166 Sentences With "heatsink" | Random Sentence Generator

You spend hours comparing damage values, gear weight, heatsink qualities.

The blades also serve as a heatsink and a strengthening component.

You apply thermal paste to this lid and then put on your heatsink.

On top of this, a large heatsink helps cool the GPU and the CPU.

Enter the heatsink, which is actually more clever that it appears to be at first glance.

A hidden copper tube serves as a heatsink for the Lightcycle's LEDs, extending their life expectancy.

The Mini comes with a 90mm fan that directly touches the GPU and an aluminum heatsink.

The listed parts include a CPU heatsink, a graphics processing module, and a computer frame and enclosure.

Furthermore, despite the copper thermal heatsink and jet turbines for fans, the palm rest gets uncomfortably hot.

The only real way to keep a CPU cool is something like this Scythe Kabuto 3 heatsink.

The heatsink is made from aluminum, most likely because it's a more cost-effective material than copper.

Judging from Google's photographs, it seems like there's not room for significant amounts of memory under that heatsink.

The back of the phone's case already features a built-in heatsink, but no, that's just not enough.

Gigabyte's latest Brix GB-EKi3A-7100 barebones PC, spotted by Liliputing, is basically a heatsink with a computer inside it.

A copper tube connected to the Lightcycle's LEDs serves as a heatsink, ensuring color accuracy and improving their overall lifespan.

As the data center is surrounded by cold water, Microsoft is confident that the sea will act as a giant heatsink.

Components of a traditional CPU are all on one level so they can all have contact with the heatsink and stay cooler.

The plates then transfer heat from inside the acoustic chambers to the heatsink attached on the other side, siphoning the heat away.

One of the most easily identifiable components is the gigantic heatsink (the gigantic copper piece) that runs through the middle of the system.

The heatsink is primarily used to cool the custom Nvidia Tegra processor, which runs hot, given its small size and high processing power.

Or if you try to close the ultra-slim case with an 8-inch-tall heatsink on your overclocked CPU, it'll just clank.

Before, the company had to solder dozens of circuits connected to a big (by drone standards) three-layer motherboard with its own heatsink and fan.

Nagisetty stresses that careful consideration has to be made in the designing of these chips to make sure that the hottest components are closest to the heatsink.

Image: IntelTypically chips are laid out on a horizontal plane so each part of the chip can make contact with the heatsink and keep nice and cool.

You know Asus is serious about crunching pixels and pwning noobs on the ROG Phone because every devices comes packaged with a clip-on heatsink and fan.

It&aposs made up of a massive heatsink, along with a selection of small controls and the main connections, including a power cable and a Ethernet port.

There's an air intake on the top of the chassis next to the Gorilla Glass-covered heatsink and fan that takes up the rear half of the computer.

A redesigned blue array shapes and controls the light while the backside of the display acts as a heatsink to allow the display 1000 nits of fullscreen brightness indefinitely.

To prevent components from being damaged—or melting—each of those microchips has its own spiky-looking heatsink, and an array of fans pushes hot air out of the machine.

This heatpipe-assisted heatsink, made by Cooler Master, won't come in the box with the Threadripper, but it's representative of the sort of cooling system you'd need to keep one running.

There's probably a lot that's obscured by the large metal heatsink that is the TPU's most prominent visual feature and which is used to conduct heat away from the chip itself.

That's according to Asus, which was busy investigating its Radeon RX 5700-series graphics cards' reportedly hot temperatures when it discovered that adding additional pressure to the heatsink could cool those GPUs down.

There were some things about my build that were different from the guide, like my CPU Corsair Hydro Series H100i water cooling system, which, unlike a standard heatsink, doesn't require applying thermal paste.

What these liars don't tell you is that you basically need three hands to push a water cooling unit into place while twisting the heatsink away and screwing it in at the same time.

Now for the catch I alluded to at the top of this review: I beg you, do not use the heatsink and fan combo cooler AMD has included with the latest generation of Ryzen processors.

"I had to literally cut a hole into my gen 2, change the thermal paste and attach a heatsink with some thermal putty to stop it from overheating after an hour," claims one Reddit user.

Now, Bry proudly holds up a single-layer board with all of the chips on one side and explains how the Skydio 2's blue magnesium alloy frame acts as a heatsink to cool them all at once.

The iFixIt teardown of the 2018 MacBook Pro, above, reveals the problem: every inch of this machine is full of hardware, which competes with the fans and miniaturized heatsink that's layered at the top edge of the machine to cool it.

The new MacBook Pro also has more powerful, 9th-generation Intel Core processors with 6 or 8 cores, up to 64GB of memory, and AMD Radeon Pro 5000M series graphics, as well as a new thermal design, with a larger heatsink and better airflow.

The primary heatsink is the Meuse river while the secondary heatsink is water from underground water tables.

This in itself did not improve thermal conductivity, since it added another layer of metal and thermal paste between the die and the heatsink, but it greatly assisted in holding the heatsink flat against the die. Earlier Coppermines without the IHS made heatsink mounting challenging. If the heatsink was not situated flat against the die, heat transfer efficiency was greatly reduced. Some heatsink manufacturers began providing pads on their products, similar to what AMD did with the "Thunderbird" Athlon to ensure that the heatsink was mounted flatly.

STMicroelectronics ST5x86-100. The IBM 5x86 with blue heatsink.

This is usually quoted as the thermal resistance from junction to case of the semiconductor device. The units are °C/W. For example, a heatsink rated at 10 °C/W will get 10 °C hotter than the surrounding air when it dissipates 1 Watt of heat. Thus, a heatsink with a low °C/W value is more efficient than a heatsink with a high °C/W value.

This model is similar to the PX10000G, but uses the 500 MHz VIA Eden ULV CPU. There are two versions of this model, the PX5000G, which has a fan-assisted heatsink, and the PX5000EG, which has a fanless heatsink.

Passive cooling involves no fan noise as convection forces move air over the heatsink.

If a MOSFET transistor produces more heat than the heatsink can dissipate, then thermal runaway can still destroy the transistors. This problem can be alleviated to a degree by lowering the thermal resistance between the transistor die and the heatsink. See also Thermal Design Power.

G200 was Matrox's first graphics processor to require added cooling in the form of a heatsink.

A fan with high static pressure is more effective at forcing air through restricted spaces, such as the gaps between a radiator or heatsink; static pressure is more important than airflow in CFM when choosing a fan for use with a heatsink. The relative importance of static pressure depends on the degree to which the airflow is restricted by geometry; static pressure becomes more important as the spacing between heatsink fins decreases. Static pressure is usually stated in either mm Hg or mm H2O.

CPU fan Thermalright Le Grand Macho RT functioning. Used to cool the CPU (central processing unit) heatsink. Effective cooling of a concentrated heat source such as a large-scale integrated circuit requires a heatsink, which may be cooled by a fan; use of a fan alone will not prevent overheating of the small chip.

Usually a heatsink is attached to the integrated heat spreader (IHS), essentially a large, flat plate attached to the CPU, with conduction paste layered between. This dissipates or spreads the heat locally. Unlike a heatsink, a spreader is meant to redistribute heat, not to remove it. In addition, the IHS protects the fragile CPU.

