural philosophy, cellular biology, and evolutionary theory.

Roambi ES is secure server software that is typically deployed on-premises or in a private hosted cloud, like Amazon Web Services. The software is designed for large companies and can change business reports and data into analytics. The software interconnects with multiple systems, enables publishing capabilities and enforces the right security policies to Roambi files that can be viewed by Roambi Analytics and Flow apps. Roambi ES can be installed in an on-premises or private cloud environment, like Amazon AWS.

He received an Achievement in Excellence Award for his contribution in PCI Express specification development in 2002. Intel's Chief I/O architect responsible for the platform and I/O interconnects directions, Bhatt also leads definition and development of the next-generation Client Platform architecture. Intel Fellows are selected for their technical leadership and outstanding contributions to the company and the industry. On October 9, 2009, The Tonight Show with Conan O'Brien did a comedy sketch featuring him that parodied Intel's "Rockstar" commercials.

Following Alumni grant and crowd funding, and with the support of Focusrite Audio Engineering, the team was able to upgrade all studio interconnects to be digital, using Focusrite's RedNet system on the Audio Over IP protocol, Dante. In September 2015, URY was able to begin broadcasting a 'hum-less' stream. The project was nominated for a Student Radio Award in October 2016. URY's longest show ever, URY 101, was broadcast in June 2016 for 101 hours in aid of Yorkshire Cancer Research.

The Nantes Busway (line 4) is a bus rapid transit line operating in the city of Nantes, France. The service was inaugurated on November 6, 2006 and is operated by Semitan. The line runs from Place Foch to Porte de Vertou on a dedicated right-of-way, and interconnects with line 1 of the Nantes Tramway at Duchesse Anne Château station. Four park & ride facilities have been built along the construction of the line to encourage passengers to use public transport.

It rises in central Salem County, approximately southeast of Woodstown, and flows south, through rural Cumberland County. It interconnects with Sunset Lake, which is in turn fed from Mary Elmer Lake, both of which are located in Bridgeton's park system. At Bridgeton it becomes navigable, although very shallow at low tide: 1 foot to a few inches coming through downtown Bridgeton. The city boat ramp downtown is unusable during low tide due to about of mud between the channel and the ramp.

99, pp. 1-1. Data Center Network (DCN) holds a pivotal role in a data center, as it interconnects all of the data center resources together. DCNs need to be scalable and efficient to connect tens or even hundreds of thousands of servers to handle the growing demands of Cloud computing.M. Al-Fares, A. Loukissas, A. Vahdat, A scalable, commodity data center 2 network architecture, in: ACM SIGCOMM 2008 Conference on Data 3 Communication, Seattle,WA, 2008, pp. 63–74.

Saskatchewan Research Network Incorporated (SRNET) is a research and education network providing networking service support education, research and innovation in the province of Saskatchewan, Canada. SRNET is member-driven and is a not-for-profit member of Canada's National Research and Education Network, which provides dedicated high speed network access to institutions and companies across Canada. SRNet also provides members access to CANARIE, a dedicated network that links similar research networks. The network also interconnects high performance computing resources within the province.

The localized electrodeposition was first reported by a group at University of Illinois at Urbana-Champaign in 2006 , and was used to fabricate high-density and high quality interconnects and wire bonds . A research group at University of Texas at Dallas studied the process further and determined that through the application of a pulsed voltage, nanotwinned metals can be 3D-printed. They demonstrated the ambient environment L-PED process for direct printing of 3D free-standing nanotwinned Cu nanostructures for the first time .

The continuing trend towards reduced feature size and voltage in integrated circuits renders modern electronics highly susceptible to damages caused by High Power Microwave (HPM) and other microwave based directed energy sources. These induce high voltage transient surges of thousands of volts which can punch through the gate insulator in the transistor and can destroy the circuit’s metal interconnects. To immunize electronic systems against such threats, the “soft spots” (metal and transistor) in a conventional receiver front-end, must be eliminated.

IBM designed a PowerPC-based processor with custom architectural extensions for the next- generation console, known as Gekko, which runs at 485 MHz and features a floating point unit (FPU) capable of 1.9 GFLOPS. Described as "an extension of the IBM Power PC architecture", the processor was designed in IBM's 0.18μm CMOS technology, which features copper interconnects. Codenamed "Flipper", the GPU runs at 162 MHz and, in addition to graphics, manages other tasks through its audio and input/output (I/O) processors.

Goldstein has cautioned that there is a serious disconnect between the fields of nanobiotechnology and A-life based on profound differences in scientific training, experimental systems, and the different sets of terminology (jargon) these two fields have produced. Nanobiotechnologists (really molecular engineers who work with both biological and nonbiological molecules) are generally not concerned with complex systems per se; even when they are building molecular interconnects between such systems, e.g. neuroelectronic splices. A-Life researchers mainly take a systems-level approach.

Where men perceive themselves as the dominant gender, disobedient women who fail to conform to their given inferior role are labelled as abnormal, promiscuous, neurotic or frigid. Spender draws parallels with how derogatory terms are used to maintain racism (1980:6). Man Made Language illustrates how linguistic determinism interconnects with economic determinism to oppress women in society and provides a wide breadth of analysis to do this. The book explores the assumed deficiencies of women, silencing, intimidation and the politics of naming.

Her selected research areas include Nanoelectronics, Semiconductors, 2D Materials, Nanophotonics and Energy Storage. Her research has added to the ITRS roadmap of materials and processes for advanced semiconductor technologies regarding devices, interconnects, and packaging. Iacopi’s research contributions have earned her various awards including a Gold Award for Graduate Students (Materials Research Society) in 2003 and Global Innovation Award (TechConnect World) in 2014.} She has served as an advisory committee member to the Queensland State Government on Science and Innovation in 2015.

However, the protective layers are subject to erosion by micrometeorites. Silver builds up a layer of silver oxide, which tends to flake off and has no protective function; such gradual erosion of silver interconnects of solar cells was found to be the cause of some observed in-orbit failures.Myer Kutz - Handbook of Environmental Degradation of Materials (2005, 0815515006) Many plastics are considerably sensitive to atomic oxygen and ionizing radiation. Coatings resistant to atomic oxygen are a common protection method, especially for plastics.

Track of the overhead line section of Baltic Cable in Sweden The Baltic Cable is a monopolar HVDC power line running beneath the Baltic Sea that interconnects the electric power grids of Germany and Sweden. Its maximum transmission power is 600 megawatts (MW). The Baltic Cable uses a transmission voltage of 450 kV - the highest operating voltage for energy transmission in Germany. The total project cost was 2 billion SEK (US$280 million), and the link was put into operation in December 1994.

It also contains decussating fibers from the olfactory tracts, vital for the sense of smell and chemoreception. The anterior commissure works with the posterior commissure to link the two cerebral hemispheres of the brain and also interconnects the amygdalae and temporal lobes, contributing to the role of memory, emotion, speech and hearing. It also is involved in olfaction, instinct, and sexual behavior. In a sagittal section, the anterior commissure is oval in shape, having a long vertical axis that measures about 5 mm.

The plant is connected to the power grid via numerous 345 kV transmission lines, both operated and maintained by ITC Transmission. There are 3 double-circuit 345kV Transmission Lines. Two of the three head west and one goes north to west and there it crosses Interstate 94 and goes north to west again where it connects to a 345kV line heading north to the Greenwood Energy Center, also owned by Detroit Edison. Another 345 kV transmission line interconnects with Hydro One.

COMindico was an Australian IP telecommunications carrier. It started as IPTel in 2000 by Wayne Passlow with the backing of AGL, AMP, JPMorganChase, James Packer (CPH) and Lachlan Murdoch (Queensland Press). The COMindico name came from the latin Indico coupled with COM to represent communications. COMindico built a 100% Cisco-powered IP/MPLS network with SS7 interconnects to Telstra from its 66 POPs situated in each of Telstra's call collection zones, allowing VoIP and internet access to over 97% of Australians.

According to Timothy Gitzen, the need for compulsory military service comes from "a Cold War binary". In this case, the perceived threat of North Korea created the perceived need for mandatory military service. The military institution interconnects with the institutions of family, education and healthcare to shape citizens' perceptions of sex and gender and, in the process, marginalize transgender bodies. The military can be viewed as a rite of passage to manhood and more importantly, citizenship in terms of nationality and belonging.

Conventional static timing analysis (STA) has been a stock analysis algorithm for the design of digital circuits over the last 30 years. However, in recent years the increased variation in semiconductor devices and interconnect has introduced a number of issues that cannot be handled by traditional (deterministic) STA. This has led to considerable research into statistical static timing analysis, which replaces the normal deterministic timing of gates and interconnects with probability distributions, and gives a distribution of possible circuit outcomes rather than a single outcome.

While traditional CMOS scaling processes improves signal propagation speed, scaling from current manufacturing and chip-design technologies is becoming more difficult and costly, in part because of power- density constraints, and in part because interconnects do not become faster while transistors do. 3D ICs address the scaling challenge by stacking 2D dies and connecting them in the 3rd dimension. This promises to speed up communication between layered chips, compared to planar layout. 3D ICs promise many significant benefits, including: ; Footprint: More functionality fits into a small space.

Nichols holds a Ph.D. in electrical engineering and computer sciences from University of California, Berkeley, and a B.S. in electrical engineering from the University of Pittsburgh. She has held several advanced architecture and research positions at Pollere, Cisco, Bay Networks, Com21, Philips Research Labs, Apple Computer, and AT&T; Bell Labs. In addition, she was co-chair of the IETF Differentiated Services Working Group, has held several positions with the IEEE Hot Interconnects Symposium, and has been a guest editor of both IEEE Software and IEEE Micro.

The Port is accessed by federal road BR 101 and the state road PE 060. At northwest it interconnects with BR 232, a federal highway that crosses the state in the east-west direction. The Guararapes International Airport from Recife, is north. The Maceió airport is south, João Pessoa airport is north, near state airports such as Caruaru ( W), and Petrolina ( W). The Transnordestina (main goods NE train line with 1,800 km/1,115 mi extent) crosses 3 and connects 7 States (34 cities just in Pernambuco).

Variations of OWC can be potentially employed in a diverse range of communication applications ranging from optical interconnects within integrated circuits through outdoor inter-building links to satellite communications. OWC long range inter-buildings communications idea for Istanbul Skyline OWC can be divided into five categories based on the transmission range: # Ultra-short range: chip-to-chip communications in stacked and closely packed multi-chip packages. # Short range: wireless body area network (WBAN) and wireless personal area network (WPAN) applications under standard IEEE 802.15.7, underwater communications .

In integrated circuit design, physical design is a step in the standard design cycle which follows after the circuit design. At this step, circuit representations of the components (devices and interconnects) of the design are converted into geometric representations of shapes which, when manufactured in the corresponding layers of materials, will ensure the required functioning of the components. This geometric representation is called integrated circuit layout. This step is usually split into several sub- steps, which include both design and verification and validation of the layout.

The prefrontal cortex is highly interconnected with much of the brain, including extensive connections with other cortical, subcortical and brain stem sites. The dorsal prefrontal cortex is especially interconnected with brain regions involved with attention, cognition and action, while the ventral prefrontal cortex interconnects with brain regions involved with emotion. The prefrontal cortex also receives inputs from the brainstem arousal systems, and its function is particularly dependent on its neurochemical environment. Thus, there is coordination between our state of arousal and our mental state.

Further examples of metropolitan Internet Exchanges in the USA that were operational by 2002 include the Anchorage Metropolitan Access Point (AMAP), the Seattle Internet Exchange (SIX), the Dallas-Fort Worth Metropolitan Access Point (DFMAP) and the Denver Internet Exchange (IX-Denver). Verizon put into operation three regional metropolitan exchanges to interconnect MANs and give them access to the Internet. The MAE-West serves the MANs of San Jose, Los Angeles and California. The MAE-East interconnects the MANs of New York City, Washington, D.C., and Miami.

While the MAE-Central interconnects the MANs of Dallas, Texas, and Illinois. In larger cities several local providers may have built a dark fibre MAN backbone. In London the metro Ethernet rings of several providers make up the London MAN infrastructure. Like other MANs, the London MAN primarily serves the needs of its urban customers, who typically need a high number of connections with low bandwidth, a fast transit to other MAN providers, as well as high bandwidth access to national and international long-haul providers.

To overcome the disappearing access for test probes, instrumentation technology began to be embedded into semiconductors and onto printed circuit boards. In recent years, this situation has been exacerbated by increasingly high-speed serial inter-chip connections (interconnects or buses) on circuit boards as well as by even more complex chip packaging technologies like system-on-a-chip (SOC), system-in-package (SIP) and package-on-package (POP). These and other developments are making instrumentation embedded into chips a necessity for design validation, test and debug processes.

A Serializer/Deserializer (SerDes pronounced sir-deez or sir-dez) is a pair of functional blocks commonly used in high speed communications to compensate for limited input/output. These blocks convert data between serial data and parallel interfaces in each direction. The term "SerDes" generically refers to interfaces used in various technologies and applications. The primary use of a SerDes is to provide data transmission over a single line or a differential pair in order to minimize the number of I/O pins and interconnects.

Management of the system devices is handled by the UCS Manager software integrated with fabric interconnects. Virtual machines can be moved from one physical chassis to another, applications may be moved between virtual machines, and management may even be conducted remotely from an iPhone using SiMU - Simple iPhone Management of UCS. In addition to the embedded software, administrators may also manage the system from VMware's vSphere. The Cisco Integrated Management Controller (CIMC) is used to configure and manage C-Series servers not connected to a manager.

Titin, together with its associated proteins, interconnects the major structure of sarcomeres, the M bands and Z discs. The C-terminal end of the titin string extends into the M line, where it binds tightly to Myomesin-1 and myomesin 2. Skelemin/Myomesin-1 is concentrated at peripheral regions of M-bands, and is postulated to link myofibrils with the intermediate filament cytoskeleton. Skelemin/Myomesin-1 has been detected in the nucleus as well as the cytoskeletal, suggesting that it may play a role in gene expression.

Rodovia Dom Pedro I (official designation SP-065) is a highway in the state of São Paulo, Brazil. One of the most modern and scenic highways in the country, it interconnects the Anhangüera and the Presidente Dutra highways, serving the major cities of Campinas, Atibaia, Jacareí and São José dos Campos. It is 126 km long and crosses a picturesque hilly region full of lakes, dams and temperate forests. The highway intersects the Fernão Dias Highway, between São Paulo and Belo Horizonte, near the city of Atibaia.

Multicast Source Discovery Protocol (MSDP) is a Protocol Independent Multicast (PIM) family multicast routing protocol defined by Experimental RFC 3618. Despite becoming the IPv4 de facto standard for inter-domain multicast, development of the protocol stopped in 2006 and it was decided by the authors not to proceed with making it a proposed standard. MSDP interconnects multiple IPv4 PIM Sparse-Mode (PIM-SM) domains which enables PIM-SM to have Rendezvous Point (RP) redundancy and inter-domain multicasting RFC 4611. MSDP uses TCP as its transport protocol.

