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127 Sentences With "solders"

How to use solders in a sentence? Find typical usage patterns (collocations)/phrases/context for "solders" and check conjugation/comparative form for "solders". Mastering all the usages of "solders" from sentence examples published by news publications.

That meant lead solders or brass devices couldn't be at fault.
That summer, the rockets killed more than two dozen American solders.
The corrosive water was burning through service lines and solders—and those contained lead.
He said solders, aid workers and state department officials have vouched for their service.
Perhaps it's the fact that Apple solders on all of its main parts on its laptops.
Dorety fabricates all the components, owns and operates all the machinery, and hand-solders the electronic components.
Indonesian solders were on hand in full uniform Saturday to carry the coffin of Anthonius Gunawan Agung.
This story comes from Reddit user MynamesnotChase: I saw a dead solders ghost in my barracks room before I deployed.
The FARC has long been accused by the government and human rights groups of using child solders as cannon fodder.
The silver medals were made up of "leftover mirrors, waste solders and X-ray plates," boasting 92.5 percent purity, according to the IOC.
CAIRO (Reuters) - Eastern Libyan forces said two of their solders were wounded in clashes as they moved on the capital Tripoli on Thursday.
Earlier solders were made of gold and tin, with the tin-lead combination employed in contemporary electronics appearing some time during the Roman empire.
The platoon fired at civilians after being told to kill anything that moved, former solders told investigators, but team leaders enforced a code of silence.
Now Hamas hopes to capitalize on the widespread outrage at images of Gazans being shot by Israeli solders to pressure Israel into making some concessions.
Reagan as their leader and the assistance of foot solders like Viguerie, who would use the list of Goldwater donors to deploy the power of direct
Tensions in Kashmir were exacerbated after more than 40 Indian solders were killed in a suicide attack in February in the Indian-controlled part of the region.
A similar elevation of the everyday can be seen in the art of Michael Kelly Williams, who solders musical instruments and decorative ironworks into uncanny mash-ups.
There's one area, he says, where North and South Korean solders face off with each other — inches apart at times — in the Joint Security Area of Panmunjom.
In addition, he donated $2 million to provide shelters, medical and psychological rehabilitation for child solders and he donated $1 million dollars to help victims of Hurricane Katrina.
"The United States needs to review its solders and elements giving support to terrorists on the ground in a way to avoid a confrontation with Turkey," he said.
There is the triumphal arch of the neoclassicist General Staff Building through which revolutionary solders and sailors ran towards the palace's gates to overthrow the Provisional Government in 1917.
Russian solders walk as a local resident waves with Russian flag outside of a Ukrainian military base in the village of Perevalne, near Simferopol, Crimea, Sunday, March 2, 2014.
Even though North Korea continues to advance its nuclear program, Trump has cited an absence of missile tests and the return of American solders' remains as signs of progress.
Marwand and his cousins immediately set off to look for Budabash, and they run into a series of adventures, dangers, and mythical characters, including thieves and solders, along the way.
The buttons, Dr. Starbuck said, hint at the likelihood the site may have been a burial ground for Revolutionary War solders who had been housed in crude smallpox hospitals nearby.
She shadows physicians perfecting techniques for penis transplants (you may snicker, but losing genitalia to an IED is a scar many solders have had to bear, with few options for reconstruction).
" Soldiers are shown marching, training and having their haircut at Fort Jackson in Columbia as the ad explains "more than 50 percent of U.S. solders got their start at Fort Jackson.
They had other tests ready to deploy, and soon figured out that the water was 20 times more corrosive than water from Detroit; it could eat through lead solders and iron mains.
Indeed, tin usage is facing its own structural challenge from the miniaturization of solders and demand is estimated to have contracted by a little over three percent last year, according to ITRI.
The four solders killed in an ambush in Niger this month had "little to no combat experience," and one of them had never been deployed abroad before, the WSJ's Ben Kesling reports, citing Army records.
The princess lined up shoulder to shoulder with more than 4,500 other guards to parade in sunny conditions that have caused solders in the past to fall to the ground due to the extreme heat.
"Our solders are not at Incirlik because of Turkey, but rather to fight Islamic State," said Julia Obermeier, a member of the Christian Social Union, the Bavarian sister party of Chancellor Angela Merkel's Christian Democrats.
Shurer then fought his way to another group of four more wounded solders that he treated and stabilized before evacuating the group down a mountainside while using his body to shield them from enemy fire.
When investigators cannot get past a lock code, or when a phone is too damaged to turn on, they can use a method called chip-off, which solders the memory chip from the board to recover data.
"During the last 24 hours, thanks to very well-prepared and careful actions, Syrian solders were able to radically change the situation," said Major-General Igor Konashenkov, a defence ministry spokesman, according to the Interfax news agency.
Though she now has a team, Karlstrom still crafts the brand's signature cowslip-shaped blomman charms by hand: She twists, solders and hammers the metal into the form of the official flower of the Aland islands. guldviva.
He gets sent to Vietnam, where he survives the casual racism of his fellow G.I.s, along with a friendly-fire napalm bomb that solders his dog tag to his chest and vaporizes the rest of his squad.