2 The heatsink is directly attached to the package, secured by nuts attached to two studs protruding from the tungsten heat spreader.

Passive heatsink cooling involves attaching a block of machined or extruded metal to the part that needs cooling. A thermal adhesive may be used. More commonly for a personal computer CPU, a clamp holds the heatsink directly over the chip, with a thermal grease or thermal pad spread between. This block has fins and ridges to increase its surface area.

Illustrative image of a shim. A CPU shim (also called CPU spacer) is a shim used between the CPU and the heat sink in a computer. Shims make it easier and less risky to mount a heatsink on the processor because it stabilizes the heatsink, preventing accidental damaging of the fragile CPU packaging. They help distribute weight evenly over the surface.

A finned air cooled heatsink with fan clipped onto a CPU, with a smaller passive heatsink without fan in the background A 3-fan heatsink mounted on a video card to maximize cooling efficiency of the GPU and surrounding components Commodore 128DCR computer's switch-mode power supply, with a user- installed 40 mm cooling fan. Vertical aluminium profiles are used as heatsinks. Computer cooling is required to remove the waste heat produced by computer components, to keep components within permissible operating temperature limits. Components that are susceptible to temporary malfunction or permanent failure if overheated include integrated circuits such as central processing units (CPUs), chipsets, graphics cards, and hard disk drives.

The TPU ASICs are mounted in a heatsink assembly, which can fit in a hard drive slot within a data center rack, according to Norman Jouppi.

A water block is better at dissipating heat than an air-cooled heatsink due to water's higher specific heat capacity and thermal conductivity. The water is usually pumped through to a radiator which allows a fan pushing air through it to take the heat created from the device and expel it into the air. A radiator is more efficient than a standard CPU or GPU heatsink/air cooler at removing heat because it has a much larger surface area. Installation of a water block is also similar to that of a heatsink, with a thermal pad or thermal grease placed between it and the device being cooled to aid in heat conduction.

This does not normally pose a problem when using isolated heatsinks, but an electrically- insulating pad or sheet may be required to electrically isolate the component from the heatsink if the heatsink is grounded or otherwise non-isolated. The material used to electrically isolate the multi-leaded power package, like mica, needs to have a high thermal conductivity. In applications where vertical clearance is at a premium (such as ISA cards in computers), it is often feasible to bend the leads at a right angle and mount the component flat to the printed wiring board using a screw and nut. This often provides enough surface area to heatsink the component when power dissipation is moderately high.

PGA package PPGA package. Uncapped Pentium Pro 256 KB Pentium II Overdrive with heatsink removed. Flip-chip Deschutes core is on the left. 512 KB cache is on the right.

This socket is a 495 pin CPU socket designed to house any processor in the Socket 495 package. The socket has a 1.27mm pitch and is designed to support a heatsink.

CPU shims are not common at all in OEM computers, but are used by some computer hardware enthusiasts who may use heavier heatsinks because they wish to have a cooler or less noisy system or perhaps to overclock the CPU for better performance. A heavy heatsink puts more pressure on the CPU and motherboard. Shims are very useful for people who often change CPU, heatsink and/or cooling solutions, or use a heatsink that is heavier than the CPU manufacturer's recommended weight. CPU shims are nowadays largely obsolete because most modern processors designed for home users since the introduction of the Athlon 64 and Pentium 4 have an Integrated Heat Spreader (IHS) which prevents the CPU core from being accidentally broken.

Besides regular primary level safety systems, in common with most nuclear power plants in the world, Tihange has secondary level safety systems that can autonomously keep the power plant safe during large external accidents such as the crash of an aircraft, external explosions or loss of the primary level. The primary level systems have two or three redundant trains of safety. The secondary level systems are 3x50% or 2x100%. and have their own heatsink separate from the primary heatsink.

Besides regular primary level safety systems, in common with most nuclear power plants in the world, Doel has secondary level safety systems that can autonomously keep the power plant safe during large external accidents such as the crash of an aircraft, external explosions or loss of the primary level. The primary level systems have a redundancy of three or four times. The secondary level systems are 2x100% or 3x50%. and have their own heatsink separate from the primary heatsink, the Scheldt river.

In an EE380 talk,video archive an Asus engineer mentioned that the Eee PC uses the keyboard shielding as a heat sink to absorb the heat generated by the processor. Three chips need heatsinking, and this is achieved by heat- conductive adhesive pads which sit between the chip heatsink flats and the keyboard shield and connect them thermally. It is important to ensure that the heatsink pads are replaced correctly after maintenance such as cleaning or replacing the fan. The Eee PC has a fan and vents to cool off the system.

Heat pipes have a much higher effective thermal conductivity than solid materials. For use in computers, the heatsink on the CPU is attached to a larger radiator heatsink. Both heatsinks are hollow, as is the attachment between them, creating one large heat pipe that transfers heat from the CPU to the radiator, which is then cooled using some conventional method. This method is expensive and usually used when space is tight, as in small form-factor PCs and laptops, or where no fan noise can be tolerated, as in audio production.

With an "infinite" heatsink, that is: when the case temperature is certain to be 25 degrees, the power rating is about 115 W (some manufacturers specify 117 W), but most applications (and certainly when the ambient temperature is high) a significantly lower power rating would be expected, as per the manufacturer's power derating curve. The device is designed to operate with an efficient heatsink, but care must be taken to mount the device properly, else physical damage or worsened power handling may result, especially with cases or heatsinks that are not perfectly flat.

The clip that releases the fan is visible in the first photo, at the top left corner of the CPU. The central plastic "column" that leads from the center of the fan houses the fan wiring and leads down the side of the heatsink at this corner. The small plastic points at each top left of this column are the locking mechanism for the fan and are released by squeezing them. The opposite corner of the CPU has a latch that locks the fan around underneath the heatsink, by swinging into place upon assembly.

For LGA 775, the distance between the screw-holes for the heatsink is 72 mm. Such heat-sinks are not interchangeable with heatsinks for sockets that have a distance of 75 mm, such as LGA 1156, 1155, 1150, 1151.

The 4 holes for fastening the heatsink to the motherboard are placed in a square with a lateral length of 75 mm for Intel's sockets LGA 1156, LGA 1155, LGA 1150 and LGA 1151\. Cooling solutions should therefore be interchangeable.

Versions were produced with 512 KB, 1 MB or 2 MB L2 caches by varying the number of 512 KB chips incorporated on the board.Pabst, Thomas. Intel's Pentium II Xeon Processor, Tom's Hardware, July 2, 1998. Pentium II Overdrive without heatsink.

It includes both the air cooler based on a heatpipe architecture as well as the water cooling solutions. Alpine Alpine is a trademark of ARCTIC for its line of CPU coolers based on Aluminum extrusion heatsink. It includes both active and passive coolers.

The 4 holes for fastening the heatsink to the motherboard are placed in a square with a lateral length of 75 mm for Intel's sockets LGA 1156, LGA 1155, LGA 1150, LGA 1151 and LGA 1200\. Cooling solutions should therefore be interchangeable.