It will no longer be possible to prototype with breadboards or wire-wrapping, and the design must go straight to PCB, which are costly to fabricate in small volumes. In this regime, the expansion bus and the expansion card become largely synonymous. Additionally, with high- speed electronics the electrical enclosure becomes important to shield the expansion card from electromagnetic interference and to comply with regulations on radiated emissions. Electrical enclosures, such as computer cases, are typically designed to accept expansion cards of predetermined dimensions, with standardized interconnects.

Link 22 is a North Atlantic Treaty Organization (NATO) secure radio system that provides Beyond Line-Of-Sight (BLOS) communications. It interconnects air, surface, subsurface, and ground-based tactical data systems, and it is used for the exchange of tactical data among the military units of the participating nations. Link 22 will be deployed in peacetime, crisis, and war to support NATO and Allied warfare taskings. The Link 22 Program was initially conducted collaboratively by seven nations under the aegis of a Memorandum Of Understanding (MOU).

In automotive engineering, a vehicle bus is a specialized internal communications network that interconnects components inside a vehicle (e.g., automobile, bus, train, industrial or agricultural vehicle, ship, or aircraft). Special requirements for vehicle control such as assurance of message delivery, of non-conflicting messages, of minimum time of delivery, of low cost, and of EMF noise resilience, as well as redundant routing and other characteristics mandate the use of less common networking protocols. Protocols include Controller Area Network (CAN), Local Interconnect Network (LIN) and others.

With the advent of popular sub-microsecond interconnects, SHMEM has been used to address the necessity of hyper- efficient, portable, parallel-communication methods for exascale computing. Programs written using SHMEM can be started on several computers, connected together with some high-performance network, supported by used SHMEM library. Every computer runs a copy of a program (SPMD); each copy is called PE (processing element). PEs can ask the SHMEM library to do remote memory-access operations, like reading ("shmem_get" operation) or writing ("shmem_put" operation) data.

They were able to control the Schottky barrier to achieve low-resistance contacts by placing a silicide layer in the metal-silicon interface. It is possible that semiconductor nanowire crossings will be important to the future of digital computing. Though there are other uses for nanowires beyond these, the only ones that actually take advantage of physics in the nanometer regime are electronic. In addition, nanowires are also being studied for use as photon ballistic waveguides as interconnects in quantum dot/quantum effect well photon logic arrays.

The neurons of the primary auditory cortex can be considered to have receptive fields covering a range of auditory frequencies and have selective responses to harmonic pitches. Neurons integrating information from the two ears have receptive fields covering a particular region of auditory space. The primary auditory cortex is surrounded by secondary auditory cortex, and interconnects with it. These secondary areas interconnect with further processing areas in the superior temporal gyrus, in the dorsal bank of the superior temporal sulcus, and in the frontal lobe.

Because of its proximity to the sea, Enviromena's team of engineers designed a unique corrosion-resistant racking system using glass reinforced plastics instead of metal. The Al Jarnain hybrid plant produces 1,336MWh per year, and reduces the island's fuel demand by up to 50 percent. Most recently, Enviromena developed an innovative solar-diesel hybrid power plant in the island of Al Yassat for the Dubai Electricity and Water Agency (DEWA). The project interconnects the private island's current gen-sets with an 800 kWp PV system.

Consumer electronics trends are leaning towards miniaturization and connectivity. Because active cables are more compact and portable than passive cables, they are ideal for use with products such as smartphones, HDTVs, gaming consoles and DV cameras. DisplayPort is the latest consumer electronics standard that has enabled support for active cables by allocating power supply pins inside the connector. Active DisplayPort cables enable ultra-thin (32 AWG and thinner) and long-reach interconnects which are particularly valuable for the use with the miniature Mini DisplayPort form-factor.

Here the line interconnects with transmission lines carrying power from Shasta Dam and Keswick Dam. ;Connecting wires to Path 15 - Olinda to Tracy From Olinda Substation, the TANC 500 kV continues as a single-circuit line, although the tower structures change (see photos below) to a two-level pylon. The line proceeds south and then southeast along the western edge of the Sacramento Valley. It parallels Interstate 5 (about four miles (6.5 km) to the west) on its way south, although it's barely visible.

1200 species have been identified but not surprisingly there are still over 300 species to be identified. The Department of Environment and Conservation improved infrastructure by installing a bitumen loop road for access to the unique flora and fauna. The best period to see the wildflowers in bloom is from August through until October. A 2.5 km walk trail "3 Bays Walkway" interconnects the three main bays from South Bay at Cliff Park, to Dynamite Bay and continues on to Anchorage Bay in the north.

A unique benefit of nanoimprint lithography is the ability to pattern 3D structures, such as damascene interconnects and T-gates, in fewer steps than required for conventional lithography. This is achieved by building the T-shape into the protrusion on the template. Similarly, nanoimprint lithography can be used to replicate 3D structures created using Focused Ion Beam. Although the area that can be patterned using Focused Ion Beam is limited, it can be used, for example to imprint structures on the edge of optical fibers.

The site is located 4° south of the equator and 40° east of the Greenwich meridian, 10 km north of Mombasa Island, but within Mombasa municipality. It is about 600 m to 700 m inland from the coast. The quarry floor lies about above the water table, which interconnects with the seabed as is evident from the quarry well water level fluctuations that are coincidental with the ocean tides. It is excavated up to a depth of 12 m and is in the coastal and marine tropical climate.

Current FDTD modeling applications range from near-DC (ultralow-frequency geophysics involving the entire Earth- ionosphere waveguide) through microwaves (radar signature technology, antennas, wireless communications devices, digital interconnects, biomedical imaging/treatment) to visible light (photonic crystals, nanoplasmonics, solitons, and biophotonics). In 2006, an estimated 2,000 FDTD-related publications appeared in the science and engineering literature (see Popularity). As of 2013, there are at least 25 commercial/proprietary FDTD software vendors; 13 free-software/open-source-software FDTD projects; and 2 freeware/closed-source FDTD projects, some not for commercial use (see External links).

Certain data-center applications (such as large computer clusters) require the use of fiber-optic interconnects due to the distance limitations inherent in copper cabling. Typically, a network- oriented standard such as Ethernet or Fibre Channel suffices for these applications, but in some cases the overhead introduced by routable protocols is undesirable and a lower-level interconnect, such as InfiniBand, RapidIO, or NUMAlink is needed. Local-bus standards such as PCIe and HyperTransport can in principle be used for this purpose, but , solutions are only available from niche vendors such as Dolphin ICS.

Among the other improvements was a process-shrink to 0.5u, allowing the speed to be increased to 50 MHz (with plans for 66 and 100 MHz). The CPU was also superscalar and included 16 KB instruction and data caches, and a MMU for virtual memory support. Additional I/O links were added, with two dedicated to I/O and sixteen for interconnects, allowing for up to 65,536 CPUs in the hypercube. The channels operated at 100 Mbit/s, due to use of 2-bit parallel lines, instead of the serial lines used previously.

Nanowire lasers for ultrafast transmission of information in light pulses Semiconductor nanowire lasers are nano-scaled lasers that can be embedded on chips and constitute an advance for computing and information processing applications. Nanowire lasers are coherent light sources (single mode optical waveguides) as any other laser device, with the advantage of operating at the nanoscale. Built by molecular beam epitaxy, nanowire lasers offer the possibility for direct integration on silicon, and the construction of optical interconnects and data communication at the chip scale. Nanowire lasers are built from III–V semiconductor heterostructures.

In semiconductor manufacturing, a low-κ is a material with a small relative dielectric constant (κ, kappa) relative to silicon dioxide. Low-κ dielectric material implementation is one of several strategies used to allow continued scaling of microelectronic devices, colloquially referred to as extending Moore's law. In digital circuits, insulating dielectrics separate the conducting parts (wire interconnects and transistors) from one another. As components have scaled and transistors have gotten closer together, the insulating dielectrics have thinned to the point where charge build up and crosstalk adversely affect the performance of the device.

Recent trends in high-density interconnects have led to the use of copper pillar solder bumps (CPB) for CPU and GPU packaging.J. Kloeser and E. Weibach, “High-Performance Flip Chip Packages with Copper Pillar Bumping,” Global SMT & Packaging, May 2006. CPBs are an attractive replacement for traditional solder bumps because they provide a fixed stand-off independent of pitch. This is extremely important as most of the high-end products are underfilled and a smaller standoff may create difficulties in getting the underfill adhesive to flow under the die.

The game concept relies on there being several realities that may appear when the Illusion shatters: Metropolis, the original city which interconnects with all great cities; Inferno and its purgatories, where humans are held captive and tortured after death; and Gaia, which connects to nature and nature's destructive forces. The Underworld where strange people from lost worlds lives in the depth close to infinity. Limbo, the Dream World where Dream Princes create their kingdoms and dream wanderers explore tattered dreams close to Vortex (a place of chaos and creation).

Silicon is the material of choice for integrated circuits, and so electronic and silicon photonic components (such as optical interconnects) could be fabricated on the same chip. Unfortunately, silicon is a difficult lasing material to deal with, since it has certain properties which block lasing. However, recently teams have produced silicon lasers through methods such as fabricating the lasing material from silicon and other semiconductor materials, such as indium(III) phosphide or gallium(III) arsenide, materials which allow coherent light to be produced from silicon. These are called hybrid silicon laser.

Underneath the macroscopic (Circuit Level) and mesoscopic (Technology Computer Aided Design level) modelling of CNT interconnects, it is also important to consider the microscopic (Ab Initio level) modelling. Significant work has been carried out on the electronic, and thermal, modeling of CNTs. Band structure and molecular level simulation tools can be also found on nanoHUB. Further potential modeling improvements include the self-consistent simulation of the interaction between electronic and thermal transport in CNTs, but also in copper-CNT composite lines and CNT contacts with metals and other relevant materials.

For example, some valve amplifiers produce greater amounts of total harmonic distortion, but this type of distortion (2nd harmonic) is not as disturbing to the ear as the higher-order distortions produced by poorly designed transistor equipment. The validity of certain products is often questioned. These include accessories such as speaker wires utilizing exotic materials (such as oxygen-free copper) and construction geometries, cable stands for lifting them off the floor (as a way to control mechanically induced vibrations), connectors, sprays and other tweaks.Cables, Interconnects and Other Stuff – The Truth. Sound.westhost.com.

SDPs are commonly considered for the telco type environments as a core system which interconnects the customer's access and network infrastructure with the OSS systems and BSS systems. SDPs in this context are usually associated to a particular service regime such as mobile telephones or for converged services. SDPs are also considered in the context of very large transformation, convergence and integration programs which require a considerable budget. The difficulty in such projects is that there may be hundreds of thousands of design and implementation decisions to be made - once the architecture is agreed.

Instruments are being embedded into chips and utilized to validate circuit board designs. This sort of design validation can make use of a variety of embedded instruments such as bit error rate test (BERT) engines, BIST) for logic devices, margining engines, memory BIST, memory test, random pattern generators and a complete logic analyzer. Deployed in design validation applications, these embedded instruments may function inside the chip or across on-board chip-to-chip interconnects to validate the performance and functionality of a circuit board design before it moves into volume production.

Ferromex began operating on February 19, 1998, following the privatization of most of the government-owned railways by then President of Mexico Ernesto Zedillo Ponce de León. Ferromex operates more than of track and interconnects five major inland Mexican cities, five cities along the border with the United States, four seaports on the Pacific Ocean, and one more on the Gulf of Mexico. Currently, Grupo México owns 74% and Union Pacific Corporation owns 26% of the company. The Ferromex system operates 9,610 km of Ferromex tracks plus of Ferrosur tracks.

The city limits of Brighton and Howell were unaffected as well, as they received electricity from Consumers Energy via the Genoa-Latson 138 kV line which interconnects Detroit Edison and Consumers Energy. Television and radio stations were temporarily knocked off the air and water supplies were disrupted in Detroit due to the failure of electric pumps. Because of the loss of water pressure all water was required to be boiled before use until August 18. Several schools which had planned to begin the school year August 18 were closed until clean water was available.

A typical Manhattan wiring scheme (logic circuit is omitted) Manhattan wiring (also known as right-angle wiring) is a technique for laying out circuits in computer engineering. Inputs to a circuit (specifically, the interconnects from the inputs) are aligned into a grid, and the circuit "taps" (connects to) them perpendicularly. This may be done either virtually or physically. That is, it may be shown this way only in the documentation and the actual circuit may look nothing like that; or it may be laid out that way on the physical chip.

Cisco UCS blade servers The UCS product line was announced in March and first installed in September 2009, at the customer premises of Tutor Perini. The first customer purchase of UCS was by Fiserv, a financial services customer in Milwaukee, Wisconsin. The entire project was code named "California". The computing component of the UCS is available in two versions: the B-series (a powered chassis and full and/or half slot blade servers), and the C-series for 19-inch racks (that can be used with fabric interconnects).

ProLiant servers are separated into four main product lines - ML, DL, BL, SY, and Apollo - which generally denote form factor. The ProLiant ML line comprises tower-based servers (convertible to rack mount) with capacity for internal expansion of disks and interconnects, while the DL line comprises general purpose rack mount servers. The BL line comprises blade servers which fit within the HP BladeSystem, the SY comprises the Synergy Blades, and the Apollo line comprises servers for scale out and High Performance Computing environments. The MicroServer product line addresses small and home businesses.

An overworld is, in a broad sense, commonly an area within a video game that interconnects all its levels or locations. They are mostly common in role- playing games, though this does not exclude other video game genres, such as some platformers and strategy games. Overworlds generally feature a top-down view or a third-person perspective of the fictional world within the game. It often contains varied terrain (including caves, mountains, forests, and bodies of water) and a collection of towns and other locations (most commonly dungeons or levels).

It is one of the most important highways in Brazil and one of the busiest, with the highest traffic segment between São Paulo and Campinas, the first to be built. It is duplicated, containing sections with additional tracks and marginal clues. They have heavy traffic, especially of trucks. It is considered, together with the Bandeirantes Highway and Washington Luis Highway, the country's largest financial corridor, since it interconnects some of the state's metropolitan regions such as São Paulo, Campinas and Ribeirão Preto, as well as the Jundiaí Urban Aglomerate and the Central Administrative Region.

In the 1980s and 1990s, the station devoted its resources primarily to music, increased its power to 100 watts, increased its hours of operation, and changed its frequency to its current dial position. In the fall of 2004, WDUB began a second era of its history as the station began streaming its on-air content worldwide. During the summer of 2005, the station went through an entire digital upgrade of the main sound board, studio interconnects, catalog, recording, and record keeping functions. Over 100 DJs volunteered to broadcast about one show per week.

Accessed February 9, 2009 setting of the +3 dB build up, whereas no build-up would require a 120 degree offset. This setting was most commonly used because of its robustness against polarity reversal of audio interconnects down the chain, which can affect the resulting audio when downmixed to mono. Information that is not common to both channels is entirely unaffected as there is no offset phase wave to cancel with. The genius of Holzer's design is in how it overcame the limitations of a single phase shift network to shift the entire audio bandwidth.

A Fuzz Button is a high performance electrical connection material used to connect two parts of an electrical circuit together, for example an IC to a PCB or two PCBs to each other. Fuzz Buttons consist of a single strand of gold-plated beryllium copper wire compressed into a dense, sponge-like cylindrical shape. Their diameter can range from a few tenths of a millimetre to a millimetre. The term "Fuzz Button" was originally conceived and trademarked by Tecknit, but is now owned by a Denver-based company called Custom Interconnects.