Polish investigators had been working since 2013 to identify a commander of the Ukrainian Self Defense Legion, a Nazi paramilitary police organization, who ordered his solders to kill residents and burn the buildings of three rural villages near Lublin.
These days, the Moscow-based tinkerer and musician solders his chops in robotics, sound art, and science into a succession of experimental musical instruments and modular synthesizers, including robotic-painting machines, a magnetically levitating Bluetooth speaker, and a musical tattoo.
Odd Tinkering gives a detailed explanation of the work in the video's description, detailing how he solders missing lines in the broken screen back to life and his process for cleaning every part of the case and its various components.
In the place of Napoleon, Wiley depicts a young African American man in contemporary dress, swaps David's landscape image for a gold-and-red design, and removes the solders in the background struggling to push a cannon over the Alps.
The saxophone maker, founded in 1885 and based in the same factory in a western Paris suburb for nearly a century, still solders, assembles and polishes manually the 700 brass pieces that compose the woodwind instrument invented by Adolphe Sax.
"The United States needs to review its solders and elements giving support to terrorists on the ground in such a way as to avoid a confrontation with Turkey," Bozdag, who also acts as the government's spokesman, told broadcaster A Haber.
Take for example laptops, which are getting slimmer and lighter every year, and thus, increasingly difficult or impossible to upgrade—Apple solders in the RAM (though you can finally upgrade the storage) for God's sake—and as consumers, we've just come to accept that reality.
MacFarland said on Wednesday that the coalition had trained more than 13,500 members of the Iraqi security forces including over 4,000 Iraqi Army soldiers, 1,500 counter terrorism service solders, 6,000 Peshmerga (Kurdish fighters in northern Iraq), almost 1,000 Federal police and 300 border guards in how to combat the insurgency effectively.
Two types of glass solders are used: vitreous, and devitrifying. Vitreous solders retain their amorphous structure during remelting, can be reworked repeatedly, and are relatively transparent. Devitrifying solders undergo partial crystallization during solidifying, forming a glass-ceramic, a composite of glassy and crystalline phases. Devitrifying solders usually create a stronger mechanical bond, but are more temperature-sensitive and the seal is more likely to be leaky; due to their polycrystalline structure they tend to be translucent or opaque.
Glass solders can be also used as sealants; a vitreous enamel coating on iron lowered its permeability to hydrogen 10 times. Glass solders are frequently used for glass-to-metal seals and glass-ceramic-to-metal seals.
Devitrifying solders are frequently "thermosetting", as their melting temperature after recrystallization becomes significantly higher; this allows soldering the parts together at lower temperature than the subsequent bake-out without remelting the joint afterwards. Devitrifying solders frequently contain up to 25% zinc oxide. In production of cathode ray tubes, devitrifying solders based on PbO-B2O3-ZnO are used. Very low temperature melting glasses, fluid at , were developed for sealing applications for electronics.
The United States Environmental Protection Agency (EPA) has published a life-cycle assessment (LCA) of the environmental impacts of lead-free and tin–lead solder, as used in electronic products. For bar solders, when only lead-free solders were considered, the tin/copper alternative had the lowest (best) scores. For paste solders, bismuth/tin/silver had the lowest impact scores among the lead-free alternatives in every category except non-renewable resource consumption. For both paste and bar solders, all of the lead-free solder alternatives had a lower (better) LCA score in toxicity categories than tin/lead solder.
There are the following companies in the town of Dragoman: KONTAKTNI ELEMENTI JSC (Bulgarian: «КОНТАКТНИ ЕЛЕМЕНТИ» АД) is a company producing bimetallic electrical contact rivets and silver solders, tin-lead solders - 40, 50, 60, zinc and tin anodes. The company was founded in 1980.
The term silver solder denotes the type of solder that is used. Some soft solders are "silver-bearing" alloys used to solder silver-plated items. Lead-based solders should not be used on precious metals because the lead dissolves the metal and disfigures it.
SOPORMETAL is a producer of brazing materials such as silver solders, copper/phosphorus, soft solders and fluxes. Cadmium-free silver solder, special alloys and tri-metal alloys for the entire industry, as well as several special alloys in the form of rod, strips, rings and various preforms. Coated silver solders with different ratios having regard the technology used for brazing and fusion technical parameters. Copper phosphorus alloys with and without silver for all sectors, as well with different types of profiles like rods, plates, strips, wires.
Copper is one of the most important constituents of silver and karat gold solders used in the jewelry industry, modifying the color, hardness and melting point of the resulting alloys. Some lead-free solders consist of tin alloyed with a small proportion of copper and other metals.Balver Zinn Solder Sn97Cu3 . (PDF) . balverzinn.com.
Environmental legislation in many countries, and the whole of the European Community area (see RoHS), has led to a change in formulation of both solders and fluxes. Water-soluble non-rosin-based fluxes have been increasingly used since the 1980s so that soldered boards can be cleaned with water or water- based cleaners. This eliminates hazardous solvents from the production environment, and from factory effluents. Those regulations have also reduced the use of lead based solders, and caused the melting temperatures of solders in use to increase by up to .