The 4 holes for fastening the heatsink to the motherboard are placed in a rectangle with lateral lengths of 48 mm and 96 mm for AMD's sockets Socket AM2, Socket AM2+, Socket AM3, Socket AM3+ and Socket FM2. Cooling solutions should therefore be interchangeable.

Although other companies have produced dual concentric speakers since then, Tannoy was the first company to register the term "dual concentric." Amplifer technologists at Lab.gruppen (est. 1979) introduced a proprietary intercooler, which uses thousands of copper fins to multiply the exposed heatsink surface’s rapid heat dissipation.

System upgrades: Intel plans OverDrive for Pentium systems. Infoworld, September 11, 1995, Vol. 17, Issue 37. The processor's heatsink is permanently attached, and the removable fan module is powered via spring-like metal prongs that connect to a trio of conductors on the surface of the chip.

For LGA 1156 the 4 holes for fastening the heatsink to the motherboard are placed in a square with a lateral length of 75 mm. This configuration was retained for the later, LGA 1155, LGA 1150, and LGA 1151 sockets meaning that cooling solutions should generally be interchangeable.

Pads of an Intel Core i9 10900K The 4 holes for fastening the heatsink to the motherboard are placed in a square with a lateral length of 75 mm for Intel's sockets LGA 1156, LGA 1155, LGA 1150, LGA 1151 and LGA 1200. Cooling solutions should therefore be interchangeable.

Square ILM is the standard type, while the narrow one is alternatively available for space-constrained applications.Intel Core i7 Processor Families for the LGA2011-0 Socket, Mechanical Drawings, page 108-114. Intel A matching heatsink is required for each ILM type.Intel Socket LGA2011 CPU and Heatsinks PCstats, July 27, 2013.

Intel Haswell Core i7-4771 CPU, sitting atop its original packaging that contains an OEM fan-cooled heatsink This generational list of Intel processors attempts to present all of Intel's processors from the pioneering 4-bit 4004 (1971) to the present high-end offerings. Concise technical data is given for each product.

Liquid helium, colder than liquid nitrogen, has also been used for cooling. Liquid helium boils at , and temperatures ranging from have been measured from the heatsink. However, liquid helium is more expensive and more difficult to store and use than liquid nitrogen. Also, extremely low temperatures can cause integrated circuits to stop functioning.

This means that a Sziklai output stage in a class AB amplifier requires only that the bias servo transistor or diodes be thermally matched to the lower power driver transistors; they need not (and should not) be placed on the main heatsink. This potentially simplifies the design and implementation of a stable class AB amplifier, reducing the need for emitter resistors, significantly reducing the number of components which must be in thermal contact with the heatsink and reducing the likelihood of thermal runaway. Optimal quiescent current in an amplifier using complementary feedback pairs also tends to be much lower than in Darlington-based output stages, on the order of 10mA vs. 100mA or more for some emitter follower output stages.

A rectifier diode (silicon controlled rectifier) and associated mounting hardware. The heavy threaded stud attaches the device to a heatsink to dissipate heat. A rectifier is an electrical device that converts alternating current (AC), which periodically reverses direction, to direct current (DC), which flows in only one direction. The reverse operation is performed by the inverter.

LGA 2011-v3 socket is used for Haswell-E and Haswell-EP CPUs, which were released in August and September 2014, respectively. Two types of ILM exist, with different shapes and heatsink mounting hole patterns, both with M4 x 0.7 threads: square ILM (80×80 mm mounting pattern), and narrow ILM (56×94 mm mounting pattern).

It is also very important that the shim is the proper thickness. If it is too thick then the heatsink will not make contact with the CPU, resulting in poor cooling and possibly overheating. Most shims are CNC manufactured, often using laser cutting. Cheaper ones may be pressed or stamped which could make them less accurate.

In most applications, the baseplate is attached to a heatsink to provide cooling, usually using thermal grease and screws. Some IMS substrates are available with a copper baseplate for better thermal performances. Compared to a classical printed circuit board, the IMS provides a better heat dissipation. It is one of the simplest way to provide efficient cooling to surface mount components.

Used to cool the heatsink of the northbridge of a motherboard's chipset; this may be needed where the system bus is significantly overclocked and dissipates more power than as usual, but may otherwise be unnecessary. As more features of the chipset are integrated into the central processing unit, the role of the chipset has been reduced and the heat generation reduced also.

Socket 604 is a 604-pin microprocessor socket designed to interface an Intel's Xeon processor to the rest of the computer. It provides both an electrical interface as well as physical support. This socket is designed to support a heatsink. Launched at November 18, 2002, over the year after Socket 603, it was originally used to accommodate most Xeons introduced at the time.

The work was hard, hot and did not require great intelligence. These menial workers tended to be ostracized by those not forced to work underground. Amaryl managed to discover and study mathematics with the help of a friendly librarian. He met Seldon when the latter visited the heatsink complex out of curiosity whilst fleeing from Eto Demerzel and living in Dahl.

Joel Hruska (December 1, 2001) Interview with Nevin House of Arctic Silver. Van's Hardware.com. A succession of silver formulations were its leading products in the mid-2000s, as is the current Arctic Silver 5. Other developments include ceramic (non-conductive) compounds as well as thermal interface epoxy adhesives for use where permanence is desirable, or where no other heatsink attachment method is available.

A passive heatsink on a motherboard As electronic devices become smaller, the problem of dispersing waste heat becomes more difficult. Tiny radiators known as heat sinks are used to convey heat from the electronic components into a cooling air stream. Heatsinks do not use water, rather they conduct the heat from the source. High-performance heat sinks have copper to conduct better.

The +D's casing was simple folded steel, which was not only stronger than before but acted as a heatsink, improving reliability. Apart from the missing ports, though, it was software-compatible with the larger device. The +D's DOS was named G+DOS, and was compatible with the DISCiPLE's DOS, GDOS. SAM DOS for MGT's SAM Coupé was backwards-compatible with GDOS and G+DOS.

As a result, the group reached 7.127 GHz, beating the previous score of 6.7 GHz. Note that these extreme overclocks involve specialized equipment and are nowhere near what the average consumer could expect using traditional air cooling even with expensive third party cooling fans. For instance, maximum overclocking on a Phenom II X4 955 processor using a heatsink and fan is approximately 4 GHz.

The Arctic Silver company was founded by Nevin House in 1999. Headquartered in Visalia, California, USA, House's original product was a custom modified version of HP's Turbocooler heatsink design from servers and workstations. That experience led to research in thermal compounds, and their material composition. House experimented with silver based solutions, and success with improved formulas led to a change in business focus, to thermal interface compounds.

The XPC consists of a custom small-footprint motherboard, a rectangular chassis typically consisting of aluminum, a "Shuttle ICE" heatpipe-augmented heatsink, and a compact power supply. Popular XPCs include the SS51G, the SN41G2, and the SN25P. Shuttle XPC barebones can be found worldwide from PC distributors, retailers, and e-commerce stores. In 2004, the Shuttle XPC was the official PC of the World Cyber Games.