The POWER3 began its life as "PowerPC 630", a successor of the commercially unsuccessful PowerPC 620. It used a combination of the POWER2 ISA and the 32/64-bit PowerPC ISA set with support for SMP and single-chip implementation. It was used to great extent in IBM's RS/6000 computers, while the second generation version, the POWER3-II, was the first commercially available processor from IBM using copper interconnects. The POWER3 was the last processor to use a POWER instruction set; all subsequent models used some version of the PowerPC instruction set.

NORDUnet interconnects the Nordic national research and education networks and connects them to the worldwide network for research and education and to the general purpose Internet. NORDUnet provides its services by a combination of leased lines and Internet services provided by other international operators. NORDUnet has peering in multiple important internet exchange sites outside the Nordics, such as Amsterdam, Chicago, Frankfurt, London, Miami and New York. In addition to the basic Internet service NORDUnet operates information services and provides USENET NetNews and Multicast connectivity to the Nordic national networks.

A gate array is a prefabricated silicon chip with most transistors having no predetermined function. These transistors can be connected by metal layers to form standard NAND or NOR logic gates. These logic gates can then be further interconnected into a complete circuit on the same or later metal layers. Creation of a circuit with a specified function is accomplished by adding this final layer or layers of metal interconnects to the chip late in the manufacturing process, allowing the function of the chip to be customized as desired.

Automoblox is a brand name of a wooden car construction toy designed by Patrick Calello and produced by Automoblox Company, LLC of Cranford, New Jersey. The toy consists of wooden car body sections with patented plastic interconnects, polycarbonate wheels and rubber tires, plastic passengers and polycarbonate screens. Each car can be disassembled into its component parts and re-assembled, parts from different cars can be combined to let children design their own models. It is very commonly used to teach cad They have also been noted for their extensive use in the PLTW program.

Rodovia Santos Dumont (officially designated SP-075) is a highway in the state of São Paulo, Brazil. It runs in a North-South direction and interconnects the cities of Campinas, Indaiatuba, Salto, Itu and Sorocaba, crossing with two other major highways, Rodovia Castelo Branco, nearby Sorocaba, and the Rodovia dos Bandeirantes nearby Campinas, thus forming a vertex of the Macrometropolitan Highway Ring of São Paulo. At the km 66 of Rodovia Santos Dumont there is the Viracopos Airport. The highway honours the Brazilian inventor Alberto Santos-Dumont, considered the "father of aviation".

SIWs are promising structures that can be used in complex microwave systems as interconnects, filters, etc. However, a problem may arise: the connection of the SIWs with other kinds of transmission lines (TL), mainly microstrip, coplanar and coaxial cable. The goal of such transitions between two different topologies of TL is to excite the correct transmission mode in the SIW cavity with the minimum loss of power and on the broadest possible frequency range. Rapidly after the presentation of the concept of SIW by Ke Wu, two different transitions were mainly used.

Global journalism is journalism that interconnects the world into a global public sphere. Global journalism is a news style that encompasses a global outlook and reports on issues that transcend national boundaries, such as climate change. It focuses on news that is transnational, considering issues that affect the relationships between multiple nation states and regions. Global journalism is not to be confused with foreign reporting, which is reporting on foreign issues within a domestic context and using a domestic outlook that does not involve finding commonality between multiple world regions.

Opte Project visualization of routing paths through a portion of the Internet. The connections and pathways of the internet could be seen as the pathways of neurons and synapses in a global brain The global brain is a neuroscience- inspired and futurological vision of the planetary information and communications technology network that interconnects all humans and their technological artifacts. As this network stores ever more information, takes over ever more functions of coordination and communication from traditional organizations, and becomes increasingly intelligent, it increasingly plays the role of a brain for the planet Earth.

Park Electrochemical Corp, now called the Park Aerospace Corp, is a Melville, New York-based materials manufacturer for the telecommunications, Internet infrastructure, high-end computing, and aerospace industries. It produces high-technology digital and radio frequency(RF)/microwave printed circuit material products, composite materials. Its printed circuit materials are used for complex multilayer printed circuit boards and other electronic interconnection systems, such as multilayer back-planes, wireless packages, high-speed/low-loss multilayers, and high density interconnects (HDIs). Its core capabilities are polymer chemistry formulation and coating technology.

Even though the z10 processor has on-die facilities for symmetric multiprocessing (SMP), there is a dedicated companion chip called the SMP Hub Chip or Storage Control (SC) that adds 24 MB off-die L3 cache and lets it communicate with other z10 processors and Hub Chips at 48 GB/s. The Hub Chip consists of 1.6 billion transistors and measures 20.8×21.4 mm, with 7984 interconnects. The design allows each processor to share cache across two Hub Chips, for a potential total of 48 MB of shared L3 cache.

Among those removed were any instruction that moved data between the 6800's two accumulators, as well as a number of branch instructions inspired by the PDP-11 like the ability to directly compare two numeric values. The 6502 used a simpler system that handled comparisons by performing math on the accumulator and then examining result flags. The chip's high-level design had to be turned into drawings of transistors and interconnects. At MOS Technology, the "layout" was a very manual process done with color pencils and vellum paper.

Voxbone is a communication as a service (CaaS) company headquartered in Brussels, with offices in San Francisco, Austin, London and Iași. Voxbone enables telephony applications such as conferencing and Call centers to send and receive phone calls, text messages and faxes in 65+ countries, with the company’s services accessed through a web portal or REST API. Voxbone's services are delivered over a private IP network that interconnects with local phone networks in the countries where it operates. Voxbone customers include Skype, Dialpad, Zoom, 8x8, Deutsche Telekom, Telefonica, NTT, Level(3) and Orange.

Nanowire lasers for ultrafast transmission of information in light pulses Nanowire lasers are nano-scaled lasers with potential as optical interconnects and optical data communication on chip. Nanowire lasers are built from III–V semiconductor heterostructures, the high refractive index allows for low optical loss in the nanowire core. Nanowire lasers are subwavelength lasers of only a few hundred nanometers. Nanowire lasers are Fabry–Perot resonator cavities defined by the end facets of the wire with high-reflectivity, recent developments have demonstrated repetition rates greater than 200 GHz offering possibilities for optical chip level communications.

Because of their small size, bead probes do not affect the signal quality of the signals transferring within the PCB trace.A New Probing Technique for High-Speed/High-Density Printed Circuit Boards by Kenneth P. Parker of Agilent TechnologiesApplying a New In-Circuit Probing Technique for High-Speed/High Density Printed Circuit Boards to a Real-Life Product by Chris Jacobsen and Kevin Wible of Agilent Technologies This is especially useful in high speed input/output (HSIO) interconnects, where a standard test pad would interfere with the signal.

High-powered power electronics can also be used to convert AC power to DC power for long distance transmission in a system known as HVDC. HVDC is used because it proves to be more economical than similar high voltage AC systems for very long distances (hundreds to thousands of kilometres). HVDC is also desirable for interconnects because it allows frequency independence thus improving system stability. Power electronics are also essential for any power source that is required to produce an AC output but that by its nature produces a DC output.

The exterior of the hall is ornately decorated and provides the main entrances to the complex. The hall contains a mixture of stalls and interconnects with the 1976 and 1981 halls via the 1875 Hall. In the centre of the hall is the Market Clock, albeit a replacement for the original which now stands in Oakwood. The front of the hall is lined with shops which face onto Vicar Lane, while the upper floors which run in a 'U' shape along the northern, southern and western sides, contain private offices.

The town lies on the southern railway, has 2 train stations of ÖBB ("Mitterdorf - Veitsch" or "Wartberg im Mürztal") and is accessible on the Semmering Schnellstraße S 6 (road exit "Mitterdorf"). The town can also be reached via the L 102 (Veitscherstraße) from Turnau or via the L 118 (Semmering Begleitstraße) from Kindberg and Krieglach. Since 2016-07-18, a bus of the Mürztaler transport company is run from Kapfenberg and interconnects all 3 districts: : Route 85 (Pretal-) Groß-Veitsch - (Dorf-Veitsch-) Niederaigen - Mitterdorf im Mürztal - Wartberg im Mürztal station.

In 2002, Abushagur was the founding director of the Ph.D. Program in Microsystems Engineering at the Rochester Institute of Technology (RIT). In early 2007, he led the effort to establish a satellite campus in the Middle East and drove the negotiations between RIT and the Emirati government's Dubai Silicon Oasis in Dubai, UAE. The satellite campus was opened in fall 2008 and Abushagur became the founding president of RIT Dubai. Abushagur's key research areas are nanophotonics, plasmonics, photonic microsystems, adaptive signal processing, optical MEMS, optical computing, optical communications, optical interconnects and fiber sensors.

The Australia Singapore Cable (ASC) is a 4,600 km fibre-optic submarine communications cable that entered service in September 2018, linking Australia and Singapore via Christmas Island and Indonesia. ASC is owned and operated by Vocus Communications and interconnects with the Vocus Australian domestic optical fibre network at the Australian landing site in Perth. The ASC consists of four fibre pairs and, at launch, had a total design capacity of 40 terabits per second. In 2019 the cable was upgraded to a total design capacity of 60 terabits per second.

The AMRES network infrastructure consists of three components. The access network connections institutes to the AMRES points of presence (PoPs), which are managed and controlled by the AMRES service centres. The backbone network interconnects the AMRES PoPs, which are located in the service centres in Belgrade, Novi Sad, Niš and Kragujevac, and in Subotica, Sombor, Zrenjanin, Šabac, Pančevo, Valjevo, Užice, Čačak, Kraljevo, Kruševac, Leskovac, Vranje, Bor, Pirot, Novi Pazar and Kosovska Mitrovica. Finally, there are external links to national research networks in other countries, commercial Internet service providers and partner institutes.

The PSN comprises a core network, the Government Conveyancing Network or GCN provided by GCN Service Providers or GCNSPs. The GCN interconnects multiple operator networks, termed Direct Network Service Providers or DNSPs. Subscriber organisations contract to a connection from a local participating DNSP, connect via that to GCN and hence onwards to other interconnected networks and services. The GCN network is entirely based on IPv4 and MPLS and the GCNSPs are not currently mandated to provide IPv6, though they should have a roadmap to implementing it if and when required.

The IBM Intelligent Cluster was a cluster solution for high-performance computing composed primarily of IBM System x, IBM BladeCenter and IBM System Storage components integrated with network switches from various vendors and optional high-performance InfiniBand interconnects. The solution was previously known as the IBM System Cluster 1350, and before that eServer Cluster 1350 or simply e1350. Roughly twice a year the solution components were updated to include the then-current products from IBM and other vendors. The solution was predated by the eServer Cluster 1300 (or e1300) based on then-current Pentium III processors, which was introduced in November 2001.

Brooks' 6th album, No One Travels Alone, accomplished a first in modern songwriting: borrowing from the Elizabethan sonneteers, the album fulfils a ‘corona' of songs. Corona form interconnects each song by first and last lines; the last line of the first song becomes the first line of the following song, etc…until the final song completes a circle, or corona. In accord with the album's central theme of digital and atomic connectivity, Brooks' 2018 set of songs are interconnected, as are we; thus it is: ‘No One Travels Alone.’ NPR included the album among its esteemed Best of 2018 list.

An epicyclic differential is at the heart of the Toyota Prius automotive drive train, where it interconnects the engine, motor-generators, and the drive wheels (which have a second differential for splitting torque as usual). It has the advantage of being relatively compact along the length of its axis (that is, the sun gear shaft). Epicyclic gears are also called planetary gears because the axes of the planet gears revolve around the common axis of the sun and ring gears that they mesh with and roll between. In the image, the yellow shaft carries the sun gear which is almost hidden.

Structured ASIC is an intermediate technology between ASIC and FPGA, offering high performance, a characteristic of ASIC, and low NRE cost, a characteristic of FPGA. Using Structured ASIC allows products to be introduced quickly to market, to have lower cost and to be designed with ease. In a FPGA, interconnects and logic blocks are programmable after fabrication, offering high flexibility of design and ease of debugging in prototyping. However, the capability of FPGAs to implement large circuits is limited, in both size and speed, due to complexity in programmable routing, and significant space occupied by programming elements, e.g.

Above the front door there is a relatively small stained glass window. The interior, Dr. Godoy installed his home office on the ground floor where the above-ground cellar used to be, connected to the rear of the house where the kitchen, annex, and backyard are located. On the second floor, a hallway interconnects the four bedrooms and the bathroom. On the front part of the house on the second floor was located the drawing room, and to the rear the dining room, smoking room, and music room, all connected to a veranda with ornate iron balustrade.

Ankabut is currently owned by KUSTAR and operates with a Chief Executive Officer and a professional staff. Ankabut interconnects universities with a 10G backbone and 1G access links. Ankabut also provides international connectivity of 155 Mbit/s to its members via Internet2. It enables a closed community network that allows the transfer of real-time services such as converged IM, voice and video communication, time-critical services such as grid computing interconnect (cloud computing), non-real time services such as e-learning, email, library interconnect, off-site disaster recovery, global federated single-sign-on, and Wi-Fi networking to name a few.

The Rodovia Luiz de Queirós (official designation SP-304) is a highway in the state of São Paulo, Brazil. It interconnects the cities of Americana, by the Anhanguera Highway (SP-330) and Piracicaba, serving also the city of Santa Bárbara d'Oeste, at which level crosses with the Rodovia dos Bandeirantes (SP-348). It is approximately 45 km long and double-lane. It has been named in honour of Luís Vicente de Sousa Queirós, a farmer and agriculturist who founded in Piracicaba the first practical school of agriculture in the state, which later became a college of the University of São Paulo.

Each computing element incorporates a two-dimensional memory array for storing LUTs, a small controller for sequencing evaluation of sub-functions and a set of temporary registers to hold the intermediate outputs from individual partitions. A fast, local routing framework inside each computing block generates the address for LUT access. Multiple such computing elements can be spatially connected using FPGA-like programmable interconnect architecture to enable mapping of large functions. The local time-multiplexed execution inside the computing elements can drastically reduce the requirement of programmable interconnects leading to large improvement in energy-delay product and better scalability of performance across technology generations.

Electron transport can go over long nanotube lengths, 1 μm, enabling CNTs to carry very high currents (i.e. up to a current density of 109 A∙cm−2) with essentially no heating due to nearly one dimensional electronic structure. Despite the current saturation in CNTs at high fields, the mitigation of such effects is possible due to encapsulated nanowires. Carbon nanotubes for interconnects application in Integrated chips have been studied since 2001, however the extremely attractive performances of individual tubes are difficult to reach when they are assembled in large bundles necessary to make real via or lines in integrated chips.

However, Kira allegedly continued to treat Asano harshly because he was upset that the latter had not emulated his companion. Finally, Kira insulted Asano, calling him a country boor with no manners, and Asano could restrain himself no longer. At the Matsu no Ōrōka, the main grand corridor that interconnects the Shiro-shoin (白書院) and the Ōhiroma of the Honmaru Goten (本丸御殿) residence, Asano lost his temper and attacked Kira with a dagger, wounding him in the face with his first strike; his second missed and hit a pillar. Guards then quickly separated them.