About 60% of antimony is consumed in flame retardants, and 20% is used in alloys for batteries, plain bearings, and solders.
In the cases of soldering direct to glasses and ceramics, ultrasonic soldering filler metals need to be modified with active elements such as In, Ti, Hf, Zr and rare earth elements (Ce, La, and Lu). Solders when alloyed with these elements are called “active solders” since they directly act on the glass/ceramic surfaces to create a bond. The use of ultrasonic soldering is expanding, since it is clean and flux-less in combination with active solders being specified for joining assemblies where either corrosive flux can be trapped or otherwise disrupt operation or contaminate clean production environments or there are dissimilar materials/metals/ceramic/glasses being joined. To be effective in adhering to surfaces, active solders’ own nascent oxide on melting need to be disrupted and ultrasonic agitation is well suited.
Sopormetal International Group was founded on February 2, 1985. It began as a Portuguese company supplying brazing materials, silver and copper brazing solders.
The more common lead-free solder systems have a higher melting point, e.g. a 30 °C typical difference for tin-silver-copper alloys, but wave soldering temperatures are approximately the same at ~255 °C; however at this temperature most typical lead-free solders have longer wetting times than eutectic Pb/Sn 37:63 solder. Additionally wetting force is typically lower, which can be disadvantageous (for hole filling), but advantageous in other situations (closely spaced components). Care must be taken in selection of RoHS solders as some formulations are harder with less ductility, increasing the likelihood of cracks instead of plastic deformation, which is typical for lead-containing solders.
One of such compositions is phosphorus pentoxide, lead(II) oxide, and zinc oxide, with addition of lithium and some other oxides. Electrically conductive glass solders can be also prepared.
Triethanolamine, diethanolamine and aminoethylethanolamine are major components of common liquid organic fluxes for the soldering of aluminium alloys using tin-zinc and other tin or lead- based soft solders.
The polypyrrole electrolyte has two fundamental disadvantages. It is toxic in the production of capacitors and becomes unstable at the higher soldering temperatures required for soldering with lead-free solders.
These alloys adhere to lead-tin, tin, and silver solders. Other metals, including copper, molybdenum, nickel, and steel can be spot-welded to the FerNiCo alloys forming low resistance electrical connections.
"Self Healing Structural Alloys - Including Aluminum and Self-Healing Solders," U.S. Patent Application no 8518531, issued on 27 August 2013 to Pradeep K. Rohatgi. 19. "Self Healing aluminum alloys incorporating shape metal alloys and reactive particles", U.S. Patent US9435014 B2, September 2016 to Pradeep K. Rohatgi. 20. "Self- Healing Lead Lead, tin, and their alloys and their alloys and solders, incorporating shape memory alloys, reactive particles and hollow vascular network" US101161026, 12/25/2018, issued to Pradeep K. Rohatgi.
Figure 4 shows a schematic of a typical CPB and a thermal bump for comparison. These structures are similar, with both having copper pillars and solder connections. The primary difference between the two is the introduction of either a P- or N-type thermoelectric layer between two solder layers. The solders used with CPBs and thermal bumps can be any one of a number of commonly used solders including, but not limited to, Sn, SnPb eutectic, SnAg or AuSn.
Solders can be removed using a vacuum plunger (on the right) and a soldering iron. In electronics, desoldering is the removal of solder and components from a circuit board for troubleshooting, repair, replacement, and salvage.
Cadmium is an extremely toxic metal commonly found in industrial workplaces, particularly where any ore is being processed or smelted. Several deaths from acute exposure have occurred among welders who have unsuspectingly welded on cadmium-containing alloys or with silver solders.
Glass solders are frequently used in electronic packaging. CERDIP packagings are an example. Outgassing of water from the glass solder during encapsulation was a cause of high failure rates of early CERDIP integrated circuits. Removal of glass-soldered ceramic covers, e.g.
Ultrasonic welding uses ultrasonic energy to join parts without adding any kind of filler material while ordinary soldering uses external heating to melt filler metal materials, namely solders, to form a joint. Ultrasonic soldering can be done with either a specialized soldering iron or a specialized solder pot. In either case the process can be automated for large-scale production or can be done by hand for prototyping or repair work. Initially, U/S soldering was aimed at joining aluminum and other metals; however, with the emergence of active solders, a much wider range of metals, ceramics and glass can now be soldered.
Thicker gold coatings are usually limited to use with indium-based solders and solders with high gold content. Removal of the oxides from the solder preform is also troublesome. Fortunately some alloys are able to dissolve the surface oxides in their bulk when superheated by several degrees above their melting point; the Sn-Cu1 and Sn-Ag4 require superheating by 18-19 °C, the Sn-Sb5 requires as little as 10 °C, but the Sn-Pb37 alloy requires 77 °C above its melting point to dissolve its surface oxide. The self-dissolved oxide however degrades the solder's properties and increases its viscosity in molten state, this approach is therefore not optimal.