'Super Reverb', 'Pro Reverb', 'Vibrolux Reverb' and 'Deluxe Reverb' amplifiers followed in 1967. The amplifiers were mainly designed by Robert "Bob" Rissi, Sawa Jacobson and Paul Spranger, who came up with the novel idea of making a heatsink to operate like a chimney to achieve increased and non-restricted airflow. Paul also designed the distinctive angled chassis and overall cosmetic styling. He was granted patents for both accounts.

The AM4 socket specifies the 4 holes for fastening the heatsink to the motherboard to be placed in the corners of a rectangle with a lateral length of 54×90 mm. Previous sockets have 48×96 mm. Some heat sinks for older sockets are not compatible. However, some cooler manufacturers are reported to be offering brackets allowing previously manufactured coolers to work with AM4, while other coolers will be redesigned.

Zalman's primary competitors include Antec, Thermaltake, Spire, Cooler Master and Arctic. Zalman has also developed a completely fanless case. It uses a fin based design to dissipate heat with heat generating components like the graphics card and motherboard transferring heat to the case body via a system of heat pipes and radiators. Zalman introduced the CNPS9500AM2, a heatsink was meant specifically for socket AM2 compatibility on May 23, 2006.

A constrained height region is intended to guarantee that boards will not interfere with other neighbors stacked above or below. However, it is not uncommon to find boards which violate these constraints. # Heatsinks - The standard spacing between stacked PC/104 boards is 0.600 inches (15.24 mm). Components with significant power consumption (CPUs, GPUs, FPGAs) often require a larger heatsink which does not fit within the traditional board spacing.

Multi-leaded power packages are heatsinkable, and thus can be used in projects where a large amount of power is being drawn. The top of the package has a metal tab with a hole used in mounting the component to a heatsink. Thermal compound is also used to provide greater heat transfer. The metal tab is often connected electrically to the internal circuitry, ground and supply connection are common.

A Radeon HD 7970 with the main heatsink removed, showing the major components of the card. The large, tilted silver object is the GPU die, which is surrounded by RAM chips, which are covered in extruded aluminum heatsinks. Power delivery circuitry is mounted next to the RAM, near the right side of the card. A modern video card consists of a printed circuit board on which the components are mounted.

The power connectors on the back of these systems incorporate a "keying" system that will prevent plugging a (newer) lower-rated power supply into an older system (which needs more power). The keying system does, however, allow older power supplies to be connected to newer systems, as this poses no problem. The initial motherboard version was known as "Xenon" and used a 203 watt power supply, and lacked an HDMI video port. Later models had an improved GPU heatsink. The "Zephyr" revision was a redesigned motherboard adding the HANA and HDMI, but used the same 90 nm CPU as the Xenon. It did howerver, move to an 80 nm GPU and eDRAM, with an improved GPU heatsink. The "Falcon" incorporated a newer 65 nm CPU, and required less power so it came packaged with a 175 watt power supply. "Jasper" (released late November 2008) used both a 65 nm CPU and GPU, as well as 16, 256 or 512 MB of on-board flash memory.

Dell acknowledged this problem and designed a new fan with a better heatsink and heatpipes to provide better cooling with less noise. Any repairs made at this point will include the redesigned parts. On September 20, Inspiron 5150 owners in the US brought a class action against Dell. The settlement included 100% cash reimbursement for certain repairs, and an extended limited warranty to cover those types of repairs that become necessary for one year.

Mass- produced CPU heat spreaders and heatsink bases are never perfectly flat or smooth; if these surfaces are placed in the best contact possible, there will be air gaps which reduce heat conduction. This can easily be mitigated by the use of thermal compound, but for the best possible results surfaces must be as flat as possible. This can be achieved by a laborious process known as lapping, which can reduce CPU temperature by typically .

The original ATX specification called for a power supply to be located near to the CPU with the power supply fan drawing in cooling air from outside the chassis and directing it onto the processor. It was thought that in this configuration, cooling of the processor would be achievable without the need of an active heatsink. This recommendation was removed from later specifications; modern ATX power supplies usually exhaust air from the case.

Sebastian was working as a manager for the now defunct Canadian online computer store NCIX. He was asked by the company to be the host for its technology channel, which was created to help demonstrate products. Sebastian was assisted by an unidentified cameraman and editor, and worked with limited resources, shooting videos with a camera borrowed from the son of the company's president. His first video was a demonstration for a Sunbeam processor heatsink.

A notable characteristic is a metal tab with a hole, used in mounting the case to a heatsink. The physical view of multi-leaded power packages are simply stretched TO-220 packages. Components made in multi-leaded power packages can handle more power than those constructed in TO-220 cases, or even TO3 cases with thermal resistance no less than 1.5 C/W. One well-known STMicroelectronics brand of this type of package is Multiwatt.

While the MegArray connector is physically similar to the Apple Power Mac G4 CPU daughtercard connector, it is not electrically compatible. There were G3 and G4 options with a maximum clock frequency of 800 MHz and 933 MHz. The G4 module originally used a Freescale 7451 processor which was later changed to a Freescale 7455, both without level 3 cache. The G4 CPU runs hotter and requires a better heatsink than that supplied on some machines.

At ISSCC 2008, IBM announced Cell at the 45 nm node. IBM said it would require 40 percent less power at the same clockspeed than its 65 nm predecessor and that the die area would shrink by 34 percent. The 45 nm Cell requires less cooling and allows for cheaper production, also through the use of a much smaller heatsink. Mass production was initially slotted to begin in late 2008 but was moved to early 2009.

The Pentium II microprocessor was largely based upon the microarchitecture of its predecessor, the Pentium Pro, but with some significant improvements. Unlike previous Pentium and Pentium Pro processors, the Pentium II CPU was packaged in a slot-based module rather than a CPU socket. The processor and associated components were carried on a daughterboard similar to a typical expansion board within a plastic cartridge. A fixed or removable heatsink was carried on one side, sometimes using its own fan.

As the CPU and GPU are integrated into the same die, they may also share the same heatsink and fan, which reduces the console's noise output, and its power consumption by roughly half in comparison to the original Xenon motherboard. The S has two additional rear USB ports, as well as a proprietary port used to connect the Kinect sensor. The motherboard has an integrated 2.4 GHz 802.11 b/g/n Wi-Fi adapter, and a TOSLINK S/PDIF optical audio connector.

Internally, the motherboard is a Shuttle MV25(N) Socket 370, VIA Apollo chipset with an Intel Celeron CPU, heatsink & fan. The motherboard can accept up to 2x 512MB of non-ECC PC133 SDRAM, although the system comes with 256MB as standard. The hard disk is a PC standard 20GB IDE unit. The audio & data PCI i/o board is a custom Hartmann design & on-ribbon includes; MIDI, USB & the first 5.1 surround sound hardware to be incorporated into a hardware synthesiser.

Typical TO-3 mounting profile, with insulator from chassis The metal package can be attached to a heat sink, making it suitable for devices dissipating several watts of heat. Thermal compound is used to improve heat transfer between the device case and the heat sink. Since the device case is one of the electrical connections, an insulator may be required to electrically isolate the component from the heatsink. Insulating washers may be made of mica or other materials with good thermal conductivity.