Each module is typically a printed circuit board with a front panel, similar to a blade PC. Modules are physically about 14 inches by 15 inches, and may occupy one or more adjacent slots. Small systems may consist of only one crate segment, or a small number of independent crate segments connected directly to a central computer rather than using segment interconnects. FASTBUS uses the emitter coupled logic (ECL) electrical standard, which allows higher speed than TTL and generates less switching noise. Segments implement a 32-bit multiplexed address/data bus, which allows a larger address space than CAMAC.

A viable option toward the design and development of these next generation architectures is to leverage existing commercial protocols capable of accommodating high levels of data transfer. In 2012, RapidIO was selected by the Next Generation Spacecraft Interconnect Standard (NGSIS) working group to serve as the foundation for standard communication interconnects to be used in spacecraft. The NGSIS is an umbrella standards effort that includes RapidIO Version 3.1 development, and a box level hardware standards effort under VITA 78 called SpaceVPX or High ReliabilityVPX. The NGSIS requirements committee developed extensive requirements criteria with 47 different elements for the NGSIS interconnect.

Before about 1990 CMP was viewed as too "dirty" to be included in high-precision fabrication processes, since abrasion tends to create particles and the abrasives themselves are not without impurities. Since that time, the integrated circuit industry has moved from aluminum to copper conductors. This required the development of an additive patterning process, which relies on the unique abilities of CMP to remove material in a planar and uniform fashion and to stop repeatably at the interface between copper and oxide insulating layers (see Copper interconnects for details). Adoption of this process has made CMP processing much more widespread.

Yehia Massoud is the Dean of the School of Systems and Enterprises at Stevens Institute of Technology. As the dean of school, SSE has seen a record increase in research awards and peer-reviewed publications, as well as a significant increase in student enrollment. He was named Fellow of the Institute of Electrical and Electronics Engineers (IEEE) in 2015 for contributions to the modeling and design of nanoscale interconnects. Massoud has had significant progressive academic leadership and has been involved in forging and building effective partnerships with numerous academic and industrial institutions, and international organizations, and governmental funding agencies.

CERNET is also the experiment platform for China to proceed with study on next generation of Internet applications, and has played a major role in the China Next Generation Internet effort. Relying on current network facilities and technical competence, CERNET has set up the IPv6, an experiment platform with nationwide coverage. In 1998, CERNET joined 6bone, an experimental IP-based network of next generation, and became a backbone member of it in November. CERNET is the first in China that interconnects with Internet2, the next generation of Internet, providing its users with an easy access to Internet2.

Lam Research Corporation is an American corporation that engages in the design, manufacture, marketing, and service of semiconductor processing equipment used in the fabrication of integrated circuits. Its products are used primarily in front-end wafer processing, which involves the steps that create the active components of semiconductor devices (transistors, capacitors) and their wiring (interconnects). The company also builds equipment for back-end wafer-level packaging (WLP), and for related manufacturing markets such as for microelectromechanical systems (MEMS). Lam Research was founded in 1980 by Dr. David K. Lam and is headquartered in Fremont, California, in the Silicon Valley.

Oracle NoSQL Database supports multiple zones to intelligently allocate replication of processes and data, in order to improve reliability during hardware, network and power-related failure modes. The two types of zones are: primary zones that contain nodes that can serve as masters or replicas and are typically connected by fast interconnects. Secondary zones contain nodes that can only serve as replicas. Secondary zones can be used to provide low latency read access to data at a distant location, or to offload read-only workloads such as analytics, report generation and data exchange for improved workload management.

While LLT module on one node interacts with every other node in the cluster, the communication is always 1:1 between individual nodes. So in case if certain information needs to be transmitted across all cluster nodes assuming a 6 nodes cluster, 6 different packets are sent across targeted to individual machine interconnects. GAB determines which machines are part of cluster and minimum number of nodes that need to be present and working to form the cluster ( this minimum number is called seed number ). GAB acts as an abstract layer upon which other cluster services can be plugged in.

In August 2014, GameFly announced through a statement on its website, that AtGames had acquired its online games distribution service. AtGames relaunched this service under the name Direct2Drive in late 2014. In December 2014, it was announced that through one of its subsidiaries, Silver Lining Systems, AtGames had purchased the IP to Calxeda, is using the technology to build fabric interconnects for A1100-powered servers. In 2017, the company released the Sega Genesis Flashback, based on Sega’s Genesis console. It had wireless controllers and had a cartridge slot for the console’s game’s and slots for the console’s controllers.

The game takes place in 2145, when the Tirmatians, intelligent alien beings from planet Tirmat, discover a sort of space-time portal -or "rift", as it is called in the game- that interconnects their homeworld with Earth. Meanwhile, human astronomers discover the same rift, but are not aware of the existence of Tirmat. They also discover that the rift is growing in a geometric rate. As they try to study it, the Tirmatians launch an exploratory probe, named "Torquemada II", in order to find a planet similar to Tirmat; the probe soon finds Earth and sends information back to Tirmat.

Virtual Hospital interconnects villages in the developing world with their main county hospitals and hospitals in the West using Telemedicine. Virtual Hospital is based on a traditional healthcare referral system where the patients’ medical information is collected by e-clinics in rural third world communities using a computer, or mobile phone and sent to a general medical practitioner (GP) based at the Virtual Hospital (Hub). The GP at the Hub then either provides a diagnosis, or refers the patient to the relevant Virtual Hospital Department where specialist consultants across the world are linked together through the Internet.

In addition to naming the mythic creature, longma "dragon horse" can mean "an eminent person" and occurs in the four-character idiom longma jingshen "vigorous spirit in old age". Longma interconnects traditional Chinese beliefs about dragons and horses. An early example comes from the Zhouli "Rites of Zhou" (), which differentiates names for horses of different heights, measured in the chi "Chinese foot" (historically around 23-33 centimeters, see Chinese units of measurement). Horses up to 8 feet tall are called long "dragon", those up to 7 feet are called lai , and those up to 6 feet are called ma "horse".

A PCI-X system allows both MSI- mode interrupts and legacy INTx interrupts to be used simultaneously (though not by the same function.) The lack of registered I/Os limited PCI to a maximum frequency of 66 MHz. PCI-X I/Os are registered to the PCI clock, usually through means of a PLL to actively control I/O delay the bus pins. The improvement in setup time allows an increase in frequency to 133 MHz. Some devices, most notably Gigabit Ethernet cards, SCSI controllers (Fibre Channel and Ultra320), and cluster interconnects could by themselves saturate the PCI bus's 133 MB/s bandwidth.

The messages can be sent by a number of communication mechanisms, such as TCP/IP over Ethernet, or specialized high-speed interconnects such as Myrinet and Supercomputer Interconnect. Serial sections of the program are implemented by identical computation on all nodes rather than computing the result on one node and sending it to the others. Nowadays, the programmer is isolated from the details of the message passing by standard interfaces, such as PVM and MPI. Distributed memory is the programming style used on parallel supercomputers from homegrown Beowulf clusters to the largest clusters on the Teragrid.

In November 2017, Link Motion joined the IETA3 APPSTACLE project which aims to include an open and secure car-to-cloud and cloud-to-car platform that interconnects a wide range of cars and transport vehicles to the cloud via open in-car and Internet connection, taking advantage of 5G opportunities. In December 2017, a partnership with Chery was announced to develop a connected car platform. In January 2018, Link Motion was selected as the platform vendor for pure electric buses in the city of Qingdao for public transportation vehicles by extending their existing passenger car platform.

The plant processes 16 thousand tons of coal daily. Coal is oxidized to coal gas, which is then converted from a mixture of carbon monoxide, carbon dioxide and hydrogen to methane, by hydrogenation over a nickel catalyst. The synthetic natural gas (95% methane, 975 BTU per cubic foot) is pipelined to the Northern Border Pipeline which transports gas from Canada, Montana and North Dakota to the Ventura, Iowa area, where the pipeline interconnects with many pipelines supplying the eastern United States. The Dakota Gasification Company is a subsidiary of the Basin Electric Power Cooperative which is located in Bismarck, North Dakota.

Original Earth Simulator processing rack The SX-6 is a supercomputer built by NEC Corporation that debuted in 2001; the SX-6 was sold under license by Cray Inc. in the U.S. Each SX-6 single-node system contains up to eight vector processors, which share up to 64 GB of computer memory. The SX-6 processor is a single chip implementation containing a vector processor unit and a scalar processor fabricated in a 0.15 μm CMOS process with copper interconnects, whereas the SX-5 was a multi-chip implementation. The Earth Simulator is based on the SX-6 architecture.

The Munich tramway is the tramway network for the city of Munich in Germany. Today it is operated by the municipally owned Münchner Verkehrsgesellschaft (the Munich Transport Company, or MVG) and is known officially and colloquially as the Tram. Previous operators have included Société Anonyme des Tramways de Munich, the Münchner Trambahn-Aktiengesellschaft, the Städtische Straßenbahnen and the Straßenbahn München. The tram network interconnects with the MVG's bus network, the Munich U-Bahn and the Munich S-Bahn, all of which use a common tariff as part of the Münchner Verkehrs- und Tarifverbund (Munich Transport and Tariff Association, or MVV) transit area.

Mass interconnect systems act as the connector interface between test instruments (PXI, VXI, LXI, GPIB, SCXI, & PCI) and devices/units under test (D/UUT) and are most often used in defense, aerospace, automotive, manufacturing, and other applications. By mating a receiver on the tester side with an interchangeable test adapter (ITA) on the UUT, a mass interconnect enables the entire system to mate together at one time. Mass interconnect systems are available in multiple sizes and configurations to accommodate virtually any testing requirement. Companies that manufacture mass interconnects include Virginia Panel Corporation and MAC Panel Company.

Active messages are communications primitive for exploiting the full performance and flexibility of modern computer interconnects. They are often classified as one of the three main types of distributed memory programming, the other two being data parallel and message passing. The view is that Active Messages are actually a lower-level mechanism that can be used to implement data parallel or message passing efficiently. The basic idea is that each message has a header containing the address or index of a userspace handler to be executed upon message arrival, with the contents of the message passed as an argument to the handler.

Due to the resistance of the interconnects constituting the network, there is a voltage drop across the network, commonly referred to as the IR-drop. The package supplies currents to the pads of the power grid either by means of package leads in wire-bond chips or through C4 bump arrays in flip chip technology. Although the resistance of package is quite small, the inductance of package leads is significant which causes a voltage drop at the pad locations due to the time varying current drawn by the devices on die. This voltage drop is referred to as the di/dt-drop.

Key among these was the use of the Cray-developed HIPPI computer bus and details of the interconnects used in the T3 series. SGI's long-term strategy was to merge its high-end server line with Cray's product lines in two phases, code-named SN1 and SN2 (SN standing for "Scalable Node"). The SN1 was intended to replace the T3E and SGI Origin 2000 systems and later became the SN-MIPS or SGI Origin 3000 architecture. The SN2 was originally intended to unify all high- end/supercomputer product lines including the T90 into a single architecture.

Singularity is able to support natively high-performance interconnects, such as InfiniBand and Intel Omni-Path Architecture (OPA). Similar to the support for InfiniBand and Intel OPA devices, Singularity can support any PCIe-attached device within the compute node, such as graphic accelerators. Singularity also has native support for Open MPI library by utilizing a hybrid MPI container approach where OpenMPI exists both inside and outside the container. These features make Singularity increasingly useful in areas such as Machine learning, Deep learning and most data-intensive workloads where the applications benefit from the high bandwidth and low latency characteristics of these technologies.

This unit is useful because it scales with clock frequency and thus allows relatively slow interconnects such as T1 to be compared to higher-speed internet backbone links such as OC-192. Absolute units such as picoseconds are more common in microprocessor applications. Units of degrees and radians are also used. In the normal distribution one standard deviation from the mean (dark blue) accounts for about 68% of the set, while two standard deviations from the mean (medium and dark blue) account for about 95% and three standard deviations (light, medium, and dark blue) account for about 99.7%.

Therefore, the HTC field is more interested in how many jobs can be completed over a long period of time instead of how fast. As an alternative definition, the European Grid Infrastructure defines HTC as “a computing paradigm that focuses on the efficient execution of a large number of loosely-coupled tasks”, while HPC systems tend to focus on tightly coupled parallel jobs, and as such they must execute within a particular site with low-latency interconnects. Conversely, HTC systems are independent, sequential jobs that can be individually scheduled on many different computing resources across multiple administrative boundaries. HTC systems achieve this using various grid computing technologies and techniques.

Various forms of fast RAM and, eventually, basic content addressable memory (CAM) were used to speed lookup. CAM, while useful in layer 2 switches that needed to look up a relatively small number of fixed- length MAC addresses, had limited utility with IP addresses having variable- length routing prefixes (see Classless Inter-Domain Routing). Ternary CAM (CAM), while expensive, lends itself to variable-length prefix lookups.Efficient Mapping of Range Classifier into Ternary-CAM, IEEE Symposium on High-Speed Interconnects, H. Liu,August 2002 One of the challenges of forwarder lookup design is to minimize the amount of specialized memory needed, and, increasingly, to minimize the power consumed by memory.

Infinity Fabric (IF) is a superset of HyperTransport announced by AMD in 2016 as an interconnect for its GPUs and CPUs. It is also usable as interchip Interconnect for communication between CPUs and GPUs (for Heterogeneous System Architecture), an arrangement known as Infinity Architecture. The company said the Infinity Fabric would scale from 30 GB/s to 512 GB/s, and be used in the Zen-based CPUs and Vega GPUs which were subsequently released in 2017. The "SDF" data interconnects are run at the same frequency as the DRAM memory clock (MEMCLK), a decision made to remove the latency caused by different clock speeds.

Criticisms usually focus on claims around so-called "tweaks" and accessories beyond the core source, amplification, and speaker products. Examples of these accessories include speaker cables, component interconnects, stones, cones, CD markers, and power cables or conditioners. There is disagreement on how equipment testing should be conducted and as to its utility. Audiophile publications frequently describe differences in quality which are not detected by standard audio system measurements and double blind testing, claiming that they perceive differences in audio quality which cannot be measured by current instrumentation, and cannot be detected by listeners if listening conditions are controlled, but without providing an explanation for those claims.

An effective way of reducing the impact of the PI architecture in FPGA is to place small LUTs in close proximity (referred as clusters) and to allow intra- cluster communication using local interconnects. Due to the benefits of a clustered FPGA architecture, major FPGA vendors have incorporated it in their commercial products.Xilinx CorporationAltera Corporation Investigations have also been made to reduce the overhead due to PI in fine-grained FPGAs by mapping larger multi-input multi-output LUTs to embedded memory blocks. Although it follows a similar spatial computing model, part of the logic functions are implemented using embedded memory blocks while the remaining part is realized using smaller LUTs.

Indeed, even with the CNTs, which are strongly densified and spun, low conductance remains a problem. However, a recent paper shows that a one-decade improvement on the conductivity may be gained just by high-pressure densification of the CNT. In spite of the development of high-density CNT material the state of the art of integrated lines is still far from the 1013 cm−2 conducting walls requested by the International Technology Roadmap for Semiconductors. Nevertheless, macroscopic assemblies with diameters of tens of microns consisting of double- walled CNTs or single-walled carbon nanotubes have experimental resistivity performances of 15 μΩcm after doping, demonstrating the potential of CNTs for interconnects.