Zinc, cadmium, and even lead whiskers have been documented. Many techniques are used to mitigate the problem including changes to the annealing process (heating and cooling), addition of elements like copper and nickel, and the inclusion of conformal coatings. Traditionally, lead has been added to slow down whisker growth in tin-based solders. Following the Restriction of Hazardous Substances Directive (RoHS), the European Union banned the use of lead in most consumer electronic products from 2006 due to health problems associated with lead and the "high-tech trash" problem, leading to a re-focusing on the issue of whisker formation in lead-free solders.
Replacing lead has many problems, including a higher melting point, and the formation of tin whiskers causing electrical problems. Tin pest can occur in lead-free solders, leading to loss of the soldered joint. Replacement alloys are rapidly being found, although problems of joint integrity remain.
Antimony is used in antifriction alloys (such as Babbitt metal), in bullets and lead shot, electrical cable sheathing, type metal (for example, for linotype printing machines), solder (some "lead-free" solders contain 5% Sb), in pewter, and in hardening alloys with low tin content in the manufacturing of organ pipes.
Carbon can negatively influence some steels. Care must be taken to avoid galvanic corrosion between the braze and the base metal, and especially between dissimilar base metals being brazed together. Formation of brittle intermetallic compounds on the alloy interface can cause joint failure. This is discussed more in-depth with solders.
For soldering n-type semiconductors, solder may be doped with antimony; indium may be added for soldering p-type semiconductors. Pure tin can also be used. Various fusible alloys can be used as solders with very low melting points; examples include Field's metal, Lipowitz's alloy, Wood's metal, and Rose's metal.
DIY audio involves "projects" directed to audio. Many DIY audio people fancy themselves to be audiophiles. These people use rare and expensive parts and components in their projects. Examples are the use of silver wire, expensive capacitors, non-standard solders of various alloys, and use of parts that have been cryogenically cooled.
This is primarily due to the toxicity of lead, and the amount of lead that leaches from printed wiring board assemblies, as determined by the leachability study conducted by the partnership. The study results are providing the industry with an objective analysis of the life-cycle environmental effects of leading candidate alternative lead-free solders, allowing industry to consider environmental concerns along with the traditionally evaluated parameters of cost and performance. This assessment is also allowing industry to redirect efforts toward products and processes that reduce solders' environmental footprint, including energy consumption, releases of toxic chemicals, and potential risks to human health and the environment. Another life-cycle assessment by IKP, University of Stuttgart, shows similar results to those of the EPA study.
Generally low levels of contaminates may include metals from the heating coils, solders, and wick. The metals nickel, chromium, and copper coated with silver have been used to make the normally thin-wired e-cigarette heating elements. The atomizers and heating coils possibly contain aluminum. They likely account for most of the aluminum in the e-cigarette vapor.
RoHS helps reduce damage to people and the environment in third- world countries where much of today's "high-tech waste" ends up. The use of lead-free solders and components reduces risks to electronics industry workers in prototype and manufacturing operations. Contact with solder paste no longer represents the same health hazard as it used to.
Circuit boards contain considerable quantities of lead-tin solders that are more likely to leach into groundwater or create air pollution due to incineration. In US landfills, about 40% of the lead content levels are from e-waste. The processing (e.g. incineration and acid treatments) required to reclaim these precious substances may release, generate, or synthesize toxic byproducts.
Pure tin has no structural uses.Russell & Lee 2005, pp. 402, 405 It is used in lead-free solders, and as a hardening agent in alloys of other metals, such as copper, lead, titanium and zinc.Russell & Lee 2005, p. 402, 407 Lead is a soft metal (MH 1.5, but hardens close to melting) which, in many cases,Alhassan & Goodwin 2005, p.
In the 1980s Engelmaier proposed a model,Engelmaier, W., "Fatigue Life of Leadless Chip Carrier Solder Joints During Power Cycling", Components, Hybrids, and Manufacturing Technology, IEEE Transactions on, vol.6, no.3, pp. 232-237, September 1983 in conjunction with the work of Wild,Wild, R. N., "Some Fatigue Properties of Solders and Solder Joints", IBM Tech. Rep. 73Z000421, January 1973.
Solutions of methanesulfonic acid are used for the electroplating of tin and tin-lead solders. It is displacing the use of fluoroboric acid, which releases corrosive and volatile hydrogen fluoride. Methanesulfonic acid is also a primary ingredient in rust and scale removers. It is used to clean off surface rust from ceramic, tiles and porcelain which are usually susceptible to acid attack.
Antimony compounds are prominent additives for chlorine and bromine containing fire retardants found in many commercial and domestic products. The largest application for metallic antimony is as alloying material for lead and tin. It improves the properties of the alloys which are used as in solders, bullets and ball bearings. An emerging application is the use of antimony in microelectronics.
This may include investigation, recommendation of treatment, installation of treatment, checking of source water, removal of lead containing plumbing, and public education. The site selection process prioritizes sites by the likelihood of finding high lead concentrations which could impact people. Building codes and building records may be used to estimate the types of plumbing and solders at various buildings. Residential buildings are preferred over commercial, for sampling.