A power device is usually attached to a heatsink to remove the heat caused by operation losses. The power semiconductor die of a three-terminal device (IGBT, MOSFET or BJT). Two contacts are on top of the die, the remaining one is on the back. #Breakdown voltage: Often, there is a trade-off between breakdown voltage rating and on-resistance, because increasing the breakdown voltage by incorporating a thicker and lower doped drift region leads to a higher on-resistance.

The mirrors can be individually rotated ±10-12°, to an on or off state. In the on state, light from the projector bulb is reflected into the lens making the pixel appear bright on the screen. In the off state, the light is directed elsewhere (usually onto a heatsink), making the pixel appear dark. To produce greyscales, the mirror is toggled on and off very quickly, and the ratio of on time to off time determines the shade produced (binary pulse-width modulation).

Late Pentium IIs also marked the switch to flip-chip based packaging with direct heatsink contact to the die, as opposed to traditional bonding. While Klamath features 4 cache chips and simulates dual-porting through interleaving (2x 64-bit) for a slight performance improvement on concurrent accesses, Deschutes only sports 2 cache chips and offers slightly lower L2 cache performance at the same clockspeed. Furthermore, Deschutes always features ECC-enabled L2 cache. Pentium II Xeon 450 MHz with 512 KB cache.

To preserve space, some Zenbooks use two PCBs connected by a communications ribbon so it can have ports on both sides of the device, with a heatsink and fan centred between them. In 2018, Asus debuted ScreenPad with the ZenBook Pro 15 UX580. The ScreenPad replaces the regular trackpad with a colour capactive touchscreen display. This technology was then in 2019 included in the ZenBook 13 (UX334), ZenBook 14 (UX434) and ZenBook 15 (UX534) and offered optionally on the lower end lineup of VivoBook S laptops.

It is easy to design a cooling system for almost any equipment if there is unlimited space, power and budget. However, the majority of equipment will have a rigid specification that leaves a limited margin for error. There is a constant pressure to reduce power requirements, system weight and cost parts, without compromising performance or reliability. Thermal simulation allows experimentation with optimisation, such as modifying heatsink geometry or reducing fan speeds in a virtual environment, which is faster, cheaper and safer than physical experiment and measurement.

In some cases, such as pistons for internal combustion engines, three-dimensional modelling may be required. This has been performed, in a manner analogous to Teledeltos paper, by using volume tanks of a conductive electrolyte. This thermal modelling technique is useful in many branches of mechanical engineering such as heatsink or radiator design and die casting. The development of computational modelling and finite element analysis has reduced the use of Teledeltos, such that the technique is now obscure and the materials can be hard to obtain.

Around 1999, Matrox introduced a newer version of G200, called G200A. This board used a newer 250 nm manufacturing process instead of G200's original 350 nm. This allowed Matrox to build more graphics processors per wafer at the factory as well as to reduce heat output of the chip, and the G200As came without even a heatsink. Some G200A boards were named G250, which were clocked slightly higher than the normal G200, and sold only to OEMs, with Hewlett Packard perhaps being the only buyer.

The company has claimed several trademarks and patents for the name and technology applied to their products. Some of the air coolers and case fans produced by the company feature a patent design of the fan holder to achieve vibration absorption and elimination of the buzzing sound when the fan is running. The Freezer 7 Pro features 4 rubber connectors which serve as a vibration damper to absorb the vibration of the running fan and prevent the vibration from transferring to the heatsink and the case." Freezer 7 Pro" www.arctic.ac.

Conversely, the overclocker may decide to decrease the chip voltage while overclocking (a process known as undervolting), to reduce heat emissions while performance remains optimal. Stock cooling systems are designed for the amount of power produced during non-overclocked use; overclocked circuits can require more cooling, such as by powerful fans, larger heat sinks, heat pipes and water cooling. Mass, shape, and material all influence the ability of a heatsink to dissipate heat. Efficient heatsinks are often made entirely of copper, which has high thermal conductivity, but is expensive.

Interior of a water-cooled computer, showing CPU thumb Water cooling carries waste heat to a radiator. Thermoelectric cooling devices which actually refrigerate using the Peltier effect can help with high thermal design power (TDP) processors made by Intel and AMD in the early twenty-first century. Thermoelectric cooling devices create temperature differences between two plates by running an electric current through the plates. This method of cooling is highly effective, but itself generates significant heat elsewhere which must be carried away, often by a convection-based heatsink or a water cooling system.

The ends of the path have inlet/outlet connectors for the tubing that connects it to the rest of the watercooling system. Early designs included spiral, zig-zag pattern or heatsink like fins to allow the largest possible surface area for heat to transfer from the device being cooled to the water. These designs generally were used because the conjecture was that maximum flow was required for high performance. Trial and error and the evolution of water block design has shown that trading flow for turbulence can often improve performance.

Noctua's computer fan products are well-known for their characteristic brown and beige colour scheme, which has divided opinions among customers and enthusiasts. Noctua has in recent years come out with more common colour schemes under their chromax line that includes black editions of their popular CPU coolers and fans, as well as various coloured heatsink covers, cables, and anti-vibration accessories. Noctua announced all-black versions of their most popular CPU coolers in the chromax.black series for the first time at Computex Taipei in 2018, and formally introduced in October 2019.

Components are often designed to generate as little heat as possible, and computers and operating systems may be designed to reduce power consumption and consequent heating according to workload, but more heat may still be produced than can be removed without attention to cooling. Use of heatsinks cooled by airflow reduces the temperature rise produced by a given amount of heat. Attention to patterns of airflow can prevent the development of hotspots. Computer fans are widely used along with heatsink fans to reduce temperature by actively exhausting hot air.

Video cards often trend towards double-slot designs, due to the need for a large heatsink to effectively cool the graphics chipset. As a consequence, the expansion slot below the slot used by the graphics card is effectively blocked and cannot be used. This leaves an ATX quad-graphics system with effectively no expansion slots, as all of the additional slots are blocked by the video cards. The main purpose of Ultra ATX is to overcome this limitation and allow high-end systems to incorporate quad-graphics with additional room for expansion.

The 400SE was largely similar to late 390SEs, but featured marginally larger displacement - 3,948 versus 3,905 cc. The body was as for Series 2 390SEs, with the more rounded nose and a large rear underbody aerofoil. An asymmetrically vented bonnet hinted at what was underneath, and there was a large rear spoiler (smaller than the 'bathtray' style used on the SEAC, but still large). The appearance was considerably more mature than the wild SEAC, but both suffered from the large transmission tunnel which cramped the footwell and serious heatsink from the large engines.

To avoid damage to electronic parts, a heatsink is usually required for headlamps that use LEDs that dissipate more than 1W. To regulate power fed to the LEDs, DC-DC converters are often used, sometimes controlled by microprocessors. This allows the LED(s) to provide brightness that is not affected by a drop in battery voltage, and allows selectable levels of output. Following the introduction of LEDs for headlamps, sometimes combinations of LED and halogen lamps were used, allowing the user to select between the types for various tasks.