Second Avenue exchange, NYC, site of the 1975 New York Telephone Exchange fire. The central exchange, due to the system's design, is almost always a single point of failure for local calls. As the capacity of individual switches and the optical fibre which interconnects them increases, potential disruption caused by destruction of one local office will only be magnified. Multiple fibre connections can be used to provide redundancy to voice and data connections between switching centres, but careful network design is required to avoid situations where a main fibre and its backup both go through the same damaged central office as a potential common mode failure.

The CFP transceiver is specified by a multi-source agreement (MSA) among competing manufacturers. The CFP was designed after the small form-factor pluggable transceiver (SFP) interface, but is significantly larger to support 100 Gbit/s. While the electrical connection of a CFP uses lanes in each direction (RX, TX), the optical connection can support both and variants of 100 Gbit/s interconnects (typically referred to as 100GBASE-SR10 in 100 meter MMF, 100GBASE-LR10 and 100GBASE-LR4 in 10 km SMF reach, and 100GBASE- ER10 and 100GBASE-ER4 in 40 km SMF reach respectively.) In March 2009, Santur Corporation demonstrated a 100 Gigabit pluggable CFP transceiver prototype.

One of the traits of Luxman equipment from this era is the quality and warmth of vacuum tube sound, paired with powerful solid-state electronics and often beautiful, minimalist aesthetic designs. Preamps and power amps such as the Luxman C-05 and M-05, with their champagne gold finish, high-calibre electrical designs (pure copper interconnects, Class A amp design, separately powered channels with dual AC cables, copper-plated chassis), beautiful sound, and superior rock-solid build became the dream of audiophiles worldwide. An engineer by the name of Atsushi Miura married Mari Yoshikawa (Mr. K. Yoshikawa's eldest daughter) and became a part of the founding 'Luxman' family.

A K computer blade featuring four SPARC64 VIIIfx processors (under the larger heat exchangers) right The SPARC64 VIIIfx (Venus) is an eight-core processor based on the SPARC64 VII designed for high- performance computing (HPC). As a result, the VIIIfx did not succeed the VII, but existed concurrently with it. It consists of 760 million transistors, measures 22.7 mm by 22.6 (513.02 mm2;), is fabricated in Fujitu's 45 nm CMOS process with copper interconnects, and has 1,271 I/O pins. The VIIIfx has a peak performance is 128 GFLOPS and a typical power consumption of 58 W at 30 °C for an efficiency of 2.2 GFLOPS/W.

The history of the Quarantine Station, which is well illustrated by its buildings, sites, landscapes and the functions that took place there, interconnects with a number of key themes in NSW's history. The demands of quarantine, and the spotlight this cast on health standards, forced improvements in the conditions experienced by immigrants travelling to NSW, through the nineteenth century in particular. The procedures established for the quarantine of inbound shipping set the foundation for responding to the various local smallpox, plague and influenza epidemics up until the 1920s. The Quarantine Station also provided a safe haven to which the ill could be removed and treated.

This increased the physical memory that is theoretically addressable by the CPU from 4 GB to 64 GB. In the first processors that supported PAE, support for larger physical addresses is evident in their package pinout, with address pin designations going up to A35 instead of stopping at A31. Later processor families use interconnects such as Hypertransport or QuickPath Interconnect, which lack dedicated memory address signals, so this relationship is less apparent. The 32-bit size of the virtual address is not changed, so regular application software continues to use instructions with 32-bit addresses and (in a flat memory model) is limited to 4 gigabytes of virtual address space.

As some interconnects fail before others, the circuit exhibits seemingly random errors, which may be indistinguishable from other failure mechanisms (such as electrostatic discharge damage). In a laboratory setting, electromigration failure is readily imaged with an electron microscope, as interconnect erosion leaves telltale visual markers on the metal layers of the IC. With increasing miniaturization, the probability of failure due to electromigration increases in VLSI and ULSI circuits because both the power density and the current density increase. Specifically, line widths will continue to decrease over time, as will wire cross-sectional areas. Currents are also reduced due to lower supply voltages and shrinking gate capacitances.

Access to this cache by each core is arbitrated by the on-die controller and the 1 MB of secondary cache tags also resides on-die as SRAM and is protected by ECC. The PA-8800 used the same front side bus as the McKinley Itanium microprocessor, which yields 6.4 GB/s of bandwidth, and is compatible with HP's Itanium chipsets such as the zx1. It consisted of 300 million transistors, of which 25 million were for logic, on a 23.6 mm by 15.5 mm (365.8 mm2) die. It was fabricated by IBM in 0.13 µm SOI process with copper interconnects and low-κ dielectric.

The typical digital propagation delay of a resistive wire is about half of R times C; since both R and C are proportional to wire length, the delay scales as the square of wire length. Charge spreads by diffusion in such a wire, as explained by Lord Kelvin in the mid nineteenth century. Until Heaviside discovered that Maxwell's equations imply wave propagation when sufficient inductance is in the circuit, this square diffusion relationship was thought to provide a fundamental limit to the improvement of long-distance telegraph cables. That old analysis was superseded in the telegraph domain, but remains relevant for long on-chip interconnects.

Such hybrid optical/electronic interconnects promise better performance even with larger designs. Optics has widespread use in long-distance communications; still it has not yet been widely used in chip-to-chip or on-chip interconnections because they (in centimeter or micrometer range) are not yet industry-manufacturable owing to costlier technology and lack of fully mature technologies. As optical interconnections move from computer network applications to chip level interconnections, new requirements for high connection density and alignment reliability have become as critical for the effective utilization of these links. There are still many materials, fabrication, and packaging challenges in integrating optic and electronic technologies.

The Bellevue/NYU Program for Survivors of Torture's mission is to provide comprehensive care to victims of ethnic and political Torture and those suffering from refugee trauma. Aiming to build a program that interconnects practical medical care, with holistic mental health care and social service needs; their mission involves efforts in survivor advocacy, community outreach initiatives, research and education. Part of their mission is for the clinicians to shape and tailor PSOT to the needs of their clients and ensure that their voices form a larger part in professional and social discourse. PSOT aims to facilitate ongoing discussion and collaborative efforts in communication to provide nuanced and effective treatment plans.

McNeill HVDC Back-to-back station is an HVDC back-to-back station at 50°35'56"N 110°1'25"W, which interconnects the power grids of the Canadian provinces Alberta and Saskatchewan and went in service in 1989. McNeill HVDC back-to-back station is the most northerly of a series of HVDC interconnectors between the unsynchronised eastern and western AC systems of the United States and Canada. The station, which was built by GEC-Alstom, can transfer a maximum power of 150 MW at a DC voltage of 42 kV. The station is unusual in many respects and contained several "firsts" for HVDC.

Supermicro SBI-7228R-T2X blade server, containing two dual-CPU server nodes A blade server is a stripped-down server computer with a modular design optimized to minimize the use of physical space and energy. Blade servers have many components removed to save space, minimize power consumption and other considerations, while still having all the functional components to be considered a computer. Unlike a rack-mount server, a blade server fits inside a blade enclosure, which can hold multiple blade servers, providing services such as power, cooling, networking, various interconnects and management. Together, blades and the blade enclosure form a blade system, which may itself be rack-mounted.

Introduction to Parallel Computing - 3.11 Related Work // cse590o course, University of Washington, Winter 2002; page 154 Variants of SHMEM libraries can run on top of any MPI library, even when a cluster has only non-rdma optimized Ethernet, however the performance will be typically worse than other enhanced networking protocols. Memory in shared region should be allocated using special functions (shmalloc/shfree), not with the system malloc. SHMEM is available only for C and Fortran (some versions also to C++).OpenSHMEM TUTORIAL // University of Houston, Texas, 2012 Many disadvantages of SHMEM have been overcome with the use of OpenSHMEM on popular sub-microsecond interconnects, driven by exascale development.

NorNed is a long high-voltage direct current submarine power cable between Feda in Norway and the seaport of Eemshaven in the Netherlands, which interconnects both countries' electrical grids. It was once the longest submarine power cable in the world.Skog, J.E., van Asten, H., Worzyk, T., Andersrød, T., Norned – World’s longest power cable, CIGRÉ session, Paris, 2010, paper reference B1-106. Budgeted at €550 million, and completed at a cost of €600m, the NorNed cable is a bipolar HVDC link with a voltage of ±450 kV and a capacity of 700 MW. NorNed is a joint project of the Norwegian transmission system operator Statnett and its Dutch counterpart TenneT.

In a report about the tests of CMS microstrip gas chamber (MSGC) modules at PSI, Iacopi and her colleagues conducted the CMS experiment and tested two CMS MSGC that were similar to the barrel of the tracker, using a high intensity beam. The inner layer of MSGC in CMS proved to be stable in terms of voltage, thus rendering the experiment successful. However, shortly after, a decision was made to change the technology for the CMS tracker to silicon detectors. In 1999, Iacopi started working at one of the largest independent R&D; centers for semiconductors (IMEC) and focused on ultra-low-k/Highly porous dielectrics for on-chip interconnects.

During her M.Sc. studies, Iacopi worked as a junior researcher at the Italian National Institute for Nuclear Physics from 1995 till 1998 and later moved to Belgium with a position at Vrije Universiteit Brussel in collaboration with CERN, Switzerland till 1999. In the following decade, Iacopi joined the Inter- university Microelectronics Center in Leuven, Belgium, as a research scientist and later got promoted to senior scientist from 2006. During her term in IMEC, Iacopi researched on interconnects and nanotechnology. Afterwards, she spent one year in Japan, where she was appointed Guest Associate Professor at the University of Tokyo, Kashiwa Campus, to study novel plasma processes.

Sputnik Observatory (SPTNK) is an educational non-profit organization that specializes in the study of contemporary culture. SPTNK documents, archives and disseminates ideas that are shaping modern thought. SPTNK has a website designed by Jonathan Harris that interconnects ideas in fields as diverse as quantum physics, mathematics, neuroscience, biology, economics, architecture, digital art, video games, computer science and music. Conversations include such people as physicist Freeman Dyson, game designer Will Wright, venture capitalist Jacques Vallée, biologist Lynn Margulis, aerospace entrepreneur Robert Bigelow, architect Lars Spuybroek and computer scientist Vint Cerf.. Sputnik Observatory was established and funded in New York City in 2003 by the principals of Sputnik Inc.

The Alpha 21264B is a further development for increased clock frequencies. There were two models, one fabricated by IBM, code-named EV68C, and one by Samsung, code-named EV68A. The EV68A was fabricated in a 0.18 μm CMOS process with aluminium interconnects. It had a die size of 125 mm², a third smaller than the Alpha 21264A, and used a 1.7 V power supply. It was available in volume in 2001 at clock frequencies of 750, 833, 875 and 940 MHz. The EV68A dissipated a maximum of 60 W at 750 MHz, 67 W at 833 MHz, 70 W at 875 MHz and 75 W at 940 MHz.

In addition to the concerns above, materials for use in spacecraft applications have to cope with radiation damage and high-intensity ultraviolet radiation, thermal loads from solar radiation, radiation cooling of the vehicle in other directions, and heat produced within the spacecraft's systems. Another concern, for orbits closer to Earth, is the presence of atomic oxygen, leading to corrosion of exposed surfaces; aluminium is an especially sensitive material. Silver, often used for surface-deposited interconnects, forms layer of silver oxide that flakes off and may erode up to a total failure. Corrosion-sensitive surfaces can be protected by a suitable plating, most often with gold; a silica layer is also possible.

Later research has shown similar delay-active neurons also in the posterior parietal cortex, the thalamus, the caudate, and the globus pallidus. The work of Goldman-Rakic and others showed that principal sulcal, dorsolateral PFC interconnects with all of these brain regions, and that neuronal microcircuits within PFC are able to maintain information in working memory through recurrent excitatory glutamate networks of pyramidal cells that continue to fire throughout the delay period. These circuits are tuned by lateral inhibition from GABAergic interneurons. The neuromodulatory arousal systems markedly alter PFC working memory function; for example, either too little or too much dopamine or norepinephrine impairs PFC network firing and working memory performance.

HyperTransport based- systems offer a dramatically reduced latency and increased throughput. This is because a HyperTransport connected system allows a co-processor to have direct access to the system's HyperTransport bus, and thus as much access to system resources as other conventional CPUs. PCI-Express and HyperTransport buses both allow systems to communicate at 20-25 Gbit/s versus 4-8 Gbit/s for Peripheral Component Interconnect PCI/PCI-X based systems. Just as the latest desktop machines are using PCI-Express for their high-performance graphic cards now servers will be able to use these high speed interconnects to add other hardware-based co-processors.

This allows simpler interconnects, and (in theory) hardware-agnostic memory controller chips (such as DDR2 and DDR3) that can be used interchangeably. The downsides to this approach are; it introduces latency to the memory request, it requires additional power consumption for the buffer chips, and current implementations create a memory write bus significantly narrower than the memory read bus. This means workloads that use many writes (such as high- performance computing) will be significantly slowed. However, this slowdown is nowhere near as bad as not having enough memory capacity to avoid using significant amounts of virtual memory, so workloads that use extreme amounts of memory in irregular patterns might be helped by using fully buffered DIMMs.

A macrocell array is an approach to the design and manufacture of ASICs. Essentially, it is a small step up from the otherwise similar gate array, but rather than being a prefabricated array of simple logic gates, the macrocell array is a prefabricated array of higher- level logic functions such as flip-flops, ALU functions, registers, and the like. These logic functions are simply placed at regular predefined positions and manufactured on a wafer, usually called master slice. Creation of a circuit with a specified function is accomplished by adding metal interconnects to the chips on the master slice late in the manufacturing process, allowing the function of the chip to be customised as desired.

Stratix IV FPGA from Altera A field-programmable gate array (FPGA) is an integrated circuit designed to be configured by a customer or a designer after manufacturinghence the term "field-programmable". The FPGA configuration is generally specified using a hardware description language (HDL), similar to that used for an application-specific integrated circuit (ASIC). Circuit diagrams were previously used to specify the configuration, but this is increasingly rare due to the advent of electronic design automation tools. A Spartan FPGA from Xilinx FPGAs contain an array of programmable logic blocks, and a hierarchy of "reconfigurable interconnects" that allow the blocks to be "wired together", like many logic gates that can be inter-wired in different configurations.

Supercomputer facilities supported by ASCR include the National Energy Research Scientific Computing Center (NERSC) at Lawrence Berkeley National Laboratory in California, and the Leadership Computing Facility at Oak Ridge National Laboratory in Tennessee and Argonne National Laboratory in Illinois. The ASCR supports the Energy Sciences Network (ESnet), which interconnects more than 40 DOE sites at speeds up to 100 gigabits per second. ESnet is a successor to a network that the Office of Science created in 1974 to connect geographically dispersed researchers through a single network. In the 1980s the Office of Science collaborated with DARPA, NSF and NASA to convert the agencies' separate networks into a single integrated communications network that became the basis for the commercial Internet.