The BIS system of hallmarking of gold jewellery began in April 2000. The standard specifications governing this system are IS 1417 (Grades of Gold and Gold Alloys, Jewellery/Artefacts), IS 1418 (Assaying of Gold in Gold Bullion, Gold alloys and Gold Jewellery/Artefacts), IS 2790 (Guidelines for Manufacture of 23,22,21,20,19,19,17,16,14 and 9 carat Gold Alloys), IS 3095 (Gold solders for use in manufacture of jewellery).
New uses were found in fusible alloys, solders, and electronics. In the 1950s, tiny beads of indium were used for the emitters and collectors of PNP alloy-junction transistors. In the middle and late 1980s, the development of indium phosphide semiconductors and indium tin oxide thin films for liquid-crystal displays (LCD) aroused much interest. By 1992, the thin-film application had become the largest end use.
Removal of the native oxide layer is more troublesome; physical or chemical cleaning methods have to be employed and the surfaces can be protected by e.g. gold plating. The gold layer has to be sufficiently thick and non-porous to provide protection for reasonable storage time. Thick gold metallization also limits choice of soldering alloys, as tin- based solders dissolve gold and form brittle intermetallics, embrittling the joint.
Indium was isolated the next year. Indium is a minor component in zinc sulfide ores and is produced as a byproduct of zinc refinement. It is most notably used in the semiconductor industry, in low-melting-point metal alloys such as solders, in soft-metal high-vacuum seals, and in the production of transparent conductive coatings of indium tin oxide (ITO) on glass. Indium is considered a technology-critical element.
The solders are even more corrosive than with aluminium, and the parts should never be required to withstand stress. Riveted joints in magnesium alloy structures usually employ aluminium or aluminium- magnesium alloy rivets. Magnesium rivets are not often used because they must be driven when hot. The rivet holes should be drilled, especially in heavy sheet and extruded sections, since punching tends to give a rough edge to the hole and to cause stress concentrations.
The D620/D630 and D820/D830 were available with an Intel integrated GMA or Nvidia graphics chip. Most Nvidia models will suffer from early failure of the graphics chip due to the switch to lead-free solder and "underfill" of the BGA. The computer industry at the time had just switched to lead-free solders without redesigning cooling systems. This in turn led to undesirable heating cycles of the more brittle solder causing micro fractures to quickly form.
The adoption of lead-free solders and lead-free soldering motivated the further development and application of immersion silver plating. Immersion silver improves wettability and solderability.Wang, Weiqiang, Anupam Choubey, Michael H. Azarian and Michael Pecht, (2009). An Assessment of Immersion Silver Surface Finish for Lead-Free Electronics, Journal of Electronic Materials, Vol. 38(6), 815-827 Mixed flowing gas testing failed to alert the electronics manufacturing industry to weaknesses in immersion silver plating (for example, see Reference 7).
Potential reliability concerns were addressed in Annex item #7 of the RoHS directive, granting some specific exemptions from regulation until 2010. These issues were raised when the directive was first implemented in 2003 and reliability effects were less known. Another potential problem that some lead-free, high tin-based solders may face is the growth of tin whiskers. These thin strands of tin can grow and make contact with an adjacent trace, developing a short circuit.
The temperature range in which creep deformation may occur differs in various materials. Creep deformation generally occurs when a material is stressed at a temperature near its melting point. While tungsten requires a temperature in the thousands of degrees before creep deformation can occur, lead may creep at room temperature, and ice will creep at temperatures below 0 °C (32 °F). Plastics and low-melting-temperature metals, including many solders, can begin to creep at room temperature.
Fine grain size gives eutectics both increased strength and increased ductility. Highly accurate melting temperature lets joining process be performed only slightly above the alloy's melting point. On solidifying, there is no mushy state where the alloy appears solid but is not yet; the chance of disturbing the joint by manipulation in such state is reduced (assuming the alloy did not significantly change its properties by dissolving the base metal). Eutectic behavior is especially beneficial for solders.
Memory, drives, and batteries were accessible in the old MacBook lineup, though the newest compact lineup solders or glues all such components in place. All of the current MacBooks feature backlit keyboards. The MacBook was discontinued from February 2012 until March 2015, when a new model featuring an ultraportable design and an all-metal enclosure was introduced. It was again discontinued in July 2019 following a price reduction of the 3rd generation MacBook Air and discontinuation of the 2nd generation model.
For some time, China has been the largest producer of antimony and its compounds, with most production coming from the Xikuangshan Mine in Hunan. The industrial methods for refining antimony are roasting and reduction with carbon or direct reduction of stibnite with iron. The largest applications for metallic antimony are an alloy with lead and tin and the lead antimony plates in lead–acid batteries. Alloys of lead and tin with antimony have improved properties for solders, bullets, and plain bearings.
Glass solders are available as frit powder with grain size below 60 micrometers. They can be mixed with water or alcohol to form a paste for easy application, or with dissolved nitrocellulose or other suitable binder for adhering to the surfaces until being melted. The eventual binder has to be burned off before melting proceeds, requiring careful firing regime. The solder glass can be also applied from molten state to the area of the future joint during manufacture of the part.
If multiple joints are needed, then the jeweler will start with hard or extra-hard solder and switch to lower-temperature solders for later joints. Silver solder is somewhat absorbed by the surrounding metal, resulting in a joint that is actually stronger than the metal being joined. The metal being joined must be perfectly flush, as silver solder cannot normally be used as a filler and will not fill gaps. Another difference between brazing and soldering is how the solder is applied.