NVIDIA GeForce 8800 Ultra NVIDIA GeForce 8800 Ultra with the heatsink removed EVGA GeForce 8800 GTX Underside The 8800 series, codenamed G80, was launched on November 8, 2006 with the release of the GeForce 8800 GTX and GTS for the high-end market. A 320 MB GTS was released on February 12 and the Ultra was released on May 2, 2007. The cards are larger than their predecessors, with the 8800 GTX measuring 10.6 in (~26.9 cm) in length and the 8800 GTS measuring 9 in (~23 cm). Both cards have two dual-link DVI connectors and a HDTV/S-Video out connector.

Retrieved 4 September 2012 The Freezer 13 PRO CO employs the patented Cross-Blow technology by the use of an extra fan installed at the bottom of the heatsink to give a boost of cooling performance to the surrounding components, including Northbridge and voltage regulators."Freezer 13 PRO CO", www.arctic.ac. Retrieved 13 September 2012 The company utilizes its patented passive cooling technology (DE 20200600) in the Accelero S1 PLUS to enhance the level of natural convection from the GPU by letting more air to pass through the aluminum fins so that heat will be dissipated more efficiently."Accelero S1 PLUS", www.arctic.ac.

To detect this, helium is often in the inert atmosphere inside the packaging as a tracer gas to detect leaks during testing. Carbon dioxide and hydrogen may form from organic materials, moisture is outgassed by polymers and amine-cured epoxies outgas ammonia. Formation of cracks and intermetallic growth in die attachments may lead to formation of voids and delamination, impairing heat transfer from the chip die to the substrate and heatsink and causing a thermal failure. As some semiconductors like silicon and gallium arsenide are infrared-transparent, infrared microscopy can check the integrity of die bonding and under-die structures.

Stanley Hooker describes its use pre-war, although he also notes that compressibility effects could be modelled in this way, by sculpting the base of the tank to give additional depth and thus conductivity locally. One of the most important applications is for thermal modelling. Voltage is the analog of temperature and current flow that of heat flow. If the boundaries of a heatsink model are both painted with conductive paint to form two separate electrodes, each may be held at a voltage to represent the temperatures of some internal heat source (such as a microprocessor chip) and the external ambient temperature.

Maxwell 107 chip on GTX 750 Ti graphics card with heatsink removed. First generation Maxwell GPUs (GM107/GM108) were released as GeForce GTX 745, GTX 750/750 Ti, GTX 850M/860M (GM107) and GeForce 830M/840M (GM108). These new chips introduced few consumer-facing additional features, as Nvidia instead focused more on increasing GPU power efficiency. The L2 cache was increased from 256 KiB on Kepler to 2 MiB on Maxwell, reducing the need for more memory bandwidth. Accordingly, the memory bus was reduced from 192 bit on Kepler (GK106) to 128 bit, reducing die area and power draw.

Commercial and retail products are manufactured to less stringent requirements than those for military and aerospace applications. For example, microprocessors produced by Intel Corporation are manufactured to three grades: commercial, industrial and extended. Because some devices generate heat during operation, they may require thermal management to ensure they are within their specified operating temperature range; specifically, that they are operating at or below the maximum operating temperature of the device. Cooling a microprocessor mounted in a typical commercial or retail configuration requires "a heatsink properly mounted to the processor, and effective airflow through the system chassis".

Cooling can be improved by several techniques which may involve additional expense or effort. These techniques are often used, in particular, by those who run parts of their computer (such as the CPU and GPU) at higher voltages and frequencies than specified by manufacturer (overclocking), which increases heat generation. The installation of higher performance, non-stock cooling may also be considered modding. Many overclockers simply buy more efficient, and often, more expensive fan and heatsink combinations, while others resort to more exotic ways of computer cooling, such as liquid cooling, Peltier effect heatpumps, heat pipe or phase change cooling.

This was more stable, but adversely affected system performance. The problem was only fixed in the final few models, which supported a 100 MHz bus. Almost all of the 6x86 line produced a large amount of heat, and required quite large (for the time) heatsink/fan combinations to run properly. There was also a problem which made the 6x86 incompatible with the then-popular Sound Blaster AWE64 sound card. Only 32 of its potential 64-voice polyphony could be utilized, as the WaveSynth/WG software synthesizer relied on a Pentium- specific instruction which the 6x86 lacked.

Review machines also became hot in places on the underside of the chassis.HP 2133 Mini-Note PC – Linux Edition – TrustedReviewsHP 2133 Mini-Note Review In many revisions of the notebook, the fan vent had an additional dense plastic grill which impeded airflow greatly. The heat problem could mostly be eliminated by removing this inner grill, additional grills behind the air intake vents and replacing the thermal compound between the heatsink, the CPU and GPU with a higher quality type. As of September, 2010, the previous two years have seen a significant number of system board failures rendering the unit useless.

A PCI Express 3.0 ×16 graphics card, using two fans for cooling Used to cool the heatsink of the graphics processing unit or the memory on graphics cards. These fans were not necessary on older cards because of their low power dissipation, but most modern graphics cards designed for 3D graphics and gaming need their own dedicated cooling fans. Some of the higher powered cards can produce more heat than the CPU (dissipating up to 289 watts), so effective cooling is especially important. Since 2010, graphics cards have been released with either axial fans, or a centrifugal fan also known as a blower, turbo or squirrel cage fan.

Potentials within the heatsink represent internal temperatures and current flows represent heat flow. In many cases the internal heat source may be modelled with a constant current source, rather than a voltage, giving a better analogy of power loss as heat, rather than assuming a simple constant temperature. If the external airflow is restricted, the 'ambient' electrode may be subdivided and each section connected to a common voltage supply through a resistor or current limiter, representing the proportionate or maximum heatflow capacity of that airstream. As heatsinks are commonly manufactured from extruded aluminium sections, the two-dimensional paper is not usually a serious limitation.

The heat conductivity of metal is much better than that of air, and it radiates heat better than the component that it is protecting (usually an integrated circuit or CPU). Fan- cooled aluminium heatsinks were originally the norm for desktop computers, but nowadays many heatsinks feature copper base-plates or are entirely made of copper. Dust buildup between the metal fins of a heatsink gradually reduces efficiency, but can be countered with a gas duster by blowing away the dust along with any other unwanted excess material. Passive heatsinks are commonly found on older CPUs, parts that do not get very hot (such as the chipset), and low-power computers.

Prior to about 1975, all computers were typically large industrial/commercial machines, often in a centralized location with a dedicated room-sized cooling system. For these systems noise was not an important issue. The first home computers, such as the Commodore 64, were very low power, and therefore could run fanless or, like the IBM PC, with a low- speed fan only used to cool the power supply, so noise was seldom an issue. By the mid 1990s as CPU clock speeds increased above 60 MHz, "spot-cooling" was added by means of a fan over the CPU heatsink to blow air onto the processor.

This external heatsink led to the system's nickname, "The Toast Rack". New features included 128 KB RAM with RAM disc commands 'save !"name"', three-channel audio via the AY-3-8912 chip, MIDI compatibility, an RS-232 serial port, an RGB monitor port, 32 KB of ROM including an improved BASIC editor, and an external keypad. The machine was simultaneously presented for the first time and launched in September 1985 at the SIMO '85 trade show in Spain, with a price of 44,250 pesetas. Because of the large number of unsold Spectrum+ models, Sinclair decided not to start selling in the UK until January 1986 at a price of £179.95.