The thermal bump is compatible with the existing flip-chip manufacturing infrastructure, extending the use of conventional solder bumped interconnects to provide active, integrated cooling of a flip-chipped component using the widely accepted copper pillar bumping process. The result is higher performance and efficiency within the existing semiconductor manufacturing paradigm. The thermal bump also enables power generating capabilities within copper pillar bumps for energy recycling applications. Thermal bumps have been shown to achieve a temperature differential of 60 °C between the top and bottom headers; demonstrated power pumping capabilities exceeding 150 W/cm2; and when subjected to heat, have demonstrated the capability to generate up to 10 mW of power per bump.

J. Cong and S. Xu, "Technology Mapping for FPGAs with Embedded Memory Blocks", Symposium on Field Programmable Gate Array, 1998. Such a heterogeneous mapping can improve the area and performance by reducing the contribution of programmable interconnects. Contrary to the purely spatial computing model of FPGA, a reconfigurable computing platform that employs a temporal computing model (or a combination of both temporal and spatial) has also been investigated S. Paul and S. Bhunia, "Reconfigurable Computing Using Content Addressable Memory for Improved Performance and Resource Usage", Design Automation Conference, 2008.S. Paul, S. Chatterjee, S. Mukhopadhyay and S. Bhunia, "Nanoscale Reconfigurable Computing Using Non- Volatile 2-D STTRAM Array", International Conference on Nanotechnology, 2009.

Parallel SCSI uses a more complex bus than SATA, usually resulting in higher manufacturing costs. SCSI buses also allow connection of several drives on one shared channel, whereas SATA allows one drive per channel, unless using a port multiplier. Serial Attached SCSI uses the same physical interconnects as SATA, and most SAS HBAs also support 3 and 6 Gbit/s SATA devices (an HBA requires support for Serial ATA Tunneling Protocol). SATA 3 Gbit/s theoretically offers a maximum bandwidth of 300 MB/s per device, which is only slightly lower than the rated speed for SCSI Ultra 320 with a maximum of 320 MB/s total for all devices on a bus.

The CNTs with encapsulated nanowires have been studied at the ab initio level with self-consistent treatment of electronic and phonon transport and demonstrated to improve current-voltage performance. A fully experimentally-calibrated electrothermal modelling tool would prove useful in studying, not only the performance of CNT and composite lines, but also their reliability and variability, and the impact of the contacts on the electronic and thermal performance. In this context, a full three dimensional physics-based and multi-scale (from ab- initio material simulation up to circuit simulation) simulation package that takes into account all aspects of VLSI interconnects (performance, power dissipation and reliability) is desirable to enable accurate evaluation of future CNT-based technologies.

The park is composed of four separate tracts of land, two of which are contiguous, reflecting its piecemeal acquisition. The southernmost section begins just north of Peekskill, abutting the New York National Guard's Camp Smith, following the Bear Mountain Highway (US 6 and 202) around the lower slopes of Anthony's Nose. In Putnam County, it serves as the AT's corridor along the north of the mountain and on Canada Hill. In the land above Manitoga, the former estate of industrial designer Russel Wright, the AT interconnects with its trail system and follows the border with another parcel known as the Osborn Preserve, formerly part of Wing & Wing, the estate of 19th-century Illinois Central railroad president William Osborn.

The Islamic Museum of Australia's permanent exhibition was 'Highly Commended' in the 2014 Museums Australia MAGNA awards, endorsed as: "An important new museum which sensitively interconnects Australia's Muslim heritage with strong interpretive themes". Yassir Morsi, from the International Centre for Muslim and Non-Muslim Understanding at the University of South Australia, in his review lists a number of deficiencies saying the museum displays, "how European we are when we colonise our Islamic history". He says the museum's only saving grace is the large oil painting of Waleed Aly. Etihad Airways and Dubai-based Habtoor Leighton Group are principal partners, while the museum branding was completed by Design 55 - a Dubai based studio.

The rail, S-Bahn, U-Bahn and bus companies are administered through a consortium of local and regional transport lines, the Verkehrsverbund Rhein-Ruhr. It offers a rapid transit system which interconnects all cities and their respective local buses, trams, U- and S-Bahn systems, partly under the umbrella of Deutsche Bahn. Their systems are highly integrated where even some subway lines continue from one city to the next (for example between Düsseldorf and Duisburg or Bochum and Herne, which is unique in Germany, as the city border is crossed underground). The region is divided into several urban zones and fares are paid according to the amount of urban areas (or zones) passed through.

This kind of connection is used in cases where permanent connection techniques like soldering or non-permanent ones like pogo pins or elastomeric "Zebra" connectors are not suitable, for example due to extreme vibrations or temperatures. They can also be used where low-distortion signal transmission is needed, like on PCB (board-to-board) interconnects, or in IC testing sockets where additionally many mating cycles are required. They can be used discretely as a signal/ground contact or for Electromagnetic interference (EMI) protection. When a mating array for multiple contacts is needed, like for BGA or LGA IC packages, Fuzz Buttons can be placed in thru-holes in an insulated piece of material, such as dielectric plastic.

The new chemistry of high-κ gate dielectrics must be combined with existing techniques, including substrate bias and multiple threshold voltages, to prevent leakage from prohibitively consuming power. IEDM papers from Intel in 2002, 2004, and 2005 illustrate the industry trend that the transistor sizes can no longer scale along with the rest of the feature dimensions (gate width only changed from 220 nm to 210 nm going from 90 nm to 65 nm technologies). However, the interconnects (metal and poly pitch) continue to shrink, thus reducing chip area and chip cost, as well as shortening the distance between transistors, leading to higher-performance devices of greater complexity when compared with earlier nodes.

Circuit switching arranges a dedicated communications path for a connection between endpoints for the duration of the connection. This sacrifices total bandwidth available if the dedicated connections are poorly utilized, but makes the connection and bandwidth more predictable, and only introduces control overhead when the connections are initiated, rather than with every packet handled, as in modern packet-switched networks. When the Clos network was first devised, the number of crosspoints was a good approximation of the total cost of the switching system. While this was important for electromechanical crossbars, it became less relevant with the advent of VLSI, wherein the interconnects could be implemented either directly in silicon, or within a relatively small cluster of boards.

For the Tesla, Quadro and Grid product lines, the NVML-API (Nvidia Management Library API) offers a set of functions for programmatically controlling some aspects of NVLink interconnects on Windows and Linux systems, such as component evaluation and versions along with status/error querying and performance monitoring. Further, with the provision of the NCCL library (Nvidia Collective Communications Library) developers in the public space shall be enabled for realizing e.g. powerful implementations for artificial intelligence and similar computation hungry topics atop NVLink. The page "3D Settings" » "Configure SLI, Surround, PhysX" in the Nvidia Control panel and the CUDA sample application "simpleP2P" use such APIs to realize their services in respect to their NVLink features.

In both cases some information is lost, although certain vectorization operations can recreate salient information, as in the case of optical character recognition. Early mechanical televisions developed in the 1920s employed rasterization principles. Electronic television based on cathode-ray tube displays are raster scanned with horizontal rasters painted left to right, and the raster lines painted top to bottom (the top of a computer monitor is most commonly referenced to landscape orientation, while the top of a printed page is most commonly referenced to portrait orientation; going against the flow requires image rotation). Left-right within top-bottom remains the conventional pixel organization in the majority of bitmapped file formats and rasterized display interconnects such as VGA and DVI.

The tampering became so widespread in the 1990s that the National Hot Rod Association (NHRA) required delay box manufacturers to make the delay boxes harder to modify by end users, and shrink enclosures so there was no room for additional contents. Sealing the delay box enclosure so it would be easy to see if it was tampered with was also part of the process. The NHRA also created rules specifying how a drag racer electrically wired his race car, requiring racers to leave wires unbundled so they could be quickly and easily traced by eye. Rules were also created limiting how many interconnects could attach to the wire between the delay box and the transmission.

The Energy Sciences Network (ESnet) is the Office of Science’s high-performance network user facility, delivering highly-reliable data transport capabilities optimized for the requirements of large-scale science. In essence, ESnet is the circulatory system that enables the DOE science mission. ESnet is stewarded by the Advanced Scientific Computing Research Program, and managed and operated by the Scientific Networking Division at Lawrence Berkeley National Laboratory. ESnet interconnects the DOE’s national laboratory system, dozens of other DOE sites, and ~200 research and commercial networks around the world—enabling tens of thousands of scientists at DOE laboratories and academic institutions across the country to transfer vast data streams and access remote research resources in real-time.

The combinational logic circuitry of the 74181 integrated circuit The 74181 is a 7400 series medium-scale integration (MSI) TTL integrated circuit, containing the equivalent of 75 logic gates Miles Murdocca, Apostolos Gerasoulis, and Saul Levy. "Novel Optical Computer Architecture Utilizing Reconfigurable Interconnects". 1991\. p. 23. quote: "Logic diagram for the 74181 ... There are 63 logic gates." and most commonly packaged as a 24-pin DIP. The 4-bit wide ALU can perform all the traditional add / subtract / decrement operations with or without carry, as well as AND / NAND, OR / NOR, XOR, and shift. Many variations of these basic functions are available, for a total of 16 arithmetic and 16 logical operations on two four-bit words.

The processing electronics consist of a card cage that includes a "Backplane" or "Motherboard", eight identical car function boards, and three unique, common processing boards that the backplane board supports and interconnects. Each of the eleven boards has its own onboard fixed 5 volt regulator IC. All of the logic circuitry is TTL, and no microprocessors are used. Each game was sold with two spare car boards and one each of the three processing boards, so that the game owner could repair it by simple circuit board substitution. Two "card extender" boards were furnished with each game sold that enabled technicians to probe individual components on suspect boards while they were still operating in the game.

A bundle of optical fiber Fiber crew installing a 432-count fiber cable underneath the streets of Midtown Manhattan, New York City A TOSLINK fiber optic audio cable with red light being shone in one end transmits the light to the other end wall-mount cabinet containing optical fiber interconnects. The yellow cables are single mode fibers; the orange and aqua cables are multi-mode fibers: 50/125 µm OM2 and 50/125 µm OM3 fibers respectively. Another example of a physical medium is optical fiber, which has emerged as the most commonly used transmission medium for long-distance communications. Optical fiber is a thin strand of glass that guides light along its length.

Switched Fabric or switching fabric is a network topology in which network nodes interconnect via one or more network switches (particularly crossbar switches). Because a switched fabric network spreads network traffic across multiple physical links, it yields higher total throughput than broadcast networks, such as the early 10BASE5 version of Ethernet, or most wireless networks such as Wi-Fi. The generation of high-speed serial data interconnects that appeared in 2001–2004 which provided point-to-point connectivity between processor and peripheral devices are sometimes referred to as fabrics; however, they lack features such as a message passing protocol. For example, HyperTransport, the computer processor interconnect technology, continues to maintain a processor bus focus even after adopting a higher speed physical layer.

Since timing skew over a parallel bus can amount to a few nanoseconds, the resulting bandwidth limitation is in the range of hundreds of megahertz. Highly simplified topologies of the Legacy PCI Shared (Parallel) Interface and the PCIe Serial Point-to-Point Interface A serial interface does not exhibit timing skew because there is only one differential signal in each direction within each lane, and there is no external clock signal since clocking information is embedded within the serial signal itself. As such, typical bandwidth limitations on serial signals are in the multi-gigahertz range. PCI Express is one example of the general trend toward replacing parallel buses with serial interconnects; other examples include Serial ATA (SATA), USB, Serial Attached SCSI (SAS), FireWire (IEEE 1394), and RapidIO.

In electronic design automation, parasitic extraction is calculation of the parasitic effects in both the designed devices and the required wiring interconnects of an electronic circuit: parasitic capacitances, parasitic resistances and parasitic inductances, commonly called parasitic devices, parasitic components, or simply parasitics. The major purpose of parasitic extraction is to create an accurate analog model of the circuit, so that detailed simulations can emulate actual digital and analog circuit responses. Digital circuit responses are often used to populate databases for signal delay and loading calculation such as: timing analysis; power analysis; circuit simulation; and signal integrity analysis. Analog circuits are often run in detailed test benches to indicate if the extra extracted parasitics will still allow the designed circuit to function.

American market intelligence firm International Data Corporation (IDC) describes CDI as "an emerging category of infrastructure systems that make use of high-bandwidth, low-latency interconnects to aggregate compute, storage, and networking fabric resources into shared resource pools that can be available for on-demand allocation." These systems use what is sometimes called rack-scale architecture, which allows network operators to replace components on a rack while the entire data center behaves as a virtualized server. This allows operators to allocate compute, memory, and storage resources inside each server node on-demand, over a high speed, low latency computing fabric. The individual components can be managed as a resource pool, allowing dynamic provisioning and deprovisioning with a common application programming interface (API).

Seen by proponents as the networking model of the future,iAreaNetwork Vision Statement. an IAN securely connects endpoints through the public Internet, so that they can communicate and exchange information and data without being tied to a physical location. Unlike a LAN, which interconnects computers in a limited area such as a home, school, computer laboratory or office building, or a WAN, which is a network that covers a broad area, such as any telecommunications network that links across metropolitan, regional, or national boundaries, using private or public network transports, the IAN eliminates a geographic profile for the network entirely because the applications and communications services have become virtualized. Endpoints need only be connected over a broadband connection across the Internet.

Also for power and high-performance applications the most critical challenges are high ampacity, thermal conductivity and electromigration resistance. Far away from bulk, copper conductors that would already melt at 104 A/cm2, current copper metallization lines can withstand 107 A/cm2 due to good heat dissipation into thermal contact to the surrounding material, optimized liner and capping as well as plating and CMP processes. The reliability of state of the art interconnects is closely linked to electromigration . This adverse effect describes the material transport and consequently void formation especially in thin metal lines to the anode by a combination of the electron wind force, the temperature gradient induced force, the stress gradient induced force and the surface tension force.

TransGas Limited operates the TransGas Pipeline, a natural gas pipeline system which collects gas from wells sites in Saskatchewan and moves gas between Alberta, Saskatchewan, Manitoba, and the United States. The system consists of nearly 14,000 kilometres of high-pressure natural gas pipelines and 8 storage locations providing 40.5 PJ in total capacity TransGas Storage Capacity TransGas Limited is a wholly owned subsidiary of SaskEnergy, a Saskatchewan Crown corporation. TransGas owns and operates the transmission utility for SaskEnergy, and has the exclusive legislated franchise to transport natural gas within the province of Saskatchewan. TransGas owns Many Islands Pipe Lines (Canada) Limited that interconnects the TransGas pipelines with TransCanada Pipelines in Alberta, Havre Pipelines in Montana and Williston Basin Pipeline in North Dakota.

Google, Tyan, Nvidia, and Mellanox are founding members of the OpenPOWER Foundation. Nvidia is looking to merge its graphics cores and Mellanox to integrate its high performance interconnects with Power cores. Tyan is said to be working on servers using POWER8 and Google sees using POWER processors in its data centers as a future possibility. Altera announced support for OpenPOWER in November 2013 with their FPGA offerings and OpenCL software. On January 19, 2014, the Suzhou PowerCore Technology Company and the Research Institute of Jiangsu Industrial Technology announced that they will join the OpenPOWER Foundation and license POWER8 technologies to promote and help build systems around and design custom made processors for use in big data and cloud computing applications.