Although lead is a known poison, the mechanical and chemical characteristics of the metal continue to keep lead as an important component in many products. In water supply, lead's durability and workability made it preferable for use as water pipes (as compared to, for example, iron pipes). Lead alloys (bronze, brass) are used for plumbing fittings, and lead solders were also preferred. While state and local governments began to prohibit installation of lead pipes early in the twentieth century, lead alloys continued to be used.
The formation of CAFs usually begins by poor glass-resin bonding; a layer of adsorbed moisture then provides a channel through which ions and corrosion products migrate. In presence of chloride ions, the precipitated material is atacamite; its semiconductive properties lead to increased current leakage, deteriorated dielectric strength, and short circuits between traces. Absorbed glycols from flux residues aggravate the problem. The difference in thermal expansion of the fibers and the matrix weakens the bond when the board is soldered; the lead-free solders which require higher soldering temperatures increase the occurrence of CAFs.
If the work is to be of hallmarking quality, the gold solder alloy must match the fineness (purity) of the work, and alloy formulas are manufactured to color-match yellow and white gold. Gold solder is usually made in at least three melting-point ranges referred to as Easy, Medium and Hard. By using the hard, high-melting point solder first, followed by solders with progressively lower melting points, goldsmiths can assemble complex items with several separate soldered joints. Gold can also be made into thread and used in embroidery.
Radiography of a swan found dead in alt=An X-ray picture with numerous small pellets highlighted in white By the mid-1980s, there was significant decline in the use of lead in industry. In the United States, environmental regulations reduced or eliminated the use of lead in non-battery products, including gasoline, paints, solders, and water systems. Particulate control devices were installed in coal-fired power plants to capture lead emissions. In 1992, U.S. Congress required the Environmental Protection Agency to reduce the blood lead levels of the country's children.
In conventional alloy design, one primary element such as iron, copper, or aluminum is chosen for its properties. Then, small amounts of additional elements are added to improve or add properties. Even among binary alloy systems, there are few common cases of both elements being used in nearly-equal proportions such as Pb-Sn solders. Therefore, much is known from experimental results about phases near the edges of binary phase diagrams and the corners of ternary phase diagrams and much less is known about phases near the centers.
Whisker growth is even observable for lead-based solders, albeit on a much smaller scale. Some countries have exempted medical and telecommunication infrastructure products from the legislation. However, this may be a moot point, since as electronic component manufacturers convert their production lines to producing only lead-free parts, conventional parts with eutectic tin-lead solder will simply not be available, even for military, aerospace and industrial users. To the extent that only solder is involved, this is at least partially mitigated by many lead-free components' compatibility with lead-containing solder processes.
Pewter, which is an alloy of 85–90% tin with the remainder commonly consisting of copper, antimony and lead, was used for tableware from the Bronze Age until the 20th century. In modern times tin is used in many alloys, most notably tin/lead soft solders, typically containing 60% or more of tin. Another large application for tin is corrosion-resistant tin plating of steel. Because of its low toxicity, tin-plated metal is also used for food packaging, giving the name to tin cans, which are made mostly of steel.
A typical computer monitor may contain more than 6% lead by weight, much of which is in the lead glass of the cathode ray tube (CRT). A typical 15 inch (38 cm) computer monitor may contain of lead but other monitors have been estimated to have up to of lead. Circuit boards contain considerable quantities of lead-tin solders that are more likely to leach into groundwater or create air pollution due to incineration. In US landfills, about 40% of the lead content levels are from e-waste.
Flux-less soldering with aid of conventional soldering iron, ultrasonic soldering iron or specialized solder pot and active solder that contains an active element, most often titanium, zirconium or chromium. The active elements, owing to mechanical activation, react with the surface of the materials generally considered difficult to solder without premetallization. The active solders can be protected against excessive oxidation of their active element by addition of rare earth elements with higher affinity to oxygen (typically cerium or lanthanum). Another common additive is gallium – usually introduced as a wetting promoter.
Assuming it is molded, multiples of the piece are cast from the mold. See lost-wax casting, which article has a sculptural inclination, though the principles are the same for jewelry casting. The cast pieces will likely need a variety of work done to them, including filing to remove the skin left from casting and prepare for polishing, straightening parts, rounding and sizing rings, and assembling many various parts together using solder. Although the method used is called soldering, it is actually a form of brazing, using "solders" of the metal being worked, i.e.
Thermal expansion mismatch between the printed circuit board material and its packaging strains the part-to-board bonds; while leaded parts can absorb the strain by bending, leadless parts rely on the solder to absorb stresses. Thermal cycling may lead to fatigue cracking of the solder joints, especially with elastic solders; various approaches are used to mitigate such incidents. Loose particles, like bonding wire and weld flash, can form in the device cavity and migrate inside the packaging, causing often intermittent and shock-sensitive shorts. Corrosion may cause buildup of oxides and other nonconductive products on the contact surfaces.