During the 1960s, the lever arm was replaced by the telescopic shock absorber. This was encouraged by better roads and motorways, increasing average speeds and driver expectations of handling. The telescopic shock absorber dissipated heat more effectively, owing to its larger working volume of fluid and also the better ratio of surface area to fluid volume. About the only area where lever arm shock absorbers still are actively used is tank suspensions, where their compact size and unique geometry allow them to be easily integrated with the suspension's torsion bars, and the massive tank chassis acting as a one huge heatsink alleviates the heat dissipation problems.

As their on- state resistance rises with temperature, if the load is approximately a constant-current load then the power loss rises correspondingly, generating further heat. When the heatsink is not able to keep the temperature low enough, the junction temperature may rise quickly and uncontrollably, resulting in destruction of the device. ; Process variations: With MOSFETs becoming smaller, the number of atoms in the silicon that produce many of the transistor's properties is becoming fewer, with the result that control of dopant numbers and placement is more erratic. During chip manufacturing, random process variations affect all transistor dimensions: length, width, junction depths, oxide thickness etc.

A heat sink (aluminium) with heat pipes (copper) Typical heat pipe configuration within a consumer laptop. The heat pipes conduct waste heat away from the CPU, GPU and voltage regulators, transferring it to a heatsink coupled with a cooling fan that acts as a fluid- to-fluid heat exchanger. Heat pipes began to be used in computer systems in the late 1990s,, 1998, Hong Xie, Intel Corp, IEEE when increased power requirements and subsequent increases in heat emission resulted in greater demands on cooling systems. They are now extensively used in many modern computer systems, typically to move heat away from components such as CPUs and GPUs to heat sinks where thermal energy may be dissipated into the environment.

Intel Xeon E3-1241 v3 CPU, sitting atop the inside part of its retail box that contains an OEM fan-cooled heatsink Intel Xeon E3-1220 v3 CPU, pin side Introduced in May 2013, Xeon E3-12xx v3 is the first Xeon series based on the Haswell microarchitecture. It uses the new LGA 1150 socket, which was introduced with the desktop Core i5/i7 Haswell processors, incompatible with the LGA 1155 that was used in Xeon E3 and E3 v2. As before, the main difference between the desktop and server versions is added support for ECC memory in the Xeon-branded parts. The main benefit of the new microarchitecture is better power efficiency.

The transient climate response (TCR) is defined as "is the change in the global mean surface temperature, averaged over a 20-year period, centered at the time of atmospheric carbon dioxide doubling, in a climate model simulation" in which the atmospheric concentration is increasing at 1% per year. This estimate is generated using shorter-term simulations. The transient response is lower than the equilibrium climate sensitivity, because slower feedbacks, which exacerbate the temperature increase, take more time to respond in full to an increase in the atmospheric concentration. For instance, the deep ocean takes many centuries to reach a new steady state after a perturbation; during this time, it continues to serve as heatsink, cooling the upper ocean.

The maximum collector-to-emitter voltage for the 2N3055, like other transistors, depends on the resistance path the external circuit provides between the base and emitter of the transistor; with 100 ohms a 70 volt breakdown rating, VCER, and the Collector-Emitter Sustaining voltage, VCEO(sus), is given by ON Semiconductor. Sometimes the 100 VCBO breakdown voltage (the maximum voltage between collector and base, with the emitter open, an unrealistic arrangement in practical circuits) is given as the only voltage rating, which can cause confusion. Manufacturers rarely specify the VCES voltage rating for the 2N3055. The total power dissipation (written PD in most American datasheets, Ptot in European ones) depends on the heatsink to which the 2N3055 is connected.

The back of the Pro Display XDR, connected to power and the Mac Pro via Thunderbolt 3 (USB-C). The Pro Display XDR contains a 6016 × 3384 6K color-calibrated panel, and its rear cover contains a similar lattice pattern to the third-generation Mac Pro. To improve its contrast ratio and HDR capabilities, it uses blue- colored LEDs for its backlight instead of white, at a higher refresh rate than the display itself, and contains a system of "custom lenses and reflectors". The aforementioned lattice serves as a heatsink: Apple stated that this design gave the display sufficient thermal management to operate "indefinitely" at 1000 nits of brightness across the entire screen, and up to 1600 nits in an environment cooler than .

If fans are fitted to force air into the case more effectively than it is removed, the pressure inside becomes higher than outside, referred to as a "positive" airflow (the opposite case is called "negative" airflow). Worth noting is that positive internal pressure only prevents dust accumulating in the case if the air intakes are equipped with dust filters. A case with negative internal pressure will suffer a higher rate of dust accumulation even if the intakes are filtered, as the negative pressure will draw dust in through any available opening in the case The air flow inside the typical desktop case is usually not strong enough for a passive CPU heatsink. Most desktop heatsinks are active including one or even multiple directly attached fans or blowers.

A laptop computer's CPU and GPU heatsinks, and copper heat pipes transferring heat to an exhaust fan expelling hot air The heat is expelled from a laptop by an exhaust centrifugal fan. Laptops present a difficult mechanical airflow design, power dissipation, and cooling challenge. Constraints specific to laptops include: the device as a whole has to be as light as possible; the form factor has to be built around the standard keyboard layout; users are very close, so noise must be kept to a minimum, and the case exterior temperature must be kept low enough to be used on a lap. Cooling generally uses forced air cooling but heat pipes and the use of the metal chassis or case as a passive heatsink are also common.

The underside of a FC-PGA package (the die is on the other side) A flip-chip pin grid array (FC- PGA or FCPGA) is a form of pin grid array in which the die faces downwards on the top of the substrate with the back of the die exposed. This allows the die to have a more direct contact with the heatsink or other cooling mechanism. The FC-PGA was introduced by Intel with the Coppermine core Pentium III and Celeron processors based on Socket 370, and was later used for Socket 478-based Pentium 4 and Celeron processors. FC-PGA processors fit into zero insertion force (ZIF) Socket 370 and Socket 478-based motherboard sockets; similar packages have also been used by AMD.

Pentium OverDrive for 486 systems Die shot of Pentium OverDrive for 486 systems The Pentium OverDrive is a heavily modified, 3.3 volt Pentium P54 core manufactured on 0.6 micrometer technology. It is fitted with a 486-compatible bus unit (though with an increased pin-count), an integrated heatsink and fan, and 32 kB of level 1 cache, double the 16 kB offered on regular P54C chips.INTEL ANNOUNCES FIRST PENTIUM(TM) OVERDRIVE(TM) PROCESSOR, Press Release, Google Groups, February, 1995. As the data bus was effectively reduced to 32-bit width, per-clock performance was much lower than that of a 'regular' Pentium, though still substantially faster compared to a similarly-clocked 486 owing to the Pentium's architectural improvements, such as the much improved FPU.