Animated image showing change in absorption spectrum of GaAs/AlGaAs quantum wells by externally applied voltage Quantum-confined Stark effect most promising application lies in its ability to perform optical modulation in the near infrared spectral range, which is of great interest for silicon photonics and down-scaling of optical interconnects. A QCSE based electro-absorption modulator consists of a PIN structure where the instrinsic region contains multiple quantum wells and acts as a waveguide for the carrier signal. An electric field can be induced perpendicularly to the quantum wells by applying an external, reverse bias to the PIN diode, causing QCSE. This mechanism can be employed to modulate wavelengths below the band gap of the unbiased system and within the reach of the QCSE induced redshift.

In 2017, Pinkston was named holder of the Louise L. Dunn Endowed Professorship in Engineering, and in 2019, he was named holder of the George Pfleger Chair in Electrical and Computer Engineering. At USC, Pinkston founded the Superior Multiprocessor Architecture (SMART) Interconnects Group which investigates high-performance communication architectures for parallel computer systems—interconnection networks, adaptive and reconﬁgurable routing algorithms, router design and implementation, and energy- and resource- efficient NoCs. Pinkston was the lead co-author of "Interconnection Networks", a chapter appearing as Appendix E in the 4th edition and as Appendix F in the 5th and 6th editions of the textbook Computer Architecture: A Quantitative Approach. He served as the founding Lead Program Director of the National Science Foundation’s Expeditions in Computing program in 2007–2008.

Since about 2000, FDTD techniques have emerged as a primary means to computationally model many scientific and engineering problems dealing with electromagnetic wave interactions with material structures. Current FDTD modeling applications range from near-DC (ultralow-frequency geophysics involving the entire Earth- ionosphere waveguide) through microwaves (radar signature technology, antennas, wireless communications devices, digital interconnects, biomedical imaging/treatment) to visible light (photonic crystals, nanoplasmonics, solitons, microscopy and lithography, and biophotonics). Both commercial FDTD software suites and free-software/open-source or closed-source FDTD projects are available which permit detailed Maxwell's equations modeling of electromagnetic wave phenomena and engineered systems spanning much of the electromagnetic spectrum. To a large degree, all of these software constructs derive directly from FDTD techniques first reported by Prof.

The HBT and BiFET productions have grown into multibillion-dollar businesses worldwide. He was the inventor of the multi-band, re-configurable RF-Interconnects based on FDMA and CDMA multiple access algorithms for intra- and inter-ULSI communications. Chang was elected to the National Academy of Engineering in 2008, for the development and commercialization of GaAs HBT power amplifiers and integrated circuits. He received the IEEE David Sarnoff Award in 2006 and became a Fellow of IEEE in 1996. He also received Pan Wen-Yuan Foundation Award in 2008, Rockwell's Leonardo da Vinci Award (Engineer of the Year) in 1992, National Chiao Tung University’s Distinguished Alumnus Award in 1997, and the National Tsing Hua University Distinguished Alumnus Award in 2002.

HVDC transmission line tower in coastal Marlborough region The HVDC Inter Island link starts at two converter stations located adjacent to Benmore Hydroelectric Power Station in the Waitaki Valley. Electricity is taken from the main Benmore switchyard, which interconnects the Benmore generators and rest of the South Island transmission grid, at 220 kV via tie-lines across the Benmore tailrace. The AC power is converted at the stations to ±350 kV HVDC for transmission The HVDC transmission line crosses the Benmore power station tailrace and takes a route along the eastern side of the dam. The line continues north along the eastern shore of Lake Benmore, before turning north- east and then east to meet the Christchurch to Twizel HVAC line.

These form a common-mode choke which inhibits unbalanced current flow, without affecting the differential signal. This technique is equally valid for coaxial interconnects, and many camcorders have ferrite cores fitted to some of their auxiliary cables such as DC charging and external audio input, to break the high-frequency current flow if the user inadvertently creates a ground loop when connecting external equipment. RF cabling, usually coaxial, is also often equipped with a ferrite core, often a fairly large toroid, through which the cable can be wound perhaps 10 times to add a useful amount of common-mode inductance. Where no power need be transmitted, only digital data, the use of fiber optics can remove many ground loop problems, and sometimes safety problems too, but there are practical limitations.

This makes it possible for frames to be delivered on a network link that interconnects hosts by some combination of repeaters, hubs, bridges and switches, but not by network layer routers. Thus, for example, when an IP packet reaches its destination (sub)network, the destination IP address (a layer 3 or network layer concept) is resolved with the Address Resolution Protocol for IPv4, or by Neighbor Discovery Protocol (IPv6) into the MAC address (a layer 2 concept) of the destination host. Examples of physical networks are Ethernet networks and Wi-Fi networks, both of which are IEEE 802 networks and use IEEE 802 48-bit MAC addresses. A MAC layer is not required in full-duplex point-to-point communication, but address fields are included in some point-to-point protocols for compatibility reasons.

The thermal copper pillar bump, also known as the "thermal bump", is a thermoelectric device made from thin-film thermoelectric material embedded in flip chip interconnects (in particular copper pillar solder bumps) for use in electronics and optoelectronic packaging, including: flip chip packaging of CPU and GPU integrated circuits (chips), laser diodes, and semiconductor optical amplifiers (SOA). Unlike conventional solder bumps that provide an electrical path and a mechanical connection to the package, thermal bumps act as solid-state heat pumps and add thermal management functionality locally on the surface of a chip or to another electrical component. The diameter of a thermal bump is 238 μm and 60 μm high. The thermal bump uses the thermoelectric effect, which is the direct conversion of temperature differences to electric voltage and vice versa.

The shell resistance of an individual nanotube can be obtained by computing the resistance of each shell as :R_{shell} = R_{i} +R_{c} + R_{hb} + R_{o} where R_{i} is the ballistic resistance, R_{c} is contact resistance, R_{o} is the distributed ohmic resistance and R_{hb} is the resistance due to the applied bias voltage. Capacitance of nanotubes consists of quantum, Cq and electrostatic capacitance Ce. For multi-wall carbon nanotubes, there is the shell-to-shell coupling capacitance, Cc. Additionally there is a coupling capacitance, Ccm between any two CNT bundles. As for inductance, CNTs have both kinetic, Lk and magnetic inductance, Lm. There are also mutual inductances between shells, Mm and bundles, Mmm. Detailed simulation for signal interconnects have been performed by Naeemi et al.

ACF continues to be the most popular form factor for ACAs, largely due to the ability to precisely control the volume of material, density of the particles in any sample, and the distribution of those particles within the sample. This is particularly true in the traditional ACF stronghold of display interconnects, but ACF has also seen strong growth out of the display industry and into areas long dominated by surface-mount technologies. The ability to make interconnections in a very small XYZ space has been the key driver in this expansion, helped by the ability under certain conditions to greatly lower cost either by the reduction of component counts or total material used. ACPs are widely used in lower-end applications, primarily in the assembly of chips on to RFID antenna substrates.

The boundary scan architecture provides a means to test interconnects (including clusters of logic, memories, etc.) without using physical test probes; this involves the addition of at least one test cell that is connected to each pin of the device and that can selectively override the functionality of that pin. Each test cell may be programmed via the JTAG scan chain to drive a signal onto a pin and thus across an individual trace on the board; the cell at the destination of the board trace can then be read, verifying that the board trace properly connects the two pins. If the trace is shorted to another signal or if the trace is open, the correct signal value does not show up at the destination pin, indicating a fault.

During this time, she led a project funded by NASA and the NSA to test components of an optical communications network for supercomputing. Bergman went to Columbia as an associate professor of electrical engineering in 2001 and became director of its Lightwave Research Laboratory in 2002. According to her member biography from OSTI's Advanced Scientific Computing Advisory Committee (of which she was a member from 2016 to 2019), > As director of the Lightwave Research Laboratory she leads multiple research > programs on optical interconnection networks for advanced computing systems, > data centers, optical packet-switched routers, and chip multiprocessor > nanophotonic networks-on-chip. In 2019 a team led by Bergman won a $4.8 million DARPA grant to support the development of a new class of on-chip optical interconnects that scale performance without increasing energy costs.

Starting July 2014, an active fractalgridIndian Energy News: United States Marine Corps to Honor Navajo Code Talkers During Navajo Nation’s Advanced FractalGrid Tour of Camp Pendleton has been active in San Diego County, California at military base Camp Pendleton, funded by the California Energy Commission to exhibit the uses of fractalgrid technology.Camp Pendleton Microgrid - Energy Security CW6 The Camp Pendleton fractalgrid is connected to a 1.1 MW facility consisting of several buildings at the Barracks, a three-story parking garage and three cell towers. The project implements three self-sufficient fractal microgrids and a larger microgrid that interconnects the site such that resources can be shared between microgrids in various configurations. Each fractal microgrid's operational status is dependent on the state of power supply and the need to keep critical loads powered.

The peering fabric first existed informally as links between "Wantree Internet" and "Omen Internet" to iiNet. WAIX formalised as an initiative by the Western Australian Internet Association after a presentation by Andrew Khoo on his similar work in Sydney and Melbourne to create multi- lateral peering fabrics in both cities. The ISPs at the presentation later agreed they could form the fabric themselves and did so by purchasing a small room in QV.1 and began as a formal peering exchange after Omen, iiNet and Wantree moved their interconnects into the peering room. Various attempts were made over the first few years to arrange traffic exchange between peers at WAIX and peers at other Australian internet exchanges (notably the "South Australia Internet Exchange", or SAIX) allowing peers to pay for interstate traffic.

He described the role of the taltos as the "recognition and accomplishment of things required by the community, but unresolved due to the limitation of its own [the community's] powers". Contemporary Hungarian religious studies, primarily the academic circle revolving around Mihály Hoppál, has acquired an important role for the international study of shamanism. The Hungarian ethnological discourse presents taltoses, and shamans in general, as those whose socio-religious role is to heal, prophesize and keep the integrity of cultural traditions by connecting the past and the present and thus projecting into the future, integrating the individual and the community, mankind and the gods. In the words of Hoppál, shamanism is depicted as a "bridge and symbol, because it interconnects the traditions of the past with the present, and anchors the future of traditions".

From that moment on, the Entel Tower became the vital nucleus of the country's communications system by allowing the interconnection of Entel's telephone, television, radio and microwave network services with those of the Chilean Telephone Company (currently Movistar) and with the north, center and south of the country and the province of Mendoza, Argentina. In addition, it is connected to the Longovilo Satellite Communications Ground Station. Currently, all the equipment that carries international traffic via satellite, the Santiago- Mendoza terrestrial, the southern and northern National Trunk networks operate there, and it interconnects the public long-distance telephone, telex, television and radio broadcasting services. On the night of December 31, 2009, the largest LED screen in South America was inaugurated and installed at the top of the tower to mark the "Bicentennial New Year".

France's peak demand occurs during the winter, and in 2007 was 88,960 MW. The annual production of electricity was 544.7 TWh, generated from an installed capacity of 108,319 MW, almost 60% of which was nuclear. RTE's network interconnects with those of its counterparts in most of France's neighbouring countries, and the international trade (both import and export) of electricity is a major contribution to RTE's business activities. France is the largest exporter of electricity in Europe, and the country is linked via a total of 44 high voltage interconnections to Spain, Italy, Switzerland, Germany, Belgium and the United Kingdom, the last of which by means of an HVDC submarine power cable. France's balance of trade in this market is normally positive; in 2007, exports of electrical energy totalled 83.0 TWh and imports 27.5 TWh.

Until 1 Gbit/s networks, Network virtualization was not suffering from the overhead of the software layers or hypervisor layers providing the interconnects. With the rise of high bandwidth, 10 Gbit/s and beyond, the rates of packets exceed the capabilities of processing of the networking stacks. In order to keep offering high throughput processing, some combinations of software and hardware helpers are deployed in the so-called "network in a box" associated with either a hardware dependent network interface controller (NIC) using SRIOV extensions of the hypervisor or either using a fast path technology between the NIC and the payloads (virtual machines or containers). For example, in case of Openstack, network is provided by Neutron which leverages many features from the Linux kernel for networking: iptables, iproute2, L2 bridge, L3 routing or OVS.

Following his PhD, Robertson worked at the Central Electricity Research Laboratories for 18 years, and in 1994 returned to Cambridge. He has published over 600 journal papers with around 33,000 citations. His main topic of research is theory of carbon materials. Other research interests include: carbon nanotubes, graphene, chemical vapour deposition, electronic applications (experimental and calculation); modelling of CVD mechanisms; carbon interconnects, carbon conductors, carbon for supercapacitors; high-κ dielectrics for complementary metal oxide semiconductor transistors; high-κ oxides on high mobility substrates such as InGaAs, Ge (modelling); transparent conducting oxides, amorphous oxide semiconductors (AOS) such as indium gallium zinc oxide, their thin film transistors, instability mechanisms (calculations); density functional calculations of semiconductors, oxides, carbon materials, and hybrid density functional calculations for correct band gaps; functional oxides, TiO2.

Expanding its semiconductor test business, Advantest established its North American subsidiary, Advantest America, in 1982, and its European operations in Munich in 1983, to locate its sales and service operations closer to its North American and European customers. The company also has subsidiaries throughout Asia and operates in 13 countries. With the integration with Verigy completed, the company currently has approximately 4,500 employees worldwide. Advantest Kitakyushu R&D; Center In 2002, Advantest was one of the founding member companies that established the Semiconductor Test Consortium (STC)—the first international, industry-wide collaboration aimed at developing a highly scalable, flexible test platform to reduce the cost of test of SoCs and other advanced ICs that incorporate complex technologies such as copper interconnects, sub-100 nm device geometries and 300mm wafers.

When valve amplifiers were the norm, user-adjustable "tone controls" (a simple two-band non-graphic equaliser) and electronic filters were used to allow the listener to change frequency response according to taste and room acoustics; this has become uncommon. Some modern equipment uses graphic equalisers, but valve preamplifiers tend not to supply these facilities (except for RIAA and similar equalisation needed for vinyl and shellac discs). Modern signal sources, unlike vinyl discs, supply line level signals without need for equalisation. It is common to drive valve power amps directly from such source, using passive volume and input source switching integrated into the amplifier, or with a minimalist "line level" control amplifier which is little more than passive volume and switching, plus a buffer amplifier stage to drive the interconnects.

Red Storm was to become the jumping-off point for a string of successful products that eventually revitalized Cray in supercomputing. Red Storm had processors clustered in 96 unit cabinets, a theoretical maximum of 300 cabinets in a machine, and a design speed of 41.5 teraflops. Red Storm also included an innovative new design for network interconnects, which was dubbed SeaStar and destined to be the centerpiece of succeeding innovations by Cray. The Cray XT3 massively parallel supercomputer became a commercialized version of Red Storm, similar in many respects to the earlier T3E architecture, but, like the XD1, using AMD Opteron processors. The Cray XT4, introduced in 2006 added support for DDR2 memory, newer dual-core and future quad-core Opteron processors and utilized a second generation SeaStar2 communication coprocessor.

Open systems are computer systems that provide some combination of interoperability, portability, and open software standards. (It can also refer to specific installations that are configured to allow unrestricted access by people and/or other computers; this article does not discuss that meaning). The term was popularized in the early 1980s, mainly to describe systems based on Unix, especially in contrast to the more entrenched mainframes and minicomputers in use at that time. Unlike older legacy systems, the newer generation of Unix systems featured standardized programming interfaces and peripheral interconnects; third party development of hardware and software was encouraged, a significant departure from the norm of the time, which saw companies such as Amdahl and Hitachi going to court for the right to sell systems and peripherals that were compatible with IBM's mainframes.