Lead oxide also facilitates solubility of other metal oxides and is used in colored glass. The viscosity decrease of lead glass melt is very significant (roughly 100 times in comparison with soda glass); this allows easier removal of bubbles and working at lower temperatures, hence its frequent use as an additive in vitreous enamels and glass solders. The high ionic radius of the Pb2+ ion renders it highly immobile and hinders the movement of other ions; lead glasses therefore have high electrical resistance, about two orders of magnitude higher than soda-lime glass (108.5 vs 106.5 Ω⋅cm, DC at 250 °C).
Body solder is a type of solder used to smooth the surface of automobile bodies before painting. It has been largely supplanted by polyester body fillers, such as Bondo, and others, but many purists and auto customizers continue to use body solder, asserting that it bonds better to sheet metal, feels better, wears better, resists higher temperatures, and can be powder coated or otherwise chemically plated. Body solder is available in both leaded and lead-free formulas from most suppliers of auto customization parts and tools. Leaded body solders usually are an alloy of lead and 2 to 10% tin.
Adverse effects on product quality and reliability, plus high cost of compliance (especially to small business) are cited as criticisms of the directive, as well as early research indicating that the life cycle benefits of lead-free solder versus traditional solder materials are mixed. Criticism earlier on came from an industry resistant to change and a misunderstanding of solders and soldering processes. Deliberate misinformation was espoused to resist what was perceived as a "non-tariff barrier created by European bureaucrats." Many believe the industry is stronger now through this experience and has a better understanding of the science and technologies involved.
EPA illustration of lead sources in residential buildings The 1986 amendments require EPA to set standards limiting the concentration of lead in public water systems, and defines "lead free" pipes as: :(1) solders and flux containing not more than 0.2 percent lead; :(2) pipes and pipe fittings containing not more than 8.0 percent lead; and :(3) plumbing fittings and fixtures as defined in industry-developed voluntary standards (issued no later than August 6, 1997), or standards developed by EPA in lieu of voluntary standards.Safe Drinking Water Act. "Prohibition on use of lead pipes, solder, and flux." .
A coil of lead-free solder wire Tin has long been used in alloys with lead as solder, in amounts 5 to 70% w/w. Tin with lead forms a eutectic mixture at the weight proportion of 61.9% tin and 38.1% lead (the atomic proportion: 73.9% tin and 26.1% lead), with melting temperature of 183 °C (361.4 °F) . Such solders are primarily used for joining pipes or electric circuits. Since the European Union Waste Electrical and Electronic Equipment Directive (WEEE Directive) and Restriction of Hazardous Substances Directive came into effect on 1 July 2006, the lead content in such alloys has decreased.
James G. Blunt, commander of the Union forces at the Battle of Honey Springs was particularly impressed by the performance of the 1st Kansas Colored Infantry at that engagement. They repulsed a Confederate charge, inflicting many casualties, and, after Colonel Williams was badly wounded, continued to fight and made an orderly withdrawal. Afterwards, he wrote: "I never saw such fighting as was done by the Negro regiment....The question that negroes (sic) will fight is settled; besides they make better solders in every respect than any troops I have ever had under my command."Honey Springs, Elk Creek, Shaw's Inn - Civil War Oklahoma American Civil War July 17, 1863.
These properties, combined with its relative abundance and low cost, resulted in its extensive use in construction, plumbing, batteries, bullets and shot, weights, solders, pewters, fusible alloys, white paints, leaded gasoline, and radiation shielding. In the late 19th century, lead's toxicity was recognized, and its use has since been phased out of many applications. However, many countries still allow the sale of products that expose humans to lead, including some types of paints and bullets. Lead is a neurotoxin that accumulates in soft tissues and bones; it damages the nervous system and interferes with the function of biological enzymes, causing neurological disorders, such as brain damage and behavioral problems.
It is also used for making particularly low melting point alloys, and is a component in some lead-free solders. Indium is not known to be used by any organism. In a similar way to aluminium salts, indium(III) ions can be toxic to the kidney when given by injection, but oral indium compounds do not have the chronic toxicity of salts of heavy metals, probably due to poor absorption in basic conditions. Radioactive indium-111 (in very small amounts on a chemical basis) is used in nuclear medicine tests, as a radiotracer to follow the movement of labeled proteins and white blood cells in the body.
The first tin alloy used on a large scale was bronze, made of tin and copper, from as early as 3000 BC. After 600 BC, pure metallic tin was produced. Pewter, which is an alloy of 85–90% tin with the remainder commonly consisting of copper, antimony, and lead, was used for flatware from the Bronze Age until the 20th century. In modern times, tin is used in many alloys, most notably tin / lead soft solders, which are typically 60% or more tin, and in the manufacture of transparent, electrically conducting films of indium tin oxide in optoelectronic applications. Another large application for tin is corrosion-resistant tin plating of steel.
Desoldering a contact from a wire Soldering (AmE: , BrE: ) is a process in which two or more items are joined together by melting and putting a filler metal (solder) into the joint, the filler metal having a lower melting point than the adjoining metal. Unlike welding, soldering does not involve melting the work pieces. In brazing, the work piece metal also does not melt, but the filler metal is one that melts at a higher temperature than in soldering. In the past, nearly all solders contained lead, but environmental and health concerns have increasingly dictated use of lead-free alloys for electronics and plumbing purposes.