Since these problems surfaced, Microsoft has attempted to modify the console to improve its reliability. Modifications include a reduction in the number, size, and placement of components, the addition of dabs of epoxy on the corners and edges of the CPU and GPU as glue to prevent movement relative to the board during heat expansion, and a second GPU heatsink to dissipate more heat. With the release of the redesigned Xbox 360 S, the warranty for the newer models does not include the three-year extended coverage for "General Hardware Failures". The newer Xbox 360 S and E models indicate system overheating when the console's power button begins to flash red, unlike previous models where the first and third quadrant of the ring would light up red around the power button if overheating occurred.

The fin-stack acts as a fluid- to-fluid heat exchanger transferring thermal energy from the working fluid within the heatpipe(s) to ambient air at dead-state condition. A heat sink (also commonly spelled heatsink) is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical device to a fluid medium, often air or a liquid coolant, where it is dissipated away from the device, thereby allowing regulation of the device's temperature. In computers, heat sinks are used to cool CPUs, GPUs, and some chipsets and RAM modules. Heat sinks are used with high-power semiconductor devices such as power transistors and optoelectronics such as lasers and light emitting diodes (LEDs), where the heat dissipation ability of the component itself is insufficient to moderate its temperature.

Xbox 360 Pro console with white wireless controller. The Xbox 360 (sometimes referred to as Pro or Premium and packaged as simply Xbox 360 with the subheading "Go Pro") included all the features of the Xbox 360 Core and included a hybrid composite/component cable with optional optical out instead of the composite AV cable included with the Core. This model also included a detachable hard disk drive (initially 20 GB, while later models had 60 GB) to store downloaded content, provide compatibility with original Xbox games, and store game data. The included hard drive came with game demos, video clips and a free Live Arcade game, Hexic HD. In July 2007, this version of the Xbox 360 began appearing with the Zephyr motherboard (the motherboard used in the Elite) which features HDMI 1.2 output and an improved GPU heatsink.

ATI Radeon HD 2400 XT The Radeon HD 2400 series was based on the codenamed RV610 GPU. It had 180 million transistors on a 65 nm fabrication process. The Radeon HD 2400 series used a 64-bit-wide memory bus. The die size is 85 mm2.Beyond3D RV610 chip reference, retrieved September 25, 2007 The official PCB design implements only a passive-cooling heatsink instead of a fan, and official claims of power consumption are as little as 35 W. The core has 16 kiB unified vertex/texture cache away from dedicated vertex cache and L1/L2 texture cache used in higher end model. Reports has that the first batch of the RV610 core (silicon revision A12), only being released to system builders, has a bug that hindered the UVD from working properly, but other parts of the die operated normally.

Disadvantages of liquid cooling include complexity and the potential for a coolant leak. Leaked water (or more importantly any additives in the water) can damage any electronic components with which it comes into contact, and the need to test for and repair leaks makes for more complex and less reliable installations. (Notably, the first major foray into the field of liquid-cooled personal computers for general use, the high-end versions of Apple's Power Mac G5, was ultimately doomed by a propensity for coolant leaks.) An air-cooled heatsink is generally much simpler to build, install, and maintain than a water cooling solution, although CPU-specific water cooling kits can also be found, which may be just as easy to install as an air cooler. These are not limited to CPUs, however, and liquid cooling of GPU cards is also possible.

A Pentium III Katmai SECC2 cartridge with heatsink removed. The first Pentium III variant was the Katmai (Intel product code 80525). It was a further development of the Deschutes Pentium II. The Pentium III saw an increase of 2 million transistors over the Pentium II. The differences were the addition of execution units and SSE instruction support, and an improved L1 cache controller (the L2 cache controller was left unchanged, as it would be completely redesigned for Coppermine anyway), which were responsible for the minor performance improvements over the "Deschutes" Pentium IIs. It was first released at speeds of 450 and 500 MHz in February 1999. Two more versions were released: 550 MHz on May 17, 1999 and 600 MHz on August 2, 1999. On September 27, 1999 Intel released the 533B and 600B running at 533 & 600 MHz respectively.

These laser diodes are mass-produced for the reading and writing of data in Blu-ray drives (although the light emitted by the diodes is not blue, but distinctly violet). In mid-to-late 2011, 405 nm blue-violet laser diode modules with an optical power of 250 mW, based on GaN violet laser diodes made for Blu-ray disc readers, had reached the market from Chinese sources for prices of about US$60 including delivery.In September 2011, GaN diode laser modules capable of operating at 250mW (or 300mW pulse) with a heatsink were offered on eBay in the Industrial Lasers category at around US$60. At the same time, a few higher-powered (120 mW) 404–405 nm "violet" laser pointers have become available that are not based on GaN, but use DPSS frequency-doubler technology from 1-watt 808 nm GaAlAs infrared diode lasers.

Intel Xeon E5-1650 v3 CPU; its retail box contains no OEM heatsink Introduced in September 2014, Xeon E5-16xx v3 and Xeon E5-26xx v3 series use the new LGA 2011-v3 socket, which is incompatible with the LGA 2011 socket used by earlier Xeon E5 and E5 v2 generations based on Sandy Bridge and Ivy Bridge microarchitectures. Some of the main benefits of this generation, compared to the previous one, are improved power efficiency, higher core counts, and bigger last level caches (LLCs). Following the already used nomenclature, Xeon E5-26xx v3 series allows dual-socket operation. One of the new features of this generation is that Xeon E5 v3 models with more than 10 cores support cluster on die (COD) operation mode, allowing CPU's multiple columns of cores and LLC slices to be logically divided into what is presented as two non-uniform memory access (NUMA) CPUs to the operating system.

Leads are used for many purposes, including: transfer of power; testing of an electrical circuit to see if it is working, using a test light or a multimeter; transmitting information, as when the leads from an electrocardiograph are attached to a person's body to transmit information about their heart rhythm; and sometimes to act as a heatsink. The tiny leads coming off through-hole electronic components are also often called "pins"; in ball grid array packages, they are in form of small spheres, and are therefore called "balls". Many electrical components such as capacitors, resistors, and inductors have only two leads, while some integrated circuits can have several hundred or even more than a thousand for the largest ball grid array packages. Integrated circuit pins often either bend under the package body like a letter "J" (J-lead) or come out, down, and form a flat foot for securing to the board (S-lead or gull-lead).

Inspiron XPS – The first XPS laptop, which was a rebranded Inspiron 9100, was a very heavy desktop-replacement laptop starting at 9.06 pounds without power supply (which added an additional 2.5 pounds). This was because it was offered with either a 3.4 GHz desktop Pentium 4 HT "Prescott" processor, or the 3.4 GHz "Gallatin" Pentium 4 Extreme Edition processor at the same clock speed, which gave off tremendous amounts of heat due to their high clock speeds and inefficient microarchitecture, despite a very large copper-based heatsink that spanned the width of the unit with three fans. Other features included a 1920×1200 15.4-inch LCD, and subwoofer integrated into the bottom of the battery casing, with the 12-cell battery (the 16-cell battery does not include a subwoofer.) Earlier models came with an ATI Mobility Radeon 9700 with 128 MB of memory, and later models with the Mobility Radeon 9800 with 256 MB of memory. The Mobility Radeon 9800 was based on the R420 core, the same as early ATI Radeon X700 and X800 desktop graphics cards, but with half the pixel pipelines disconnected.