Many viewers find that when they acquire a digital television or set-top box they are unable to view closed caption (CC) information, even though the broadcaster is sending it and the TV is able to display it. Originally, CC information was included in the picture ("line 21") via a composite video input, but there is no equivalent capability in digital video interconnects (such as DVI and HDMI) between the display and a "source". A "source", in this case, can be a DVD player or a terrestrial or cable digital television receiver. When CC information is encoded in the MPEG-2 data stream, only the device that decodes the MPEG-2 data (a source) has access to the closed caption information; there is no standard for transmitting the CC information to a display monitor separately.

In 2012 the coarse-grained architectural approach was taken a step further by combining the logic blocks and interconnects of traditional FPGAs with embedded microprocessors and related peripherals to form a complete "system on a programmable chip". This work mirrors the architecture created by Ron Perloff and Hanan Potash of Burroughs Advanced Systems Group in 1982 which combined a reconfigurable CPU architecture on a single chip called the SB24. Examples of such hybrid technologies can be found in the Xilinx Zynq-7000 all Programmable SoC, which includes a 1.0 GHz dual-core ARM Cortex-A9 MPCore processor embedded within the FPGA's logic fabric or in the Altera Arria V FPGA, which includes an 800 MHz dual-core ARM Cortex-A9 MPCore. The Atmel FPSLIC is another such device, which uses an AVR processor in combination with Atmel's programmable logic architecture.

C-Band transportable services cost more than similar Ku service due to the robust nature of the signal, the larger physical size of the truck, and specialized nature of C-Band transmissions. With the advent of Ku band trucks (that don't require frequency coordination) and long-haul fiber optics providing similar signal qualities, C-Band transportable service experienced a slowdown in service volume in the 1990s. It's still used in situations where rain-fades (a problem affecting only Ku band uplinks) are unacceptable and where fiber-optic links are not practical. C-Band uplinks are still commonly used for golf, auto racing, horse racing, and major college sports events in rural areas where local fiber interconnects to long-haul networks are either not available or where the low number of events at the venue per year made installation of fiber not cost effective.

Note that the function of a wire is either power delivery or signalling, both of which can become exceedingly complex in the frequency domain. Below around 8 MHz wires can often be treated as DC elements, above 30 MHz wires on this length scale must be treated as transmission lines; in between a designer might get away with treating wires as DC elements if the ground plane is handled carefully and the wires are short. Hobby electronics rarely exceeds a 10 MHz signalling rate on parallel interconnects. Once the signalling frequency passes into the transmission line regime, form factor constraints become arduous and expansion cards will typically feature standardized connectors with tight manufacturing tolerances, and the expansion card itself will likely interface to the bus through a dedicated interface chip designed to respect the narrow bus tolerances for timing and signal integrity.

August 2012: Head Office PABX extended with 100 dedicated VoIP lines enabling emergency services direct in- dialling to VKS-737 operators. January 2013: VKS-737 services expanded to provide Emergency Service access to satellite telephone users who do not have HF radio facilities. February 2013: Head Office PABX extended with a further 100 dedicated VoIP (total 200) lines to further enhance services in cases of emergency. 2017: All bases upgraded with the latest generation Codan 3033 / Envoy radio-telephone interconnects. March 2019: Port Hedland Base closed due to termination of RFDS Tx site lease at Port Hedland International Airport. August 2019: Derby Base closed due to relocation of RFDS from Derby to Broome. January 2020: Swan Hill Base closed and relocated to Stawell. January 2020: Stawell Base commissioned. Administration: The Australian National 4WD Radio Network Inc.

The processors in a CS-2 were connected by a Meiko-designed multi-stage packet- switched "fat tree" network implemented in custom silicon.Meiko CS-2 Interconnect Elan-Elite design Jon Beecroft, Fred Homewood, Moray McLaren; Journal Parallel Computing; Volume 20 Issue 10-11, November 1994Meiko CS-2 Interconnect Elan-Elite design Fred Homewood, Moray McLaren; Hot Interconnects Conference, Stanford; August 1993Message Passing Performance Jack Dongarra and Tom Dunigan; Concurrancy: Practice and Experience; October 1997 This project, codenamed Elan-Elite, was started in 1990, as a speculative project to compete with the T9000 Transputer from Inmos, which Meiko intended to use as an interconnect technology. The T9000 began to suffer massive delays, such that the internal project became the only viable interconnect choice for the CS-2. This interconnect comprised two devices, code-named Elan (adapter) and Elite (switch).

He coordinated the national ManTech mission with activities having common interests and willing to share results, namely Small Business Innovative Research soldering programs supported by the Air Force, Navy ManTech programs, Department of Defense study groups for Soldering Standard 2000, the United Kingdom Ministry of Defense, Tri-Service Quality Assurance personnel, University professors, and major defense contractors willing to serve as test beds in no-cost Cooperative Research and Development Agreements. For these accomplishments he received the US Army Harry Diamond Laboratories’ John A. Ulrich Award for Managerial Leadership, 1989. He identified the gaps in scientific research that were inhibiting productivity on soldering lines by sponsoring Sandia National Laboratories to conduct symposia with 50 renowned scientists from academe, industry, and government and publish three textbooks to serve as roadmaps for future research: The Mechanics of Solder Alloy Interconnects,D.

This active boosting allows cables to be more compact, thinner, longer and transmit data faster than their passive equivalents. Active cables are used in enterprise networks which form the backbone of modern data communication systems, and also to interconnect consumer devices such as cameras, gaming consoles and HDTVs, Embedding circuitry in cables can allow less copper to be used in cable production for the same performance, reducing the weight of the cable by as much as 80% and reducing size. Other benefits include longer reach and lower power consumption: active cables have demonstrated up to fivefold longer reach than simple passive cables, while consuming approximately 75% less power than comparable fiber-based interconnects.G. Oganessyan, Active Cable Interconnects for High-Speed Serial Communications, DesignCon Conference proceedings, February 2010 Active cables support much longer reach than their passive equivalents.

Application service management (ASM) is an emerging discipline within systems management that focuses on monitoring and managing the performance and quality of service of business transactions. ASM can be defined as a well-defined process and use of related tools to detect, diagnose, remedy and report the service quality of complex business transactions to ensure that they meet or exceed end-users’ Performance measurements relate to how fast transactions are completed or information is delivered to the end user by the aggregate of applications, operating systems, hypervisors (if applicable), hardware platforms, and network interconnects. The critical components of ASM include application discovery & mapping, application "health" measurement & management, transaction-level visibility, and incident-related triage. ASM is related to application performance management (APM), but serves as a more pragmatic, "top-down" approach that focuses on delivery of business services.

Since October 2005, the HPI’s Research School for "Service-Oriented Systems Engineering" has been offering a PhD program modeled to support a more interdisciplinary PhD education. All professors of the HPI with their research groups are supporting pillars for this PhD school whose interdisciplinary structure interconnects the HPI research groups and fosters close and fruitful collaborations. Every year, up to ten new PhD candidates and postdoctoral researchers are admitted and awarded a scholarship. In 2009, the Research School opened a first international branch in South Africa, the "HPI research school at Cape Town University", with up to 15 PhD students. 2010 another branch was opened in Haifa, where up to 15 PhD students joined the research team of the “HPI Research School at Technion.” In 2011, the “HPI Research School at Nanjing University” was opened as a third branch with up to 15 PhD students.

The Wilbur Cross Highway runs through Wethersfield and Hartford, then crosses the Connecticut River into East Hartford on the Charter Oak Bridge. Just prior to the river crossing in Hartford, the Wilbur Cross Highway runs parallel to and interconnects with I-91 near the vicinity of Brainard Airport. Just after the crossing, US 5 exits from the Wilbur Cross Highway on exit 90, ending the long overlap with Route 15. US 5 continues north to East Hartford center along Main Street. From East Hartford northward to the Massachusetts state line, US 5 runs along the east bank of the Connecticut River. Main Street in East Hartford is mostly a 4-lane divided highway. It crosses under I-84 about north of the split with Route 15 with access to the westbound direction only. Main Street continues through the town center, intersecting (and briefly overlapping) U.S. Route 44.

Mixtures of cluster interconnects and technologies are permitted, including Gigabit Ethernet (GbE), SCSI, FDDI, DSSI, CI and Memory Channel adapters. OpenVMS supports up to 96 nodes in a single cluster, and allows mixed-architecture clusters, where VAX and Alpha systems, or Alpha and Itanium systems can co- exist in a single cluster (Various organizations have demonstrated triple- architecture clusters and cluster configurations with up to 150 nodes, but these configurations are not officially supported). Unlike many other clustering solutions, VMScluster offers transparent and fully distributed read-write with record-level locking, which means that the same disk and even the same file can be accessed by several cluster nodes at once; the locking occurs only at the level of a single record of a file, which would usually be one line of text or a single record in a database. This allows the construction of high-availability multiply redundant database servers.

Silicon photonics 300 mm wafer Silicon photonic devices can be made using existing semiconductor fabrication techniques, and because silicon is already used as the substrate for most integrated circuits, it is possible to create hybrid devices in which the optical and electronic components are integrated onto a single microchip. Consequently, silicon photonics is being actively researched by many electronics manufacturers including IBM and Intel, as well as by academic research groups, as a means for keeping on track with Moore's Law, by using optical interconnects to provide faster data transfer both between and within microchips. The propagation of light through silicon devices is governed by a range of nonlinear optical phenomena including the Kerr effect, the Raman effect, two-photon absorption and interactions between photons and free charge carriers. The presence of nonlinearity is of fundamental importance, as it enables light to interact with light, thus permitting applications such as wavelength conversion and all-optical signal routing, in addition to the passive transmission of light.

A common use in the system on a chip (SoC) era is to obtain an microcontroller (MCU) on a pre-assembled printed circuit board (PCB) which exposes an array of input/output (IO) pins in a header suitable to plug into a breadboard, and then to prototype a circuit which exploits one or more of the MCU's peripherals, such as general- purpose input/output (GPIO), UART/USART serial transceivers, analog-to-digital converter (ADC), digital-to-analog converter (DAC), pulse-width modulation (PWM; used in motor control), Serial Peripheral Interface (SPI), or I²C. Firmware is then developed for the MCU to test, debug, and interact with the circuit prototype. High frequency operation is then largely confined to the SoC's PCB. In the case of high speed interconnects such as SPI and I²C, these can be debugged at a lower speed and later rewired using a different circuit assembly methodology to exploit full-speed operation.

A barrier metal is a material used in integrated circuits to chemically isolate semiconductors from soft metal interconnects, while maintaining an electrical connection between them. For instance, a layer of barrier metal must surround every copper interconnect in modern integrated circuits, to prevent diffusion of copper into surrounding materials. As the name implies, a barrier metal must have high electrical conductivity in order to maintain a good electronic contact, while maintaining a low enough copper diffusivity to sufficiently chemically isolate these copper conductor films from underlying device silicon. The thickness of the barrier films is also quite important; with too thin a barrier layer, the inner copper may contact and poison the very devices that they supply with energy and information; with barrier layers too thick, these wrapped stacks of two barrier metal films and an inner copper conductor can have a greater total resistance than the traditional aluminum interconnections would have, eliminating any benefit derived from the new metallization technology.

Information sources are generated, updated, stored and operated on the internet by producers, integrators, and intermediaries, in a decentralized manner, following common methodologies for their integration in the VHL. The VHL organizes information in a structure that integrates and interconnects literature databases, directories or experts, events and institutions, a catalogue of the information resources available on the internet, collections of full texts with a highlight for the SciELO (Scientific Electronic Library Online) collection of scientific journals, selective information dissemination services, information sources to support education and decision-making, news, discussion lists, and support to virtual communities. The space of the VHL is, therefore, a dynamic and decentralized network of information sources based on which it is possible to retrieve and extract information and knowledge to support health decision- making processes. The Virtual Health Library can be visualized as a distributed base of scientific and technical health knowledge that is saved, organized and stored in electronic format in the countries of the region, universally accessible on the internet and compatible with international databases.

Finn-Kelcey's work, like that of many artists she shared gallery space with, was also engaged in dialogues surrounding social liberation movements during this time. For instance, The Restless Image: a discrepancy between the seen position and the felt position (1975), now owned by Tate, in which Finn-Kelcey is posed in a hand-stand on a beach, interconnects with feminist critiques of the woman as 'seen' whilst the title simultaneously draws attention to the shallowness of the viewer's gaze in the invisibility of the 'felt'. Finn-Kelcey's work also appeared in exhibitions and spaces with explicitly feminist agendas, for instance she performed Mind The Gap as part of About Time: video, performance and installation by 21 women artists within the 'women's season' at the Institute of Contemporary Arts in the winter of 1980. Examples of artists Finn-Kelcey exhibited alongside during the 1970s include Carlyle Reedy, Paul Burwell, Tina Keane and David Medalla, all of whom featured in the London Calling presents Performance Plus exhibition in which Finn-Kelcey performed The Boilermaker's Assistant.

Dara Singh inaugurating Harakh Chand Nahata Marg On 1 March 2007, the wrestler, actor and member of the Rajya Sabha, Dara Singh, opened Harakh Chand Nahata Marg, a road that interconnects three villages of South-West Delhi, namely Nanakheri, Badusarai and Raghopur. Nahata's family is in the process of developing a Farmhouse Scheme in that area by the name of Westyn Park. Hema Malini unveiling the bust of Shri Harakh Chand Nahata In a ceremony held on the occasion of Mahavir Jayanti on 31 March 2007, Hema Malini, an actor, dancer and member of the Rajya, unveiled a bust of Nahata at Mahabalipuram Teerth, Village Bhatti, New Delhi. A commemorative 5-rupee stamp was released by Shri S. C. Jamir, Governor of Maharashtra, on Shri Harakh Chand Nahata on 28 February 2009 in Mumbai to honor his selfless service to society and India On 28 September 2013, a 100 feet wide, 2km prominent road connecting National Highway 89 to Rani Bazaar Industrial Area was named "Harakh Chand Nahata Marg" to honor him and his contributions.

In the ENTSO-E in 2008, over 350,000 megawatt hours were sold per day on the European Energy Exchange (EEX). Each of the interconnects in North America are synchronized at a nominal 60 Hz, while those of Europe run at 50 Hz. Neighbouring interconnections with the same frequency and standards can be synchronized and directly connected to form a larger interconnection, or they may share power without synchronization via high-voltage direct current power transmission lines (DC ties), solid-state transformers or variable-frequency transformers (VFTs), which permit a controlled flow of energy while also functionally isolating the independent AC frequencies of each side. The benefits of synchronous zones include pooling of generation, resulting in lower generation costs; pooling of load, resulting in significant equalizing effects; common provisioning of reserves, resulting in cheaper primary and secondary reserve power costs; opening of the market, resulting in possibility of long term contracts and short term power exchanges; and mutual assistance in the event of disturbances. (See "Operation of Power Systems" link for title page and table of contents.) One disadvantage of a wide-area synchronous grid is that problems in one part can have repercussions across the whole grid.