Although the term bench jeweler is a contemporary term with vague meaning, it often is used to describe a jeweler who has a larger set of skills than that of a production worker who merely files and solders rings. Thus they may have a fair knowledge of stonesetting, a bit of engraving, and perhaps other skills that widen their abilities. For a long time throughout history the model was as described above under "Anatomy of a Jewelry Shop", with a fairly strict delineation of responsibilities. In the modern day, there are a great many jewelers who do it all, from design to stonesetting to finishing with fair ability.
In applications where the area of the solder joint is a small or band, U/S soldering using 1 – 10 mm tips can be very effective since the volume of molten metal is small and can effectively be agitated by the 1 – 10 mm U/S soldering iron tips. The figures in this article show the U/S soldering equipment (power supply and soldering tools-tips) and the application of solder to glass using U/S solder iron tips. In other larger surface bonding application, wide, heated U/S tips are being used to spread and wet active solders on large aluminum surfaces (and is applicable to other metal, ceramic and glass surfaces).
A cut piece of cloth (the appliqué) is placed above the base material that is in the embroidery machine (having a first seam reference), is fixed and finally embroidered. More recently, the manual method of cutting has been replaced by the laser cutting technology, laser plotters first, and then by laser bridges. The laser ensures better accuracy compared to manual cutting. It allows users to imitate a jagged or irregular cut as if done by hand, with the advantage that the laser solders the borders of synthetic fiber, avoiding unpleasant unthreading. The combination “laser plus embroidery machine” offered by the laser bridge also avoids double work: no longer is it necessary to cut by hand after embroidering appliqués.
This soldering tip can melt solder filler metals as acoustic vibrations are induced in the molten solder pool. The vibration and cavitation in the molten solder then permits solders to wet and adhere to many metal surfaces. The acoustic energy created by the solder tip or ultrasonic solder pot works via cavitation of the molten solder which mechanically disrupts oxide layers on the solder layers themselves and on metal surfaces being joined. Cavitation in the molten solder pool can be very effective in disrupting the oxides on many metals, however, it is not effective when soldering to ceramics and glass since they themselves are oxides or other non- metal compound that cannot be disrupted since they are the base materials.
Indium's uses can be divided into four categories: the largest part (70%) of the production is used for coatings, usually combined as indium tin oxide (ITO); a smaller portion (12%) goes into alloys and solders; a similar amount is used in electrical components and in semiconductors; and the final 6% goes to minor applications. Among the items in which indium may be found are platings, bearings, display devices, heat reflectors, phosphors, and nuclear control rods. Indium tin oxide has found a wide range of applications, including glass coatings, solar panels, streetlights, electrophosetic displays (EPDs), electroluminescent displays (ELDs), plasma display panels (PDPs), electrochemic displays (ECs), field emission displays (FEDs), sodium lamps, windshield glass and cathode ray tubes, making it the single most important indium compound.
One of the major differences between lead-containing and lead-free solder pastes is the "flow" of the solder in its liquid state. Lead-containing solder has a lower surface tension, and tends to move slightly to attach itself to exposed metal surfaces that touch any part of the liquid solder. Lead-free solder conversely tends to stay in place where it is in its liquid state, and attaches itself to exposed metal surfaces only where the liquid solder touches it. This lack of "flow" – while typically seen as a disadvantage because it can lead to lower quality electrical connections – can be used to place components more tightly than they used to be placed due to the properties of lead-containing solders.
Cracks can occur due to thermal or mechanical forces acting on components or the circuit board, the former being more common during manufacturing and the latter in the field. RoHS solders exhibit advantages and disadvantages in these respects, dependent on packaging and formulation. The editor of Conformity Magazine wondered in 2005 if the transition to lead-free solder would affect long-term reliability of electronic devices and systems, especially in applications more mission- critical than in consumer products, citing possible breaches due to other environmental factors like oxidation. The 2005 Farnell/Newark InOne "RoHS Legislation and Technical Manual", cites these and other "lead-free" solder issues, such as: # Warping or delamination of printed circuit boards; # Damage to through-holes, ICs and components on circuit boards; and, # Added moisture sensitivity, all of which may compromise quality and reliability.
Furthermore, the mass prototypes produced by ion deposition techniques would have been nothing like the freestanding platinum- iridium prototypes currently in use; they would have been deposited onto—and become part of—an electrode imbedded into one pan of a special balance integrated into the device. Moreover, the ion-deposited mass wouldn't have had a hard, highly polished surface that can be vigorously cleaned like those of current prototypes. Gold, while dense and a noble metal (resistant to oxidation and the formation of other compounds), is extremely soft so an internal gold prototype would have to be kept well isolated and scrupulously clean to avoid contamination and the potential of wear from having to remove the contamination. Bismuth, which is an inexpensive metal used in low- temperature solders, slowly oxidises when exposed to room-temperature air and forms other chemical compounds and so would not have produced stable reference masses unless it was continually maintained in a vacuum or inert atmosphere.

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